NXP Semiconductors MC56F82723VFM
- Part No.:
- MC56F82723VFM
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
MC56F82723VFM.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 32QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,435
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC56F82723VFM from NXP Semiconductors is a 32-bit digital signal controller (DSC) based on the 56800EX core, operating at up to 100 MHz in fast mode and delivering 100 MIPS. It integrates dual 12-bit ADCs (2×8 channels), two 12-bit DACs, eFlexPWM with 8 high-resolution outputs, and supports motor control (BLDC/PMSM), switched-mode power supplies, and industrial automation. Its 32-pin QFN package, -40°C to 125°C M-temperature grade, and 3.3 V single supply make it suitable for thermally demanding embedded control.
For engineers reviewing the MC56F82723VFM datasheet, MC56F82723VFM pinout, MC56F82723VFM application, or MC56F82723VFM equivalent, key selection criteria include its 32-pin QFN footprint, M-grade temperature range, 32 KB flash/6 KB RAM configuration, dual ADC with programmable gain amplifiers, and eFlexPWM NanoEdge timing resolution - all critical for real-time closed-loop control in power electronics and motor drives.
Technical Context
The MC56F82723VFM implements the 56800EX core with modified dual-Harvard architecture, enabling concurrent instruction fetches and dual data accesses per cycle. It features a unified DSP/MCU instruction set supporting fractional arithmetic, hardware MAC, and zero-overhead context switching via full register shadowing.
Its peripheral integration centers on deterministic real-time control: the eFlexPWM module supports independent deadtime insertion and FORCE_OUT synchronized output updates; dual 12-bit ADCs are synchronized via crossbar to PWM or timer triggers; and the inter-module crossbar enables flexible routing between ADCs, comparators, DACs, and PWM inputs without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 32-bit 56800EX DSP/MCU hybrid core, 100 MIPS @ 100 MHz - enables simultaneous control-law computation and signal processing in single-cycle MAC operations. |
| Flash / RAM | 32 KB flash / 6 KB RAM - sufficient for compact motor FOC or SMPS digital compensator code with runtime data buffers. |
| ADC | Two 12-bit cyclic ADCs, 2×3 external channels each, with x1/x2/x4 programmable gain - supports direct current/voltage sensing with dynamic range adaptation. |
| PWM | eFlexPWM with 8 high-resolution outputs, NanoEdge placement - achieves sub-nanosecond timing precision for advanced gate driving in SiC/GaN inverters. |
| DAC | Two 12-bit DACs with automatic waveform generation (triangle/sawtooth) - provides slope compensation or reference signals without CPU overhead. |
| Temp Range | -40°C to +125°C (M-grade) - qualified for under-hood automotive power modules and industrial motor drives with high ambient thermal stress. |
| I/O Voltage | 5 V–tolerant GPIO (except RESETB) - simplifies interface to legacy 5 V sensors and logic without level shifters. |
| Package | 32-pin QFN (7 mm × 7 mm, 0.5 mm pitch) - compact footprint with exposed thermal pad for efficient heat dissipation in space-constrained power stages. |
Pinout & Package
MC56F82723VFM uses a 32-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments are defined for the 32-pin variant per MC56F827xxDS Rev. 4.1, Table 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | I/O Power Supply | 3.3 V supply for digital I/O; must be decoupled locally to ensure noise immunity for GPIO and communication peripherals. |
| VSS | I/O Ground | Common return path for digital I/O; requires low-inductance connection to minimize ground bounce in high-speed PWM switching. |
| VDDA / VSSA | Analog Power / Ground | Separate 3.3 V analog supply and ground for ADC/DAC/comparators; mandatory isolation from digital planes to preserve 12-bit accuracy. |
| VCAP | Core Regulator Output | Connect 2.2 µF capacitor to VSS; total capacitance across all VCAP pins ≤ 4.7 µF - stabilizes internal 1.2 V core voltage under dynamic load. |
| RESETB | Active-Low Reset Input | 3.3 V-only input (not 5 V tolerant); internal pullup enables reliable power-on reset without external circuitry. |
| TCK / TMS / TDI / TDO | JTAG Debug Interface | Supports real-time emulation via EOnCE; TMS requires 2.2 kΩ pullup to VDD for on-board debug retention. |
| ADC0_IN0–ADC0_IN2 | Analog Inputs | Three dedicated inputs for first ADC; support single-ended or differential acquisition with programmable gain for current-sense amplifier interfacing. |
| PWMA_A0–PWMA_A3 | eFlexPWM Outputs | Four complementary PWM outputs from submodule A; support independent polarity, deadtime, and forced update for three-phase inverter topologies. |
Key Features
| Feature | Design Value |
|---|---|
| 56800EX Core Architecture | Modified dual-Harvard with three address buses and four data buses - enables concurrent program fetch and dual data access per cycle for deterministic loop execution. |
| eFlexPWM NanoEdge Timing | Sub-nanosecond PWM edge placement resolution - eliminates timing jitter in high-frequency (>100 kHz) SiC gate drivers requiring precise deadtime control. |
| Inter-Module Crossbar | Configurable routing matrix linking ADC, PWM, timers, and comparators - allows hardware-triggered ADC sampling on PWM center-aligned events without CPU ISR latency. |
| Programmable Gain ADC Amplifiers | x1/x2/x4 selectable gain per channel - adapts input range to shunt resistor voltage drops (e.g., 50 mV full-scale) while preserving 12-bit ENOB across operating conditions. |
| M-Grade Temperature Range | -40°C to +125°C operation - validated for continuous use in automotive engine compartments and industrial variable-frequency drives without derating. |
| 5 V–Tolerant GPIO | All I/O pins (except RESETB) withstand 5 V - enables direct connection to industrial PLC I/O modules and legacy sensor interfaces without external level translators. |
Applications
| Motor Control System | Switched-Mode Power Supply |
|---|---|
Use Scenario: Field-oriented control of 3-phase BLDC motors in HVAC compressors or electric power steering units. IC Role / Device Role / Timing Role: Real-time DSC executing FOC algorithm, generating six PWM signals with synchronized ADC sampling of phase currents and DC bus voltage. Use Value: eFlexPWM NanoEdge placement ensures <1 ns edge jitter, enabling stable 20+ kHz switching with minimal EMI; dual ADCs capture current and voltage simultaneously within 100 ns window. | Use Scenario: Digital control of isolated LLC resonant converters in server PSUs or telecom rectifiers. IC Role / Device Role / Timing Role: Closed-loop regulator computing duty cycle and frequency modulation using sampled output voltage/current, with hardware-accelerated PID and PWM synchronization. Use Value: 100 MIPS core executes complex control laws at 100 kHz loop rate; programmable DAC generates precise slope compensation ramp, eliminating external analog components. |
| Industrial Circuit Breaker | Photovoltaic Inverter |
Use Scenario: Intelligent trip unit monitoring line current, voltage, and temperature in medium-voltage distribution panels. IC Role / Device Role / Timing Role: Fault detection processor acquiring analog inputs via dual ADCs, running protection algorithms (overcurrent, earth fault), and driving solid-state trip actuators. Use Value: Windowed COP and EWM watchdogs provide ASIL-B–compliant safety monitoring; 125°C rating ensures reliability in sealed enclosures with no active cooling. | Use Scenario: Maximum power point tracking (MPPT) and grid-synchronization control in string inverters for residential solar arrays. IC Role / Device Role / Timing Role: Dual-core-equivalent processing unit managing MPPT algorithm, DC-DC boost stage control, and grid-tie inverter modulation with anti-islanding detection. Use Value: Inter-module crossbar routes ADC samples directly to PWM triggers for precise current shaping; 32 KB flash stores multiple MPPT curves and grid compliance firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC56F82733VFM | Same 32-pin QFN package and M-temp grade, but with 48 KB flash / 8 KB RAM and 2×8-channel ADCs instead of 2×3. | Supports more complex control algorithms (e.g., dual-motor control) and larger lookup tables; retains identical peripheral set and pinout. | Select when firmware size exceeds 32 KB or additional ADC channels are needed for auxiliary sensing. |
| MC56F82723VLC | Identical core, memory, and peripherals, but in 64-pin LQFP package with V-temp grade (-40°C to 105°C) instead of M-grade. | Better suited for lab prototyping or lower-thermal-stress industrial environments where PCB layout flexibility outweighs temperature margin. | Choose for development boards or applications where 64-pin routing simplifies layout and 105°C ambient suffices. |
Compared with MC56F82723VFM, MC56F82733VFM offers expanded memory for feature-rich firmware without changing hardware design, while MC56F82723VLC trades thermal robustness for package accessibility - both require no schematic or layout revision but differ in thermal qualification and memory headroom.
Availability
MC56F82723VFM is available at Aetrix Electronics and suitable for motor control systems, switched-mode power supplies, industrial circuit breakers, and photovoltaic inverters requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC56F82723VFM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in microcontrollers, RF, and analog technologies.
The MC56F827xx family is designed specifically for high-performance digital power conversion and real-time motor control, combining DSP computational efficiency with MCU peripheral integration to replace discrete controller + signal processor architectures.
FAQ
What is the maximum operating frequency of the MC56F82723VFM core?
The MC56F82723VFM core operates at up to 100 MHz in fast mode, delivering 100 MIPS performance. This frequency is sustained across its full -40°C to +125°C operating range, with internal PLL generating the core clock from an external 4–16 MHz crystal or oscillator source as specified in the MC56F827xxDS Rev. 4.1 datasheet.
Does the MC56F82723VFM support CAN communication?
No, the MC56F82723VFM does not include the MSCAN module. Per the MC56F827xx Family comparison table in Rev. 4.1, MSCAN is only present in variants with part numbers ending in 'V' or 'M' followed by 'LH', 'LF', or 'LC' - such as MC56F82748VLH - but is explicitly omitted from all 'VFM' and 'VLC' variants including MC56F82723VFM.
What are the analog input capabilities of the MC56F82723VFM?
The MC56F82723VFM integrates two independent 12-bit cyclic ADCs, each with 3 external input channels (6 total), programmable x1/x2/x4 gain amplifiers, and support for single-ended and differential acquisition. Conversion time is 10 ADC clock cycles (minimum 100 ns period), and sampling can be hardware-triggered via PWM, timer, or comparator events through the inter-module crossbar.
Is the MC56F82723VFM pin-compatible with other MC56F827xx family members?
The MC56F82723VFM shares the same 32-pin QFN package and pinout with MC56F82733VFM, MC56F82723VLC, and MC56F82733VLC. However, it is not pin-compatible with 48-pin or 64-pin variants like MC56F82748VLH. Signal mapping for all 32-pin QFN devices is identical per Table 2 of MC56F827xxDS Rev. 4.1.
What debug interfaces does the MC56F82723VFM support?
The MC56F82723VFM supports JTAG-based debugging via TCK, TMS, TDI, and TDO pins, with enhanced on-chip emulation (EOnCE) enabling unobtrusive real-time tracing and breakpoint control independent of CPU speed. The TMS pin requires a 2.2 kΩ pullup to VDD for reliable on-board debug functionality, as documented in the MC56F827xxDS Rev. 4.1 signal descriptions section.
MC56F82723VFM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VFQFN Exposed Pad
- Series:
- 56F8xxx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 56800EX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 32KB (16K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3K x 16
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 6x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
MC56F82723VFM FAQ
1.How can I place an order for MC56F82723VFM through Aetrix?
Please submit a Request for Quotation (RFQ) for MC56F82723VFM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC56F82723VFM reliable?
The price and inventory of MC56F82723VFM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC56F82723VFM is usually 5 days.
3.What payment methods are accepted for MC56F82723VFM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC56F82723VFM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC56F82723VFM?
MC56F82723VFM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC56F82723VFM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC56F82723VFM?
For technical support, including MC56F82723VFM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC56F82723VFM requirements.
6.How does Aetrix verify that MC56F82723VFM is sourced from the original manufacturer or authorized distributors?
All MC56F82723VFM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC56F82723VFM meets industry standards.
7.What is the process for return or replacement of MC56F82723VFM?
All MC56F82723VFM units undergo pre-shipment inspection (PSI). If there is an issue with MC56F82723VFM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC56F82723VFM part is unused and in its original packaging.
Return procedure for MC56F82723VFM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC56F82723VFM Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

