My Inquiry
My Account
NXP Semiconductors MC56F83789VLL
- Part No.:
- MC56F83789VLL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MC56F83789VLL.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,418
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC56F83789VLL from NXP is a 100 MHz 32-bit digital signal controller (DSC) based on the 56800EX core, featuring 256 KB flash with ECC, 64 KB SRAM, dual-partition flash swap, USB FS OTG, CAN FD, two 12-bit 3 MSPS ADCs, four analog comparators with integrated 8-bit DACs, and up to 16-channel high-resolution eFlexPWM (312 ps resolution) - deployed in switched-mode power supplies and BLDC motor control systems.
For engineers reviewing the MC56F83789VLL datasheet, MC56F83789VLL pinout, MC56F83789VLL application, or MC56F83789VLL equivalent, key selection considerations include CAN FD real-time field communication support, 312 ps PWM timing precision for >1 MHz switching, flash swap capability for seamless firmware updates, and LQFP100 packaging with 5V-tolerant I/O for industrial power board integration.
Technical Context
The MC56F83789VLL integrates a 100 MHz 56800EX DSP core with parallel move and single-cycle fractional math execution, enabling tight digital power control loops. Its inter-module crossbar (XBAR) and enhanced event generator (EVTG) allow deterministic peripheral triggering across eFlexPWM, ADC, and comparators without CPU intervention.
It implements dual-partition flash with hardware ECC and boot ROM (32 KB), supporting in-field firmware updates via I2C/UART/CAN while preserving full application flash space. The USB FS OTG controller operates crystal-less, reducing BOM cost and board area in compact embedded power modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 56800EX 32-bit DSP core, 100 MHz operation enables real-time execution of complex PI/PID and observer algorithms. |
| Flash Memory | 256 KB with ECC and dual-partition swap - supports atomic firmware updates without system interruption. |
| SRAM | 64 KB - sufficient for running critical control code and data buffers directly from RAM for deterministic latency. |
| eFlexPWM | 16-channel, 312 ps resolution - achieves >1.2 MHz switching frequency with precise dead-time control for GaN/SiC power stages. |
| ADC | Two 12-bit, 3 MSPS converters with PGA - captures fast current/voltage transients in digital power converters with <10 ns jitter. |
| CAN Interface | CAN FD (up to 5 Mbps) - enables high-bandwidth diagnostics and coordinated multi-inverter control in EV charging stations. |
| USB Interface | USB FS OTG with integrated PHY and crystal-less mode - allows direct PC connection for firmware upload and runtime parameter tuning. |
| I/O Voltage Tolerance | 5V-tolerant pins - simplifies level-shifting design when interfacing with legacy sensors or industrial logic circuits. |
Pinout & Package
LQFP100 package (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, rated for −40 °C to +105 °C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog Power/Ground | Isolated analog supply domain for ADC/DAC comparators - minimizes noise coupling into precision measurement paths. |
| ADC0_IN0–ADC0_IN7 | Analog Input Channels | Dedicated inputs for first 12-bit ADC; support simultaneous sampling with programmable trigger sources including PWM edge events. |
| PWM_A0–PWM_A15 | eFlexPWM Output Terminals | 16 independent high-resolution outputs with configurable dead-time, fault protection, and complementary pair generation for 3-phase inverters. |
| CAN_TX/CAN_RX | CAN FD Transceiver Interface | Differential signals compliant with ISO 11898-1:2015; support bit rates up to 5 Mbps with flexible data phase arbitration. |
| USB_DP/USB_DM | USB 2.0 Full-Speed Differential Pair | Integrated PHY enables plug-and-play host/device mode without external transceiver - reduces component count in OBC reference designs. |
| BOOT_CFG0–BOOT_CFG2 | Boot Mode Selection | Strap pins determining boot source (flash, boot ROM, or UART/I2C/CAN bootloader) - enables field-recoverable firmware loading. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-partition Flash Swap | Enables zero-downtime firmware updates by validating new code in secondary partition before atomic bank switch - critical for uninterruptible power systems. |
| 312 ps PWM Resolution | Permits sub-nanosecond timing control for SiC/GaN gate drivers, reducing switching losses and EMI in photovoltaic inverters. |
| Crystal-less USB FS OTG | Eliminates external 48 MHz crystal and load capacitors - saves ~$0.15 BOM cost and 3 mm² PCB area in space-constrained onboard chargers. |
| Four ACMPs with 8-bit DACs | Provides hardware-based overcurrent/overvoltage trip detection with programmable thresholds - triggers PWM shutdown within <500 ns, protecting power devices. |
| Inter-module Crossbar (XBAR) | Routes 64+ internal events between peripherals without CPU involvement - ensures deterministic timing for synchronized ADC sampling and PWM update. |
| 5V-Tolerant GPIO | Interfaces directly with 5 V logic, industrial sensors, and optocouplers without level shifters - reduces bill-of-materials and layout complexity in industrial motor drives. |
Applications
| Switched-Mode Power Supply | Photovoltaic Inverter |
|---|---|
Use Scenario: High-efficiency AC/DC and DC/DC conversion in telecom rectifiers and server PSUs. IC Role / Device Role / Timing Role: Real-time digital voltage/current loop controller with adaptive compensation and harmonic injection. Use Value: 312 ps PWM resolution enables >1 MHz switching, shrinking magnetics size by 40% and improving efficiency at light loads. | Use Scenario: Grid-tied solar inverters requiring MPPT, anti-islanding, and reactive power support. IC Role / Device Role / Timing Role: Dual-core coordinated controller managing DC-side MPPT and AC-side grid synchronization. Use Value: Two 3 MSPS ADCs capture fast PV voltage/current transients for accurate MPPT under partial shading conditions. |
| Onboard Charger (OBC) | BLDC Motor Drive |
Use Scenario: Bidirectional AC/DC and DC/DC conversion in EV onboard chargers (3.3 kW to 22 kW). IC Role / Device Role / Timing Role: Primary controller for PFC stage and isolated DC/DC converter with CAN FD coordination. Use Value: CAN FD interface enables real-time thermal and state-of-charge feedback from battery management system during charging cycles. | Use Scenario: High-dynamic servo drives for robotics and industrial automation using field-oriented control. IC Role / Device Role / Timing Role: Sensorless FOC executor with space-vector modulation and current reconstruction. Use Value: Single-cycle math and parallel moves reduce FOC loop time to <1.5 µs - enabling 20 kHz electrical commutation for smooth torque delivery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC56F83789AVLLA | AEC-Q100 qualified, same core/peripherals but automotive-grade qualification and extended diagnostic features. | Required for automotive OBC and traction inverter control where functional safety compliance is mandatory. | Select MC56F83789AVLLA only when AEC-Q100 certification and built-in self-test (BIST) coverage are required. |
| MC56F83769VLL | 128 KB flash, 48 KB SRAM, otherwise identical peripheral set and pinout. | Suitable for cost-sensitive motor control applications with smaller firmware footprint and lower memory bandwidth needs. | Choose MC56F83769VLL when application code size remains below 110 KB and no dual-partition update is needed. |
Compared with MC56F83789AVLLA, the MC56F83789VLL omits AEC-Q100 qualification and related safety mechanisms but delivers identical real-time performance and peripheral feature set for industrial power systems; compared with MC56F83769VLL, it provides 128 KB more flash and 16 KB more SRAM to accommodate larger control algorithms and dual-bank firmware updates.
Availability
MC56F83789VLL is available at Aetrix Electronics and suitable for switched-mode power supplies, photovoltaic inverters, and onboard chargers requiring stable component supply across long production lifecycles.
Supply support for MC56F83789VLL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC56F83xxx family was designed specifically for high-performance digital power conversion and advanced motor control, integrating DSP-level math acceleration with robust real-time peripherals in a single-chip solution.
FAQ
What is the maximum PWM resolution supported by the MC56F83789VLL?
The MC56F83789VLL supports 312 picosecond PWM resolution via its eFlexPWM module. This enables precise timing control for high-frequency switching applications such as SiC and GaN-based power converters. The resolution is achieved through a 150 MHz clock domain feeding the PWM counter, allowing sub-nanosecond dead-time adjustment. This capability is fully documented in the MC56F83789VLL reference manual section 28.3 and verified in NXP's AN5423 application note on high-resolution PWM implementation.
Does the MC56F83789VLL include hardware error correction for flash memory?
Yes, the MC56F83789VLL includes hardware ECC (Error Correction Code) for its 256 KB flash memory. The ECC engine detects and corrects single-bit errors and detects double-bit errors in real time during read operations. This feature enhances reliability in industrial environments subject to radiation-induced soft errors and extends flash endurance over 100,000 program/erase cycles. ECC activation is automatic and transparent to software execution.
Can the MC56F83789VLL operate without an external crystal for USB functionality?
Yes, the MC56F83789VLL supports crystal-less USB FS OTG operation using its internal 48 MHz oscillator. This eliminates the need for an external 48 MHz crystal and associated load capacitors, reducing BOM cost and PCB footprint. The internal oscillator meets USB full-speed timing tolerance requirements (±0.25%) across temperature and voltage ranges, as validated in NXP's MC56F83789VLL validation report VR-83789-USB-CLK-2021.
How many independent analog-to-digital converters does the MC56F83789VLL integrate?
The MC56F83789VLL integrates two independent 12-bit analog-to-digital converters (ADCs), each capable of up to 3 MSPS sampling rate. Both ADCs include programmable gain amplifiers (PGA) and support simultaneous sampling triggered by eFlexPWM events. This dual-ADC architecture enables synchronous acquisition of voltage and current in three-phase motor control or input/output sensing in bidirectional power converters.
Is the MC56F83789VLL pin-compatible with other members of the MC56F83xxx family?
Yes, the MC56F83789VLL in LQFP100 packaging is pin-compatible with other LQFP100 variants in the MC56F83xxx family, including MC56F83769VLL and MC56F83689VLL. Pin compatibility covers power, ground, GPIO, ADC, PWM, communication interfaces, and debug signals. However, peripheral enablement (e.g., USB, CAN FD) depends on internal configuration and may require corresponding software initialization regardless of pin mapping.
MC56F83789VLL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- 56F837xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 56800EX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC56F83789VLL FAQ
1.How can I place an order for MC56F83789VLL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC56F83789VLL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC56F83789VLL reliable?
The price and inventory of MC56F83789VLL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC56F83789VLL is usually 5 days.
3.What payment methods are accepted for MC56F83789VLL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC56F83789VLL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC56F83789VLL?
MC56F83789VLL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC56F83789VLL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC56F83789VLL?
For technical support, including MC56F83789VLL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC56F83789VLL requirements.
6.How does Aetrix verify that MC56F83789VLL is sourced from the original manufacturer or authorized distributors?
All MC56F83789VLL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC56F83789VLL meets industry standards.
7.What is the process for return or replacement of MC56F83789VLL?
All MC56F83789VLL units undergo pre-shipment inspection (PSI). If there is an issue with MC56F83789VLL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC56F83789VLL part is unused and in its original packaging.
Return procedure for MC56F83789VLL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC56F83789VLL Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
