NXP Semiconductors MC40XS6500DEKR2
- Part No.:
- MC40XS6500DEKR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC40XS6500DEKR2.pdf
- Description:
- LIGHTING ESWITCH PENTA 40MOHM
- Quantity:
- Payment:

- Shipping:

Inventory:4,706
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Product details
Overview
MC40XS6500DEKR2 from NXP Semiconductors is a penta-channel 40 mΩ automotive high-side switch IC for LED and incandescent lamp control in centralized lighting ECUs. It delivers 5 protected high-side outputs, 5.0 MHz daisy-chainable SPI interface, programmable current sensing (1:100–1:1000), dynamic overcurrent threshold profiling, and -16 V reverse polarity protection. Used in exterior lighting modules requiring fail-safe diagnostics and limp-home operation.
For engineers reviewing the MC40XS6500DEKR2 datasheet, MC40XS6500DEKR2 pinout, MC40XS6500DEKR2 application, or MC40XS6500DEKR2 equivalent, key selection criteria include RDS(on) per channel (40 mΩ), operating voltage range (7.0–18 V full spec), sleep current (< 5.0 µA), SOIC-32EP package compatibility, and SPI-configurable PWM duty cycle and open-load detection.
Technical Context
The MC40XS6500DEKR2 integrates five self-protected high-side power switches with active clamp circuitry for inductive load switching, thermal shutdown with prewarning, and programmable output edge shaping to reduce EMI. Its dual-supply architecture uses VBAT (7–18 V) for power stages and VCC (4.5–5.5 V) for SPI logic and register access.
It implements a 16-bit SPI 5.0 MHz interface supporting daisy-chaining, configurable fault reporting (openload, short-to-battery, severe short-to-ground, overtemperature), and synchronized analog feedback via CSNS/SYNCB pins. Fail mode activation occurs on LIMP assertion or SPI communication loss, enabling direct IN1–IN4 control of OUT1–OUT4 while disabling OUT5/OUT6.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RDS(on) per channel | 40 mΩ max at TJ = 125 °C - enables low conduction loss for 3.9 A continuous output current per channel |
| Operating supply (VBAT) | 7.0 V to 18 V full-spec range - supports standard 12 V automotive battery with jump-start tolerance up to 28 V |
| Sleep current | < 5.0 µA at VPWR = 12 V - ensures ultra-low quiescent draw during ECU standby |
| SPI interface | 16-bit, 5.0 MHz, daisy-chainable - allows scalable control of multiple devices with single MCU SPI port |
| Current sensing ratio | Programmable 1:100 to 1:1000 - provides precise LED current monitoring with external ADC synchronization |
| Reverse polarity protection | -16 V - prevents damage during battery misconnection without external diode |
| Thermal shutdown | 150 °C junction limit with prewarning at 125 °C - enables predictive thermal management in enclosed lamp housings |
Pinout & Package
MC40XS6500DEKR2 is housed in a 32-pin SOIC with exposed pad (SOICEP), optimized for thermal dissipation in automotive lighting modules. The exposed VBAT pad serves as primary power input and thermal path to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBAT (Pin 33) | Battery power supply | Main power source for internal regulator, charge pump, and all five high-side drivers; exposed pad requires soldered thermal connection |
| VCC (Pin 6) | Logic supply | 5.0 V supply for SPI I/Os, logic, and OUT6 driver; must be present for bidirectional SPI communication |
| OUT1–OUT5 (Pins 22–23, 21, 19–20, 12–14, 17–18) | Protected high-side outputs | Five independent 40 mΩ channels with integrated overcurrent, overtemperature, and open-load diagnostics |
| CSNS / SYNCB (Pins 25 / 26) | Analog feedback & sync | CSNS outputs scaled current/voltage/temperature; SYNCB provides open-drain timing pulse for MCU ADC sampling alignment |
| IN1–IN4 (Pins 27–30) | Direct control inputs | Wake-up and fail-mode channel enable inputs; internally pulled down; used for limp-home operation when SPI fails |
| LIMP (Pin 31) | Fail-mode trigger | Active-high digital input forcing immediate transition to fail mode with direct INx control of OUT1–OUT4 |
| SCLK / SI / SO / CSB / RSTB (Pins 4–5, 7, 3, 2) | SPI interface | Standard 4-wire SPI plus reset; supports daisy-chaining via SO-to-SI routing between devices |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic overcurrent threshold profile | Adapts trip point during inrush to avoid false shutdown while maintaining accurate load current tracking |
| Programmable output edge shaping | Reduces dv/dt-induced EMI emissions during turn-on/turn-off, easing EMC compliance in headlamp modules |
| Limp-home mode with direct input control | Enables continued partial lighting function (OUT1–OUT4) using IN1–IN4 after SPI failure or LIMP assertion |
| External smart power switch control (OUT6) | Logic-level output drives external high-current switch (e.g., for fog lamps or auxiliary loads) under SPI or fail-mode control |
| Extended analog feedback multiplexing | Single CSNS pin reports battery voltage, die temperature, or any selected channel's current - reduces BOM count and routing complexity |
Applications
| Automotive Exterior Lighting | LED Headlamp Control |
|---|---|
|
Use Scenario: Centralized body controller managing tail lamps, brake lights, and turn signals in modern vehicles. IC Role / Device Role: High-side power switch providing channel-isolated drive, real-time current monitoring, and open-circuit diagnostics for each lamp filament or LED string. Use Value: Eliminates need for discrete fuses and relays; enables predictive maintenance via SPI-reported fault logs and thermal trends. |
Use Scenario: Adaptive driving beam (ADB) headlamp module requiring precise PWM dimming and thermal derating of multiple LED zones. IC Role / Device Role: Five-channel high-side driver with synchronized current sensing and programmable PWM prescaler per channel. Use Value: Enables per-zone brightness control and thermal foldback without external current-sense amplifiers or PWM generators. |
| Incandescent Lamp Replacement | ECU-Level Diagnostics Hub |
|
Use Scenario: Retrofit ECU converting legacy 21 W incandescent bulbs to LED equivalents while retaining OEM wiring harness. IC Role / Device Role: Penta-switch with enhanced inrush handling and dynamic overcurrent profiling tailored for tungsten filament cold-resistance surge. Use Value: Prevents nuisance tripping during bulb warm-up while delivering same form-factor and connector compatibility as original relay-based design. |
Use Scenario: Gateway-integrated lighting diagnostic node aggregating fault data across multiple lamp domains for CAN FD reporting. IC Role / Device Role: SPI-configurable diagnostic hub with standardized fault register mapping and wake-up event logging. Use Value: Reduces software integration effort by providing consistent SPI register layout across NXP's 12XS6 family, enabling shared driver code. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC40XS6500BEK | Same RDS(on), identical pinout and SPI register map; differs only in marking suffix and tape-and-reel packaging (no R2) | Used where reel packaging is not required; identical functional behavior and thermal performance | Select MC40XS6500BEK for prototype builds or low-volume manual assembly; MC40XS6500DEKR2 preferred for SMT production lines. |
| MC40XS6500CEK | Identical electrical specs and package; differentiated solely by date-code traceability and internal lot handling per NXP's quality tiering | No functional or application difference; deployed in programs requiring enhanced manufacturing traceability | Choose MC40XS6500CEK when ASIL-B compliance documentation or extended lot retention is mandated by OEM process requirements. |
Compared with MC40XS6500BEK and MC40XS6500CEK, the MC40XS6500DEKR2 offers identical core functionality but ships in tape-and-reel format optimized for automated placement, reducing line changeover time and minimizing static-sensitive handling in high-mix production environments.
Availability
MC40XS6500DEKR2 is available at Aetrix Electronics and suitable for automotive exterior lighting, LED headlamp control, and centralized lamp diagnostics requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified sourcing.
Supply support for MC40XS6500DEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive power management and functional safety.
The MC40XS6500DEKR2 belongs to NXP's 12XS6 SMARTMOS family-designed specifically for centralized automotive lighting ECUs requiring robust diagnostics, fail-safe operation, and software-compatible scalability across output count and RDS(on) variants.
FAQ
What is the maximum continuous output current per channel for MC40XS6500DEKR2?
The MC40XS6500DEKR2 supports 3.9 A continuous output current per channel (OUT1–OUT5) under thermal limits defined by RθJA = 22 °C/W on a four-layer board. This rating assumes junction temperature remains ≤150 °C and VBAT is within 7.0–18 V. Derating is required above ambient temperatures of 85 °C or with reduced copper area.
Does MC40XS6500DEKR2 require both VBAT and VCC to operate?
Yes, MC40XS6500DEKR2 requires both supplies: VBAT (7.0–18 V) powers the high-side drivers and internal regulator, while VCC (4.5–5.5 V) is mandatory for SPI communication, logic operation, and OUT6 control. Without VCC, the device enters sleep mode and SPI registers become inaccessible-even if VBAT is present.
How does the dynamic overcurrent threshold work in MC40XS6500DEKR2?
The MC40XS6500DEKR2 implements a time-varying overcurrent threshold that starts high during initial turn-on to tolerate inrush current (e.g., cold LED strings or incandescent filaments), then decays to a lower steady-state level for precise fault detection. This profile is SPI-programmable per channel and prevents false trips while maintaining tight current monitoring accuracy.
Can MC40XS6500DEKR2 drive loads above 18 V, such as during load dump?
MC40XS6500DEKR2 tolerates up to 40 V on VBAT for short durations (e.g., load dump per ISO 7637-2 Pulse 5a), but full specification compliance-including RDS(on), timing, and diagnostic accuracy-is guaranteed only between 7.0 V and 18 V. Operation at 28 V (jump start) is supported in extended mode, though some features like PWM may be limited.
Is MC40XS6500DEKR2 pin-compatible with other 12XS6 family members?
Yes, MC40XS6500DEKR2 shares identical SOIC-32EP footprint and pinout with MC40XS6500BEK and MC40XS6500CEK, including matching VBAT pad layout and SPI signal placement. This enables drop-in replacement across variants without PCB redesign, provided firmware supports the same register map and feature set.
MC40XS6500DEKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 6
- Ratio - Input:Output:
- 1:6
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- PWM, SPI
- Voltage - Load:
- 7V ~ 18V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- 3.9A
- Rds On (Typ):
- 40mOhm
- Input Type:
- Non-Inverting
- Features:
- Internal PWM, Slew Rate Controlled, Status Flag
- Fault Protection:
- Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-HSOP
MC40XS6500DEKR2 FAQ
1.How can I place an order for MC40XS6500DEKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC40XS6500DEKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC40XS6500DEKR2 reliable?
The price and inventory of MC40XS6500DEKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC40XS6500DEKR2 is usually 5 days.
3.What payment methods are accepted for MC40XS6500DEKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC40XS6500DEKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC40XS6500DEKR2?
MC40XS6500DEKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC40XS6500DEKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC40XS6500DEKR2?
For technical support, including MC40XS6500DEKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC40XS6500DEKR2 requirements.
6.How does Aetrix verify that MC40XS6500DEKR2 is sourced from the original manufacturer or authorized distributors?
All MC40XS6500DEKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC40XS6500DEKR2 meets industry standards.
7.What is the process for return or replacement of MC40XS6500DEKR2?
All MC40XS6500DEKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC40XS6500DEKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC40XS6500DEKR2 part is unused and in its original packaging.
Return procedure for MC40XS6500DEKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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