NXP Semiconductors MC56F8335VFGE
- Part No.:
- MC56F8335VFGE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 128-LQFP
- Datasheet:
-
MC56F8335VFGE.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 128LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,382
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Product details
Overview
MC56F8335VFGE from NXP Semiconductors (formerly Freescale) is a 60 MHz digital signal controller (DSC) based on the 56800E core, integrating 64 KB program Flash, 8 KB data Flash, 4 KB program RAM, 8 KB data RAM, dual 6-channel PWM modules, FlexCAN 2.0A/B, and a 12-bit 16-input ADC - deployed in industrial motor control and automotive powertrain subsystems.
For engineers reviewing the MC56F8335VFGE datasheet, MC56F8335VFGE pinout, MC56F8335VFGE application, or MC56F8335VFGE equivalent, key selection criteria include its -40°C to +105°C operating range, LQFP-128 package, integrated temperature sensor, hardware fault protection for PWM, and tight ADC-PWM synchronization for real-time closed-loop control.
Technical Context
The MC56F8335VFGE implements the 56800E Harvard architecture with three parallel execution units enabling up to six operations per instruction cycle. It supports C-efficient DSP+MCU code via unified addressing, single-cycle 16×16 MAC, four 36-bit accumulators, and hardware DO/REP loops.
Its peripheral set includes two independent PWM modules (12 outputs, 8 fault inputs), two quadrature decoders, two SPIs, two SCIs, I²C master emulation, and a FlexCAN module compliant with ISO 11898-1:2003 (CAN 2.0A/B). Memory operates at full 60 MHz with zero wait states across temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 56800E Harvard core with three parallel execution units, enabling up to six operations per instruction cycle |
| Clock Speed / Performance | 60 MHz operation delivering 60 MIPS - sufficient for real-time field-oriented control (FOC) of 3-phase motors |
| Flash Memory | 80 KB total: 64 KB program Flash + 8 KB data Flash + 8 KB boot Flash - supports in-application reprogramming and secure boot |
| RAM | 12 KB total: 4 KB program RAM + 8 KB data RAM - enables fast coefficient storage and real-time variable buffering |
| PWM Capability | Dual 6-channel modules (12 outputs), eight programmable fault inputs - supports dead-time insertion, trip-zone protection, and synchronous update for inverter gate drivers |
| ADC | 12-bit resolution, 16 input channels, self-calibration, current injection - enables precise current/voltage sensing with <1 µs conversion latency |
| FlexCAN Interface | ISO 11898-1:2003 compliant CAN 2.0A/B controller with message buffers and error counters - handles distributed control messaging without host CPU overhead |
Pinout & Package
MC56F8335VFGE is housed in a 128-pin Low-Profile Quad Flat Pack (LQFP) package with 0.4 mm pitch, thermally enhanced for industrial ambient operation up to +105°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital supply pairs with internal voltage regulator (3.3V → 2.6V) reduce external component count |
| XTAL, EXTAL | Crystal oscillator inputs | Supports external 4–20 MHz crystal; internal relaxation oscillator provides fail-safe clock source |
| PWMxA, PWMxB | PWM output pairs | Complementary high-side/low-side outputs with programmable dead time - directly drive half-bridge gate drivers |
| ADC0–ADC15 | Analog inputs | 16 dedicated pins with simultaneous sampling capability - enable synchronized current sensing across multiple phases |
| CANH, CANL | CAN bus differential pair | Direct interface to ISO 11898-compliant transceiver - no level-shifting required |
| JTAG_TCK, TMS, TDI, TDO | Debug interface | Full EOnCE™ support for non-intrusive real-time debugging and flash programming without halting execution |
Key Features
| Feature | Design Value |
|---|---|
| Integrated temperature sensor | Monitors die temperature continuously to trigger thermal shutdown before junction exceeds safe limit - eliminates need for external thermal IC |
| Tight ADC-PWM synchronization | Hardware-triggered ADC sampling aligned to PWM center-aligned period - ensures deterministic timing for current loop control |
| Programmable fault protection | Eight independent fault inputs mapped to PWM modules with configurable response (blanking, shutdown, interrupt) - meets IEC 61800-5-2 functional safety requirements |
| Flash security lock | Prevents unauthorized read-out of program memory via JTAG or serial interface - protects proprietary motor control algorithms |
| On-chip PLL with software control | Configurable multiplication factor (×1 to ×16) allows dynamic clock scaling - balances performance vs. power consumption during idle modes |
Applications
| Industrial Motor Control | Automotive Powertrain |
|---|---|
Use Scenario: Closed-loop FOC of 3-phase PMSM/BLDC motors in HVAC compressors and pump drives. IC Role / Device Role / Timing Role: Real-time DSC executing position estimation, current regulation, and PWM generation with sub-microsecond jitter. Use Value: Dual 6-channel PWM with synchronized ADC sampling enables precise phase current reconstruction and torque ripple reduction below 3% THD. | Use Scenario: Throttle actuator control and transmission solenoid management in 12V engine control units. IC Role / Device Role / Timing Role: Safety-aware controller managing PWM-driven actuators while monitoring voltage, temperature, and CAN status. Use Value: Integrated COP watchdog, LVI detection, and fault-input-triggered PWM shutdown meet ASIL-B diagnostic coverage requirements without external safety monitors. |
| Smart Inverters | Fire & Security Systems |
Use Scenario: Grid-tied solar microinverters requiring MPPT, DC-AC conversion, and anti-islanding detection. IC Role / Device Role / Timing Role: Primary controller handling high-frequency PWM (20 kHz), ADC-based islanding detection, and CAN-based system coordination. Use Value: 60 MIPS processing headroom allows concurrent execution of MPPT algorithm, grid-synchronization PLL, and harmonic analysis - all within one device. | Use Scenario: Multi-sensor fire alarm panels with smoke, heat, and CO detection plus networked zone reporting. IC Role / Device Role / Timing Role: Central DSC aggregating analog sensor inputs, running classification logic, and communicating via CAN to remote nodes. Use Value: On-chip temperature sensor validates sensor health; FlexCAN enables deterministic, fault-tolerant inter-panel communication per EN 54-22. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC56F8323VFGE | Same 56800E core, 48 KB Flash, 4 KB RAM, single PWM module (6 outputs), no FlexCAN | Lacks CAN interface and second PWM - suitable only for standalone motor control without networking | Select when CAN and dual PWM are unnecessary and BOM cost reduction is critical |
| MPC5604B | Power Architecture core, 64 MHz, 512 KB Flash, 48 KB RAM, e200z0 core, CAN FD capable | Higher performance, larger memory, CAN FD support - targets ASIL-B automotive ECUs with complex diagnostics | Choose for next-generation automotive platforms requiring CAN FD, larger code space, and higher safety certification scope |
Compared with MC56F8335VFGE, MC56F8323VFGE reduces peripheral count and memory to lower cost but sacrifices networking and redundancy; MPC5604B offers greater scalability and modern CAN FD, yet requires toolchain migration and higher power budget.
Availability
MC56F8335VFGE is available at Aetrix Electronics and suitable for industrial motor control, automotive powertrain subsystems, and smart inverter designs requiring stable component supply over extended product lifecycles.
Supply support for MC56F8335VFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC56F8335VFGE belongs to NXP's legacy 56F8300 DSC family, designed specifically for cost-sensitive, real-time embedded control applications demanding integrated signal processing, motor control peripherals, and functional safety features.
FAQ
What is the maximum operating temperature for the MC56F8335VFGE?
The MC56F8335VFGE is rated for operation from -40°C to +105°C. This extended temperature range is validated across all memory and peripheral functions, including Flash endurance and ADC linearity, making it suitable for under-hood automotive and industrial environments where thermal stress is critical. The on-die temperature sensor provides real-time monitoring to support thermal derating strategies in the MC56F8335VFGE firmware.
Does the MC56F8335VFGE support in-application programming (IAP) of Flash memory?
Yes, the MC56F8335VFGE supports secure in-application programming via its EOnCE™ debug interface or through SCI/SPI serial interfaces. The 64 KB program Flash and 8 KB data Flash can be reprogrammed without external programmers, enabling field firmware updates and parameter tuning. Flash security bits prevent unauthorized access during IAP, preserving intellectual property in the MC56F8335VFGE deployment.
How many independent PWM modules does the MC56F8335VFGE integrate?
The MC56F8335VFGE integrates two independent PWM modules, each supporting six complementary output channels (12 total), eight programmable fault inputs, and flexible dead-time insertion. This dual-module architecture allows simultaneous control of multiple inverters or multi-phase motors - a key capability leveraged in the MC56F8335VFGE's use for multiphase motor drives and interleaved power converters.
Is the FlexCAN module in the MC56F8335VFGE compatible with CAN FD?
No, the FlexCAN module in the MC56F8335VFGE is compliant with CAN 2.0A/B only (ISO 11898-1:2003) and does not support CAN FD data rates or extended frame formats. It provides 16 message buffers, hardware filtering, and error confinement - fully adequate for traditional automotive body control and industrial CAN networks. For CAN FD, consider newer NXP families such as S32K1 or MPC56xx derivatives instead of the MC56F8335VFGE.
What development tools are officially supported for the MC56F8335VFGE?
NXP officially supports the MC56F8335VFGE with CodeWarrior Development Studio v10.x and Processor Expert™ rapid application design tools. Evaluation is enabled via the DEMO56F8335 development board, which includes on-board JTAG/EOnCE™ debugging, motor control headers, and CAN transceivers. Legacy support remains available through NXP's archived documentation suite, including MC56F8335PB and MC56F8335FS - essential references for configuring the MC56F8335VFGE's peripherals correctly.
MC56F8335VFGE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 128-LQFP
- Series:
- 56F8xxx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 56800E
- Core Size:
- 16-Bit
- Speed:
- 60MHz
- Connectivity:
- CANbus, EBI/EMI, SCI, SPI
- Peripherals:
- POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 64KB (32K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 16
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC56F8335VFGE FAQ
1.How can I place an order for MC56F8335VFGE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC56F8335VFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC56F8335VFGE reliable?
The price and inventory of MC56F8335VFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC56F8335VFGE is usually 5 days.
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4.How is shipping managed for MC56F8335VFGE?
MC56F8335VFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC56F8335VFGE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC56F8335VFGE?
For technical support, including MC56F8335VFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC56F8335VFGE requirements.
6.How does Aetrix verify that MC56F8335VFGE is sourced from the original manufacturer or authorized distributors?
All MC56F8335VFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC56F8335VFGE meets industry standards.
7.What is the process for return or replacement of MC56F8335VFGE?
All MC56F8335VFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC56F8335VFGE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC56F8335VFGE part is unused and in its original packaging.
Return procedure for MC56F8335VFGE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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