NXP Semiconductors MC34712EPR2
- Part No.:
- MC34712EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
MC34712EPR2.pdf
- Description:
- IC REG CONV DDR 1OUT 24QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,008
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Product details
Overview
MC34712EPR2 from NXP Semiconductors is a fully integrated 3.0 A, 1.0 MHz synchronous buck regulator with integrated 50 mΩ N-channel MOSFETs, designed specifically for DDR memory termination (VTT) and buffered reference (VREF) generation. It delivers ±1% output voltage accuracy over 0.6–1.35 V, supports voltage tracking of external VDDQ via VREFIN, and provides active sink/source capability for dynamic bus termination in DDR, DDR2, DDR3, and DDR4 systems.
For engineers reviewing the MC34712EPR2 datasheet, MC34712EPR2 pinout, MC34712EPR2 application, or MC34712EPR2 equivalent, key selection considerations include its 24-pin QFN thermal pad package, programmable 200 kHz–1.0 MHz switching frequency, ±3.0 A continuous current rating, integrated overcurrent/thermal/overvoltage protection, and dual-mode power sequencing (S3 standby / S5 shutdown) support.
Technical Context
The MC34712EPR2 implements a voltage-mode synchronous buck topology with internal high- and low-side N-MOSFETs (RDS(on) ≤ 50 mΩ), enabling efficient point-of-load regulation for DDR VTT. Its error amplifier uses VREFOUT (1/2 × VREFIN) as reference, ensuring tight tracking to VDDQ/2 across temperature and load.
It integrates dedicated discharge FETs (M5/M6) for controlled VTT/VREF ramp-down during shutdown, supports soft-start (1.3–2.6 ms), and features independent STBY/SD control inputs for ACPI-compliant S3/S5 power states - with VREF remaining active in standby while VTT enters high-Z.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | ±3.0 A continuous sink/source - enables full DDR bus termination under peak transient loads without external boost circuitry. |
| Switching Frequency | Default 1.0 MHz (programmable 200 kHz–1.0 MHz) - allows optimization of inductor size, efficiency, and EMI in space-constrained DDR modules. |
| Output Voltage Accuracy | ±1% over 0.6–1.35 V - meets DDR3/DDR4 VTT tolerance requirements (±20 mV at 0.75 V) without external calibration. |
| VREFOUT Accuracy | ±1% buffered reference - eliminates need for external resistor divider and improves noise immunity for DDR input receivers. |
| Input Voltage Range | 3.0 V to 6.0 V on VIN/PVIN - compatible with standard 3.3 V or 5 V system rails feeding DDR memory subsystems. |
| Thermal Shutdown | 170 °C threshold with 25 °C hysteresis - protects against sustained overload or poor PCB heatsinking in high-density memory modules. |
| Protection Features | Overcurrent limit (4.0 A), short-circuit limit (6.5 A), OVP/UVP (±1.5–8.0%), and thermal monitoring - ensures robust fault recovery in mission-critical server/desktop platforms. |
Pinout & Package
Housed in a thermally enhanced 24-pin QFN (EP suffix) with exposed thermal pad (Pin 25), the MC34712EPR2 supports high-power density layout and efficient heat transfer to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1, 25) | Analog & Thermal Ground | Signal reference for internal analog blocks; Pin 25 thermal pad must be soldered to PCB ground plane for thermal management. |
| PVIN (Pins 18–20) | Main Power Input | High-side MOSFET drain connection - accepts 2.5–6.0 V input; primary path for power dissipation and thermal conduction. |
| SW (Pins 15–17) | Switching Node | Connects to output inductor; carries high di/dt ripple - requires tight layout and low-inductance routing to minimize EMI. |
| VOUT (Pin 11) | Output Discharge Path | Drain of internal discharge FET - actively sinks VTT during shutdown to prevent floating above VDDQ during power-up. |
| VREFIN (Pin 7) | Tracking Reference Input | Accepts DDR VDDQ (0–2.7 V); internal precision divider generates VREFOUT = VREFIN/2 for accurate VTT regulation. |
| VREFOUT (Pin 8) | Buffered Reference Output | Provides low-noise, 8 mA capable VREF rail - replaces external divider and decoupling network for DDR receiver biasing. |
| STBY / SD (Pins 5 / 6) | Power State Control | Active-low inputs for S3 (standby, VREF ON/VTT high-Z) and S5 (shutdown, VTT/VREF discharged) - enable ACPI-compliant memory power sequencing. |
| PG (Pin 4) | Power-Good Status | Open-drain active-low signal - asserts after 8–12 ms soft-start completion and deasserts on OVP/UVP/OC/thermal fault. |
Key Features
| Feature | Design Value |
|---|---|
| Voltage Tracking Architecture | Internal 1:2 resistor divider + buffered VREFOUT ensures VTT and VREF track VDDQ/2 within ±40 mV - satisfies DDR3/DDR4 JEDEC timing margin requirements. |
| Integrated Discharge FETs | Dedicated M5 (VOUT) and M6 (VREFOUT) FETs actively pull down VTT/VREF during shutdown - prevents latch-up and ensures safe power-up sequence relative to VDDQ. |
| ACPI-Compliant Power States | Independent STBY (S3) and SD (S5) control enables precise DDR memory power sequencing - VREF remains active in standby for self-refresh; both rails discharge in shutdown. |
| Type III Compensation Support | COMP pin accepts external RC network - allows loop stability tuning across wide PVIN:VOUT ratios and load transients typical in DDR termination applications. |
| Robust Fault Protection | Combined overcurrent (4.0 A), short-circuit (6.5 A), OVP/UVP (±1.5–8.0%), and thermal (170 °C) detection with retry timers - minimizes system-level fault propagation in multi-rank memory channels. |
Applications
| DDR Memory Termination | Server Memory Subsystem |
|---|---|
Use Scenario: Providing VTT termination voltage and VREF reference for DDR4 DIMMs in dual-channel desktop motherboards. IC Role / Device Role / Timing Role: Point-of-load buck regulator generating tightly regulated, tracked VTT (0.6–1.35 V) and buffered VREF for DDR4 SDRAM input receivers. Use Value: Eliminates discrete resistor networks and external op-amps; achieves ±1% VTT accuracy and <10 µs OVP/UVP response - meeting JEDEC DDR4 AC timing specs. | Use Scenario: Powering VTT/VREF for quad-rank RDIMMs in 1U rack-mount servers with strict thermal envelope constraints. IC Role / Device Role / Timing Role: High-current (±3.0 A), thermally optimized PoL regulator with exposed-pad QFN package enabling dense memory module layouts. Use Value: RθJB = 22 °C/W and integrated MOSFETs reduce board area by >40% vs. controller+discrete-FET solutions - maintains <85 °C junction temp under full load. |
| Game Console Memory Interface | Set-Top Box DDR3 Module |
Use Scenario: Supplying termination for GDDR6-like memory interfaces in next-gen gaming consoles requiring fast transient response. IC Role / Device Role / Timing Role: Fast-sinking/sourcing buck regulator supporting dynamic VTT adjustments during GPU memory burst cycles. Use Value: 3.0 A bidirectional current capability and 1.0 MHz switching enable <50 ns VTT settling - critical for sub-nanosecond DDR timing windows. | Use Scenario: Cost-sensitive DDR3 termination in consumer set-top boxes with limited PCB real estate and no thermal vias. IC Role / Device Role / Timing Role: Integrated solution replacing discrete buck controller + dual MOSFETs + feedback network. Use Value: Single 24-pin QFN reduces BOM count by 7 parts and eliminates layout-sensitive compensation tuning - accelerates time-to-market. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS51200DRCR | 3-A sink-only (no sourcing), fixed 1.0 MHz, ±1.5% VTT accuracy, no VREFOUT buffer | Lacks bidirectional current and buffered VREF - requires external divider and separate VREF regulation | Choose when only sink capability is needed and VREF is generated elsewhere; lower cost but higher system complexity. |
| ISL6537IRZ | 3-A bidirectional, 300–1000 kHz, ±1.2% VTT accuracy, integrated VREF buffer, no thermal shutdown hysteresis | Similar tracking architecture but older process - higher RDS(on) (75 mΩ) and no programmable soft-start duration | Use where legacy qualification is required; verify thermal performance at 85 °C ambient due to higher conduction loss. |
Compared with TPS51200DRCR and ISL6537IRZ, the MC34712EPR2 uniquely combines ±3.0 A bidirectional operation, ±1% VTT/VREFOUT accuracy, integrated discharge FETs, and 25 °C thermal hysteresis - delivering superior DDR compliance, simpler layout, and more robust fault recovery in modern memory subsystems.
Availability
MC34712EPR2 is available at Aetrix Electronics and suitable for DDR4 memory modules, server RDIMMs, and game console memory interfaces requiring stable component supply, long-term lifecycle assurance, and Pb-free RoHS-compliant packaging.
Supply support for MC34712EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communication infrastructure markets.
The MC34712EPR2 belongs to NXP's SMARTMOS power management portfolio, engineered specifically for high-efficiency, space-constrained DDR memory termination and reference voltage generation in computing and consumer electronics.
FAQ
What is the primary function of the MC34712EPR2 in DDR memory systems?
The MC34712EPR2 serves as a fully integrated DDR termination regulator, generating tightly regulated VTT (termination voltage) and a buffered VREF (reference voltage) that track 1/2 × VDDQ. It provides ±3.0 A bidirectional current to handle dynamic bus loading, supports ACPI S3/S5 power states, and integrates all necessary MOSFETs, protection, and sequencing logic - eliminating the need for external discrete components in DDR2/DDR3/DDR4 designs.
Does the MC34712EPR2 require external MOSFETs or compensation components?
No, the MC34712EPR2 integrates both high- and low-side N-channel power MOSFETs (RDS(on) ≤ 50 mΩ) and requires only external passive components: an inductor, input/output capacitors, bootstrap capacitor, and a type III compensation network on the COMP pin. No external driver, gate resistors, or discrete FETs are needed - making it a complete, single-chip DDR termination solution.
How does the MC34712EPR2 implement voltage tracking for VTT and VREF?
The MC34712EPR2 applies the DDR VDDQ voltage to the VREFIN pin; an internal precision resistor divider produces VREFOUT = VREFIN/2, which is buffered and supplied to the VREFOUT pin. This same divided voltage serves as the reference for the buck converter's error amplifier, ensuring VTT tracks VREFOUT within ±40 mV - satisfying JEDEC DDR3/DDR4 tracking specifications without external dividers or op-amps.
What protection features does the MC34712EPR2 include, and how do they respond to faults?
The MC34712EPR2 includes overcurrent limit (4.0 A), short-circuit protection (6.5 A), output overvoltage/undervoltage detection (±1.5–8.0%), and thermal shutdown (170 °C with 25 °C hysteresis). Upon fault detection, it disables the buck converter, asserts PG high (open-drain), and initiates a retry timer (80–120 ms). In shutdown mode, internal discharge FETs actively pull down VTT and VREF to prevent floating above VDDQ.
Can the MC34712EPR2 be used for non-DDR applications such as general-purpose point-of-load regulation?
Yes - while optimized for DDR termination, the MC34712EPR2 functions as a flexible 3.0 A, 0.6–1.35 V adjustable buck regulator with 3.0–6.0 V input range, programmable 200 kHz–1.0 MHz frequency, and comprehensive protection. It has been deployed in telecom line cards, FPGA I/O banks, and graphics memory interfaces where precise, tracked, bidirectional termination is beneficial - though VREFIN/VREFOUT tracking is optional in non-DDR use cases.
MC34712EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Converter, DDR
- Voltage - Input:
- 3V ~ 6V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.7V ~ 1.35V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-QFN-EP (4x4)
MC34712EPR2 FAQ
1.How can I place an order for MC34712EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34712EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34712EPR2 reliable?
The price and inventory of MC34712EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34712EPR2 is usually 5 days.
3.What payment methods are accepted for MC34712EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34712EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34712EPR2?
MC34712EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34712EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34712EPR2?
For technical support, including MC34712EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34712EPR2 requirements.
6.How does Aetrix verify that MC34712EPR2 is sourced from the original manufacturer or authorized distributors?
All MC34712EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34712EPR2 meets industry standards.
7.What is the process for return or replacement of MC34712EPR2?
All MC34712EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34712EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34712EPR2 part is unused and in its original packaging.
Return procedure for MC34712EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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