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NXP Semiconductors MC56F83763VLH

Part No.:
MC56F83763VLH
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixMC56F83763VLH.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,359

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Product details

Overview

MC56F83763VLH from NXP is a 100 MHz 32-bit 56800EX digital signal controller (DSC) optimized for digital power conversion and motor control, featuring 128 KB flash with ECC, 48 KB SRAM, dual-partition flash swap, 16-channel eFlexPWM with 312 ps resolution, two 12-bit 3 MSPS ADCs, CAN FD, and USB FS OTG - deployed in onboard chargers and photovoltaic inverters.

For engineers reviewing the MC56F83763VLH datasheet, MC56F83763VLH pinout, MC56F83763VLH application, or MC56F83763VLH equivalent, key selection considerations include flash swap capability for safe firmware updates, 5V-tolerant I/O for mixed-voltage system interfacing, and eDMA-assisted PWM/ADC synchronization in real-time closed-loop control.

Technical Context

The MC56F83763VLH integrates a 100 MHz 56800EX DSP core with parallel move and fractional arithmetic support, enabling single-cycle math operations critical for fast inner-loop execution in PMSM and BLDC motor drives. Its inter-module crossbar (XBAR) routes events between eFlexPWM, ADC, and EVTG with configurable latency.

It implements dual-partition flash with hardware ECC and boot ROM (32 KB), allowing bootloader storage independent of application flash. The eDMA controller supports two-level loop transfers, reducing CPU load during high-frequency PWM waveform generation and ADC data acquisition.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core32-bit 56800EX DSP running at 100 MHz with single-cycle math and fractional arithmetic
Flash Memory128 KB with ECC, dual-partition swap for atomic firmware updates
SRAM48 KB for real-time variable storage and code execution acceleration
eFlexPWM16-channel, 312 ps resolution, supporting >1 MHz switching in digital power stages
ADCTwo 12-bit, 3 MSPS converters with PGA, enabling precise current/voltage sampling in noisy power environments
CommunicationCAN FD (up to 5 Mbps) and USB FS OTG with crystal-less operation for BOM cost reduction
I/O Voltage5V-tolerant pins simplify interface with legacy sensors, gate drivers, and level-shifting circuits

Pinout & Package

LQFP64 package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, industrial temperature range (–40 °C to +105 °C).

Pin/TerminalCircuit RoleDesign Meaning
VDDA/VSSAAnalog power/groundSeparate analog domain supply for ADC/DAC reference stability and noise isolation
ADC0_IN0–ADC0_IN7Analog input channelsDedicated pins for high-speed current sensing and DC-link voltage monitoring
PWM_A0–PWM_A7eFlexPWM output A-sideHigh-resolution complementary outputs with dead-time insertion for half/full-bridge gate drive
PWM_B0–PWM_B7eFlexPWM output B-sideIndependent B-side outputs enable interleaved multi-phase topologies (e.g., 3-phase PFC + inverter)
CAN_TX/CAN_RXCAN FD physical layer interfaceDifferential signaling compliant with ISO 11898-1:2015, supporting flexible data-rate arbitration and payload
USB_DP/USB_DMUSB 2.0 Full-Speed differential pairCrystal-less operation via internal 48 MHz oscillator; supports device/host/OTG roles

Key Features

FeatureDesign Value
Dual-partition flash with hardware ECCEnables verified, atomic firmware updates without runtime interruption or flash corruption risk
16-channel eFlexPWM with 312 ps resolutionSupports >1 MHz switching frequencies in resonant LLC and GaN-based SMPS designs
Two independent 12-bit 3 MSPS ADCs with PGAAllows simultaneous high-accuracy sampling of phase currents and bus voltage with <10 ns jitter
5V-tolerant GPIOEliminates external level shifters when interfacing with 5 V Hall sensors, optocouplers, or legacy MCU peripherals
eDMA with scatter-gather and loop chainingOffloads CPU from ADC-to-memory and PWM register update tasks, freeing cycles for PID computation

Applications

Onboard Charger (OBC)Photovoltaic Inverter

Use Scenario: Bidirectional AC/DC and DC/DC conversion in EV charging systems with grid synchronization and battery management.

IC Role / Device Role / Timing Role: Primary DSC executing dual-loop control (PFC + DC-DC), managing CAN FD communication with BMS, and handling USB-based diagnostics.

Use Value: 100 MHz core and eDMA enable concurrent execution of 20+ kHz PFC and 100+ kHz LLC control loops with sub-microsecond timing precision.

Use Scenario: Grid-tied solar inverter with MPPT, reactive power control, and anti-islanding protection.

IC Role / Device Role / Timing Role: Real-time MPPT algorithm host, PWM generator for H-bridge switching, and ADC coordinator for panel voltage/current sampling.

Use Value: Dual 3 MSPS ADCs capture fast transients during cloud-edge events; 312 ps PWM resolution improves harmonic suppression in 25 kHz SPWM waveforms.

Industrial BLDC DriveWireless Charging Transmitter

Use Scenario: Closed-loop field-oriented control (FOC) of high-speed BLDC motors in CNC spindles and pumps.

IC Role / Device Role / Timing Role: Sensorless FOC executor using back-EMF estimation, PWM modulator with adaptive dead-time, and CAN FD node for motion command reception.

Use Value: Fractional arithmetic and single-cycle multiply-accumulate accelerate Clarke/Park transforms; eDMA synchronizes ADC sampling to PWM zero-crossing events.

Use Scenario: Resonant inverter control for Qi-compliant 15 W wireless power transmitters with foreign object detection (FOD).

IC Role / Device Role / Timing Role: High-frequency inverter controller measuring coil impedance shifts via ADC, modulating frequency/amplitude, and communicating status over I²C.

Use Value: 16-channel eFlexPWM supports multi-frequency burst-mode operation; 12-bit DACs feed analog comparators for fast FOD threshold comparison.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC56F83766VLKSame core, flash, SRAM, and peripheral set but in LQFP80 package with additional GPIO and UARTPreferred where board layout requires more I/O or second UART for debug/loggingSelect when pin count and peripheral expansion outweigh compact LQFP64 footprint constraints
MC56F83783VLH256 KB flash (vs. 128 KB), identical SRAM, PWM, ADC, CAN FD, and USB; same LQFP64 packageSuitable for applications requiring larger firmware image size (e.g., dual-application secure boot + runtime)Choose when future firmware growth or safety-certified redundancy demands extra flash capacity

Compared with MC56F83766VLK and MC56F83783VLH, the MC56F83763VLH delivers optimal balance of cost, footprint, and feature set for mid-complexity digital power and motor control designs where 128 KB flash and 64-pin I/O sufficiency are confirmed.

Availability

MC56F83763VLH is available at Aetrix Electronics and suitable for onboard chargers, photovoltaic inverters, industrial BLDC drives, and wireless charging transmitters requiring stable component supply across production lifecycles.

Supply support for MC56F83763VLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC56F83xxx family is part of NXP's high-performance DSC portfolio, engineered specifically for deterministic real-time control in digital power conversion and advanced motor drive systems.

FAQ

What is the maximum operating frequency of the MC56F83763VLH core?

The MC56F83763VLH features a 32-bit 56800EX DSP core rated for continuous operation at 100 MHz. This frequency applies to both core instruction execution and bus transactions, enabling deterministic cycle counts for time-critical control algorithms. All timing specifications in the official NXP datasheet (MC56F83763VLH Rev. 4) assume operation at this maximum frequency under industrial temperature conditions (–40 °C to +105 °C). The MC56F83763VLH achieves this performance using an on-chip PLL with external crystal or oscillator input.

Does the MC56F83763VLH support CAN FD, and what data rates are achievable?

Yes, the MC56F83763VLH integrates a FlexCAN module compliant with CAN FD (ISO 11898-1:2015), supporting arbitration bit rates up to 1 Mbps and data bit rates up to 5 Mbps. It maintains full backward compatibility with classical CAN 2.0 B frames. The MC56F83763VLH's CAN FD implementation includes dedicated message RAM, flexible filtering, and error confinement logic - validated in NXP's MC56F83XXXFS Rev. 4 fact sheet and supported by NXP's S32DS toolchain.

How does the dual-partition flash architecture work in the MC56F83763VLH?

The MC56F83763VLH implements dual-partition flash with hardware-assisted swap functionality, allowing one partition to run active firmware while the other receives an updated image. Upon successful CRC verification, the boot ROM triggers an atomic partition swap during reset - no external intervention required. This architecture eliminates runtime flash erasure and enables fail-safe field updates. The MC56F83763VLH's 128 KB flash is divided into two equal 64 KB partitions, each with ECC protection as documented in the MC56F83XXXFS Rev. 4 fact sheet.

What ADC performance metrics are guaranteed for the MC56F83763VLH?

The MC56F83763VLH includes two independent 12-bit successive-approximation ADCs, each rated for up to 3 MSPS sampling rate with integrated programmable gain amplifier (PGA). Total unadjusted error is ±1.5 LSB over temperature, and effective number of bits (ENOB) exceeds 11.2 bits at 100 kHz input. These specifications are measured under industrial conditions and published in the MC56F83XXXFS Rev. 4 fact sheet. The MC56F83763VLH's ADCs support hardware-triggered sampling synchronized to PWM events for minimal jitter in motor current sensing.

Is the MC56F83763VLH pin-compatible with other members of the MC56F83xxx family?

Yes, the MC56F83763VLH in LQFP64 is pin-compatible with MC56F83783VLH (256 KB flash), MC56F83683VLH (no CAN FD/USB), and MC56F83663VLH (no CAN FD/USB, no flash swap) - all sharing identical pin count, function mapping, and thermal pad layout. This allows direct substitution within the same PCB footprint when flash size or peripheral requirements change. Pin compatibility is explicitly stated in the MC56F83XXXFS Rev. 4 fact sheet under "Pin-to-pin compatible with the MC56F84xxx and MC56F82xxx DSC families" and confirmed across the VLH-suffixed variants.

MC56F83763VLH Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
56F837xx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
48K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC56F83763VLH FAQ

1.How can I place an order for MC56F83763VLH through Aetrix?

Please submit a Request for Quotation (RFQ) for MC56F83763VLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC56F83763VLH reliable?

The price and inventory of MC56F83763VLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC56F83763VLH is usually 5 days.

3.What payment methods are accepted for MC56F83763VLH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC56F83763VLH transactions.

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4.How is shipping managed for MC56F83763VLH?

MC56F83763VLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC56F83763VLH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC56F83763VLH?

For technical support, including MC56F83763VLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC56F83763VLH requirements.

6.How does Aetrix verify that MC56F83763VLH is sourced from the original manufacturer or authorized distributors?

All MC56F83763VLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC56F83763VLH meets industry standards.

7.What is the process for return or replacement of MC56F83763VLH?

All MC56F83763VLH units undergo pre-shipment inspection (PSI). If there is an issue with MC56F83763VLH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC56F83763VLH part is unused and in its original packaging.

Return procedure for MC56F83763VLH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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