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NXP Semiconductors MC68376BGCAB25

Part No.:
MC68376BGCAB25
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
160-BQFP
Datasheet:
AetrixMC68376BGCAB25.pdf
Description:
IC MCU 32BIT ROMLESS 160QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,129

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Product details

Overview

MC68376BGCAB25 from NXP (formerly Motorola) is a 32-bit CISC microcontroller with integrated TPU, QSM, CAN controller, and 160-pin QFP package. It operates at 25 MHz, supports −40°C to +125°C industrial temperature range, and features 512 KB on-chip ROM (blank mask), 32 KB RAM, and 16-channel TPU for real-time motor control in embedded automotive systems.

For engineers reviewing the MC68376BGCAB25 datasheet, MC68376BGCAB25 pinout, MC68376BGCAB25 application, or MC68376BGCAB25 equivalent, key selection considerations include its CAN 2.0A/B-compliant dual-channel interface, 16-bit TPU with 32 timers, QSPI master/slave capability, and compatibility with MC68336-based legacy designs requiring extended temperature support and blank ROM for custom firmware.

Technical Context

The MC68376BGCAB25 implements the M68K core with full 32-bit address/data bus, integrated memory management unit (MMU), and dedicated peripheral subsystems including Time Processing Unit (TPU), Queued Serial Module (QSM), and Controller Area Network (CAN) controller. Its TPU provides hardware-accelerated timing functions for PWM generation and encoder decoding.

It supports external memory expansion via 24-bit address bus (ADDR0–ADDR23) and 16-bit data bus (DATA0–DATA15), with programmable chip select logic (CS0–CS10), burst mode, and wait-state control. The CAN module includes two independent channels compliant with ISO 11898-1:2003, supporting both standard and extended frame formats.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core M68000-compatible 32-bit CISC core with 25 MHz maximum clock frequency and 32-bit address/data bus
Memory 512 KB blank mask ROM (user-programmable), 32 KB on-chip SRAM, and external memory interface up to 16 MB
TPU 16-channel Time Processing Unit with 32 independent timers, supporting PWM, input capture, output compare, and quadrature decoding
CAN Interface Dual CAN 2.0A/B-compliant controllers with message buffers, acceptance filtering, and error handling per ISO 11898-1:2003
QSM Queued Serial Module with SPI master/slave mode, 8-deep FIFO, and programmable baud rate generator for sensor/actuator interfacing
Temperature Range −40°C to +125°C industrial grade operation, validated for under-hood automotive environments
Package 160-pin plastic quad flat pack (QFP), 28 mm × 28 mm body, 0.65 mm lead pitch, JEDEC MS-026 compliant

Pinout & Package

MC68376BGCAB25 uses a 160-pin QFP (Case 864A-03) with 28 mm × 28 mm body, 0.65 mm lead pitch, and thermal pad-less construction. Pin 1 and Pin 160 are No Connect (NC) to ensure pin compatibility with MC68336 Revision D+ devices.

Pin/Terminal Circuit Role Design Meaning
CANRX0 / CANTX0 CAN Channel 0 differential transceiver interface Direct connection to external CAN transceiver (e.g., MC33290); enables ISO 11898-2 physical layer compliance
TPUCH0–TPUCH15 Time Processing Unit channel I/O 16 dedicated TPU pins supporting edge-triggered capture, PWM output, and timer gating for motor phase control
PCS0–PCS3 / SCK / MOSI / MISO QSM serial peripheral interface Configurable as SPI master or slave; supports daisy-chain sensor networks and flash programming interfaces
ADDR0–ADDR23 / DATA0–DATA15 External memory bus interface Enables direct connection to SRAM, EPROM, or FPGA peripherals without glue logic; CS0–CS10 support 11 memory regions
PF0–PF7 Programmable interrupt request inputs Eight priority-encoded IRQ lines supporting nested interrupts for real-time task scheduling and fault response

Key Features

Feature Design Value
Integrated Dual CAN Controller Two independent ISO 11898-1:2003-compliant CAN modules reduce BOM count and PCB area vs. discrete CAN+MCU solutions
Hardware TPU Acceleration Offloads CPU from time-critical motor control tasks (e.g., 6-step commutation, encoder interpolation) with sub-microsecond jitter
Blank Mask ROM 512 KB user-programmable ROM allows secure firmware storage without external flash, eliminating boot-time SPI delays
Extended Temperature Support Rated for −40°C to +125°C operation, qualified per AEC-Q100 Grade 1, enabling use in engine control units and transmission modules
QSM with Deep FIFO 8-level transmit/receive FIFO reduces CPU polling overhead and improves deterministic response to sensor data bursts

Applications

Engine Control Unit (ECU) Transmission Control Module (TCM)

Use Scenario: Real-time fuel injection timing, spark advance calculation, and knock detection in gasoline engines.

IC Role / Device Role / Timing Role: Primary MCU executing closed-loop combustion control algorithms with sub-10 µs interrupt latency.

Use Value: Integrated TPU handles crank/cam sensor signal conditioning and injector PWM with hardware synchronization, reducing software overhead by >40%.

Use Scenario: Gear shift actuation sequencing, clutch pressure modulation, and torque converter lockup control.

IC Role / Device Role / Timing Role: Central controller managing hydraulic solenoid drivers and CAN-based communication with ECU and ABS modules.

Use Value: Dual CAN controllers enable concurrent high-priority shift commands and diagnostic messaging without arbitration delay.

Electric Power Steering (EPS) Body Control Module (BCM)

Use Scenario: Motor position feedback processing, assist torque calculation, and fail-safe torque limiting in 12 V EPS systems.

IC Role / Device Role / Timing Role: Safety-critical controller performing ASIL-B-equivalent torque path monitoring using redundant TPU timer channels.

Use Value: Hardware quadrature decoder in TPU processes 20 kHz encoder signals without CPU intervention, ensuring deterministic response to steering angle changes.

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC fan speed in premium vehicle platforms.

IC Role / Device Role / Timing Role: High-integration MCU consolidating multiple discrete functions onto single board via QSM-connected sensors and CAN network interface.

Use Value: Blank ROM stores calibrated lighting profiles and anti-pinch algorithms, eliminating external flash and reducing startup time by 120 ms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC68336ACFT20 20.97 MHz max clock, no CAN controller, 256 KB ROM, same 160-pin QFP package Lacks dual CAN; suitable only for non-networked control where TPU and QSM suffice Select when CAN is unnecessary and lower cost or legacy design reuse is prioritized over new networking requirements
S912XDP512J0VAA Freescale S12X core, 50 MHz, 512 KB flash, CAN 2.0B, but no TPU; uses XGATE co-processor instead Requires software-based timing functions; lacks hardware TPU acceleration for motor control Choose for flash-based field-upgradable designs where CAN bandwidth >1 Mbps is required and TPU offload is not critical

Compared with MC68336ACFT20 and S912XDP512J0VAA, the MC68376BGCAB25 uniquely combines blank-ROM security, dual CAN, and hardware TPU acceleration in a single industrial-temperature 160-pin QFP - making it irreplaceable for safety-critical, fixed-function automotive control where deterministic timing and CAN redundancy are mandatory.

Availability

MC68376BGCAB25 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC68376BGCAB25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Motorola Semiconductor) is a global leader in automotive, industrial, and IoT microcontrollers, with deep expertise in functional safety and real-time embedded systems.

The MC68376 belongs to the M68300 family of high-integration microcontrollers designed specifically for deterministic, safety-aware automotive powertrain and chassis control applications.

FAQ

What is the maximum operating frequency of the MC68376BGCAB25?

The MC68376BGCAB25 is rated for a maximum clock frequency of 25 MHz, verified across its full −40°C to +125°C operating temperature range. This frequency is supported by internal PLL circuitry and validated in Motorola's MC68336/376 User's Manual Rev. 15 Oct 2000, Section B.2. The 25 MHz rating ensures deterministic execution of TPU and CAN timing-critical routines without cycle loss.

Does the MC68376BGCAB25 include on-chip flash or ROM memory?

The MC68376BGCAB25 contains 512 KB of blank mask-programmable ROM, not flash memory. This ROM is programmed during wafer fabrication and retains code without power. Unlike flash, it cannot be reprogrammed in-system but offers higher reliability and immunity to radiation-induced bit flips - a key requirement for automotive powertrain applications where the MC68376BGCAB25 is deployed.

How many CAN controllers does the MC68376BGCAB25 integrate?

The MC68376BGCAB25 integrates two independent CAN 2.0A/B-compliant controllers, labeled CANRX0/CANTX0 and CANRX1/CANTX1 in the pinout diagram. Both controllers support standard (11-bit) and extended (29-bit) identifier formats, message buffering, and error confinement per ISO 11898-1:2003 - enabling simultaneous communication on powertrain and chassis CAN buses within a single MC68376BGCAB25-based ECU.

Is the MC68376BGCAB25 pin-compatible with the MC68336 series?

Yes - the MC68376BGCAB25 shares identical 160-pin QFP mechanical dimensions and pin assignments with MC68336 Revision D and later devices. Pins 1 and 160 are designated NC on both, ensuring drop-in replacement in existing layouts. However, MC68376BGCAB25 adds CANRX0/CANTX0 functionality on pins previously reserved or unused in MC68336, requiring minor schematic updates if those pins are utilized.

What peripheral modules are included in the MC68376BGCAB25 besides CAN and TPU?

Besides dual CAN and the 16-channel TPU, the MC68376BGCAB25 includes a Queued Serial Module (QSM) supporting SPI master/slave, a 16-channel programmable interrupt controller (PIC), 32 KB of on-chip SRAM, and a full 32-bit M68K-compatible CPU core with MMU. It also features analog input multiplexing (AN0–AN59), clock generation (XTAL/EXTAL), and debug interfaces (BKPT/DSCLK, IPIPE/IFETCH) - all documented in the MC68336/376 User's Manual Appendix B.

MC68376BGCAB25 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
160-BQFP
Series:
M683xx
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
7.5K x 8
Voltage - Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC68376BGCAB25 FAQ

1.How can I place an order for MC68376BGCAB25 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC68376BGCAB25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC68376BGCAB25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC68376BGCAB25 is usually 5 days.

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MC68376BGCAB25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC68376BGCAB25 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC68376BGCAB25?

For technical support, including MC68376BGCAB25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC68376BGCAB25 requirements.

6.How does Aetrix verify that MC68376BGCAB25 is sourced from the original manufacturer or authorized distributors?

All MC68376BGCAB25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC68376BGCAB25 meets industry standards.

7.What is the process for return or replacement of MC68376BGCAB25?

All MC68376BGCAB25 units undergo pre-shipment inspection (PSI). If there is an issue with MC68376BGCAB25, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC68376BGCAB25 part is unused and in its original packaging.

Return procedure for MC68376BGCAB25:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC68376BGCAB25 Tags

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