NXP Semiconductors MC56F82746MLF

Overview

MC56F82746MLF from NXP Semiconductors is a 32-bit digital signal controller (DSC) based on the 56800EX core, delivering up to 100 MIPS at 100 MHz in fast mode. It integrates 64 KB flash, 8 KB RAM, dual 12-bit ADCs with programmable gain amplifiers, four analog comparators with 6-bit DAC references, and one eFlexPWM module supporting up to 8 high-resolution PWM outputs. It targets motor control (BLDC/PMSM), switched-mode power supplies, and industrial automation systems requiring deterministic real-time processing.

For engineers reviewing the MC56F82746MLF datasheet, MC56F82746MLF pinout, MC56F82746MLF application, or MC56F82746MLF equivalent, key selection criteria include its -40°C to 125°C M-temperature grade, 64-pin LQFP package, 3.0–3.6 V single supply, 5 V–tolerant I/O (except RESETB), and integrated MSCAN, QSCI, QSPI, and I²C interfaces for embedded control subsystems.

Technical Context

The MC56F82746MLF implements a unified 32-bit 56800EX DSP/MCU architecture with three internal address buses and four data buses enabling concurrent instruction fetches and dual data accesses per cycle. Its dual Harvard memory system supports simultaneous program/data access, while the inter-module crossbar enables flexible routing of ADC triggers, PWM events, comparator outputs, and timer signals without CPU intervention.

It features two independent 12-bit cyclic ADCs with 8-channel external inputs, x1/x2/x4 programmable pre-amplifiers, and 10 MHz max clock rate; an eFlexPWM module with NanoEdge timing resolution, independent deadtime control, and fault input mapping; and dual periodic interrupt timers (PIT0/PIT1) capable of waking the CPU from Wait/Stop modes using crystal, ROSC, or PLL-derived clocks.

Key Specifications

Pinout & Package

MC56F82746MLF is housed in a 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are defined per Table 2 of MC56F827XXDS Rev. 4.1, including dedicated VDD/VSS/VDDA/VSSA rails, VCAP for core regulator stabilization, JTAG TDI/TDO/TCK/TMS, RESETB (3.3 V only), and multiplexed GPIO/peripheral signals routed via SIM and GPIOx_PER registers.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal controller applications.

Compared with MC56F82746VLF, the MC56F82746MLF provides extended thermal operation critical for under-hood automotive or high-ambient industrial enclosures; compared with MC56F82748MLH, it offers identical CAN functionality in a functionally equivalent package, eliminating unnecessary over-specification.

Availability

MC56F82746MLF is available at Aetrix Electronics and suitable for motor control systems, switched-mode power supplies, industrial PLC modules, and photovoltaic inverters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC56F82746MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers, RF, and analog technologies.

The MC56F827xx family was designed specifically for high-performance embedded control in motor drives, power conversion, and industrial automation - combining DSP-level math throughput with MCU-style peripheral integration and safety features.

FAQ

What is the maximum operating temperature specification for MC56F82746MLF?

The MC56F82746MLF is rated for operation from -40°C to +125°C (M-temperature grade), making it suitable for demanding industrial and automotive under-hood applications where thermal margins exceed standard commercial-grade devices. This rating is confirmed in Table 1 of the MC56F827XXDS Rev. 4.1 datasheet and applies to the full electrical specification across the range.

Does MC56F82746MLF support Controller Area Network (CAN) communication?

Yes, MC56F82746MLF includes a Modular/Scalable CAN (MSCAN) module compliant with CAN 2.0 A/B protocol, supporting standard and extended frames, up to 8-byte payloads, programmable bit rates up to 1 Mbit/s, and listen-only and loopback test modes. The MSCAN module is fully integrated and documented in Section 1.6.11 of MC56F827XXDS Rev. 4.1.

What package type and pin count does MC56F82746MLF use?

MC56F82746MLF uses a 64-pin LQFP package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad, as specified in Section 11 (Pinout) and Table 1 of the MC56F827XXDS Rev. 4.1 datasheet. Pin assignments match the 64-pin variant column in Table 2, including dedicated VDD/VSS/VDDA/VSSA, VCAP, JTAG, and RESETB pins.

How much on-chip memory does MC56F82746MLF provide?

MC56F82746MLF integrates 64 KB of on-chip flash memory and 8 KB of dual-port data/program RAM, both mappable into program or data memory spaces. This configuration supports complex control algorithms and real-time data buffering, as verified in Sections 1.4 and Table 1 of MC56F827XXDS Rev. 4.1.

Is MC56F82746MLF compatible with 5 V logic interfaces?

MC56F82746MLF features 5 V–tolerant I/O pins across all GPIO ports except RESETB, which is strictly 3.3 V only. This allows direct interfacing with legacy 5 V sensors, actuators, and communication transceivers without level-shifting circuitry, as explicitly stated in Section 1.3 (Operation Parameters) of MC56F827XXDS Rev. 4.1.