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NXP Semiconductors MC68EN302AG25BT

Part No.:
MC68EN302AG25BT
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
144-LQFP
Datasheet:
AetrixMC68EN302AG25BT.pdf
Description:
IC MPU M683XX 25MHZ 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,613

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Product details

Overview

MC68EN302AG25BT from Freescale is an integrated multiprotocol processor combining a 68000-compatible CPU core, three serial communication controllers (SCCs), a full IEEE 802.3-compliant Ethernet controller, DRAM controller, and JTAG debug interface - all in a single 144-pin TQFP package operating at 25 MHz with 5 V supply. It targets embedded networking bridges and ISDN-to-Ethernet routers requiring deterministic real-time protocol handling and glueless DRAM interfacing.

For engineers reviewing the MC68EN302AG25BT datasheet, MC68EN302AG25BT pinout, MC68EN302AG25BT application, or MC68EN302AG25BT equivalent, key selection considerations include its 16-bit Ethernet bus interface, dual 128-byte Tx/Rx FIFOs, 128 on-chip buffer descriptors, IEEE 1149.1 JTAG compliance, and support for up to 8 MB per DRAM bank with programmable refresh timing.

Technical Context

The MC68EN302AG25BT extends the MC68302 architecture with a dedicated Ethernet controller that operates independently of the three legacy SCCs, using two dedicated DMA channels and a dual-port RAM for descriptor management. Its Ethernet protocol core handles full-duplex 10 Mbps operation (20 Mbps in switched mode), automatic collision retransmission, and frame flushing without CPU intervention.

The DRAM controller supports two independent banks with separate RAS/CAS lines, address multiplexing, programmable wait states (zero-wait at 25 MHz with 80 ns DRAM), and hidden refresh - coordinated via the module bus controller, which also manages interrupt routing for Ethernet and DRAM blocks and external bus master arbitration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreMC68000-compatible microcoded core with 68302-style programming model
Ethernet ComplianceFully IEEE 802.3 compliant, supporting 10 Mbps baseband and full-duplex 20 Mbps operation
FIFO DepthSeparate 128-byte transmit and receive FIFOs enabling collision handling without CPU overhead
DRAM SupportTwo-bank controller with 128 KB–8 MB per bank, CAS-before-RAS refresh, and hidden refresh cycles
Package & Speed144-pin low-profile TQFP, rated for 25 MHz operation at 5 V
JTAG InterfaceFully IEEE 1149.1-compliant boundary-scan test and debug capability
Buffer Descriptors128 internal descriptors stored in on-chip dual-port RAM for efficient packet queuing

Pinout & Package

MC68EN302AG25BT is housed in a 144-lead thin quad flat pack (TQFP) with 0.5 mm lead pitch and exposed thermal pad. Pin functions are defined across multiple I/O groups including parallel address/data buses (A23–A1, D15–D0), peripheral control signals (RX/TX/RENA/CLSN/TENA/TCLK), DRAM interface (RAS0/RAS1/CAS0/CAS1/DRAMRW), and JTAG test access (TMS/TCK/TDO/TDI/TRST).

Pin/TerminalCircuit RoleDesign Meaning
RX / TXEthernet physical layer interfaceDifferential pair for 10BASE-T twisted-pair connection via external transceiver (e.g., MC68160)
RENA / TENAEthernet enable controlActive-high enables receiver/transmitter sections independently for power-aware operation
CLSN / TCLK / RCLKEthernet timing and statusCollision detection signal; transmit/receive clock inputs synchronized to external PHY
A23–A1 / D15–D0System address/data bus16-bit data bus with 23-bit addressing; supports dynamic bus sizing for 8-bit peripherals
RAS0/RAS1/CAS0/CAS1DRAM bank controlIndependent row/column address strobes for two 128 KB–8 MB DRAM banks
TMS/TCK/TDO/TDI/TRSTJTAG boundary-scan interfaceIEEE 1149.1-compliant test access port for production testing and debug

Key Features

FeatureDesign Value
Four independent serial interfacesThree legacy SCCs + one dedicated Ethernet channel, enabling concurrent ISDN, HDLC, and LAN protocols
Glueless DRAM interfaceIntegrated controller eliminates external logic for DRAM timing, refresh, and bank switching
Automatic collision handlingEthernet core performs retransmission and FIFO flush during collisions - no CPU or bus cycle penalty
On-chip descriptor RAM1152-byte dual-port RAM stores 128 buffer descriptors, reducing external memory bandwidth demand
Module bus arbitrationHardware-managed bus sharing between internal core, Ethernet, DRAM, and external masters via BG/BGACK/BR

Applications

ISDN-to-Ethernet RouterRemote Dial-in Access Point

Use Scenario: Aggregating ISDN B-channel traffic into Ethernet LANs for branch office connectivity.

IC Role / Device Role / Timing Role: Protocol translation engine with real-time SCC-based ISDN framing and Ethernet MAC-layer packetization.

Use Value: Eliminates need for separate ISDN and Ethernet controllers, reducing BOM count and PCB area while maintaining deterministic latency.

Use Scenario: Embedded dial-up server connecting remote users via PSTN modems to corporate Ethernet networks.

IC Role / Device Role / Timing Role: Dual-role controller managing modem AT command parsing (SCC1) and Ethernet packet forwarding (Ethernet channel).

Use Value: Enables single-chip remote access gateway with hardware-accelerated frame buffering and collision-free transmission.

Low-End Network BridgeIndustrial Communication Controller

Use Scenario: Transparent bridging between legacy RS-485 fieldbus and 10BASE-T Ethernet segments in building automation.

IC Role / Device Role / Timing Role: Store-and-forward bridge with SCC-based serial protocol conversion and Ethernet MAC-layer forwarding.

Use Value: Provides deterministic inter-segment delay (<1 ms) using on-chip dual-port RAM and dedicated DMA paths.

Use Scenario: Central controller in factory-floor PLC systems coordinating sensor data collection over RS-232/485 and uploading to supervisory SCADA servers via Ethernet.

IC Role / Device Role / Timing Role: Real-time I/O concentrator with time-stamped SCC interrupts and Ethernet-based alarm reporting.

Use Value: Synchronizes serial polling intervals with Ethernet transmit scheduling to avoid bus contention and ensure sub-100 ms alarm latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated multiprotocol processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC68302AC25BLacks integrated Ethernet controller and DRAM controller; retains three SCCs and same 25 MHz 68000 coreRequires external Ethernet PHY and DRAM interface logic; suitable only when Ethernet is added via discrete componentsSelect when system already implements Ethernet off-chip and cost-sensitive design favors reuse of existing MC68302 layout
MC68EN360CZP25Successor device with PowerPC 603e core, integrated 10/100 Mbps Ethernet MAC, and PCI interface - not pin-compatibleTargets higher-performance routing with TCP/IP stack acceleration and PCI host interfaceSelect when migrating to higher throughput and software-defined networking, accepting full redesign and toolchain change

Compared with MC68302AC25B, the MC68EN302AG25BT integrates Ethernet and DRAM control to reduce component count and board space, while MC68EN360CZP25 offers architectural advancement at the cost of compatibility - making MC68EN302AG25BT optimal for cost-constrained, fixed-function embedded bridges where legacy 68k toolchains and deterministic SCC timing remain critical.

Availability

MC68EN302AG25BT is available at Aetrix Electronics and suitable for low-end network bridges, ISDN-to-Ethernet routers, and industrial communication controllers requiring stable component supply and long-term obsolescence management.

Supply support for MC68EN302AG25BT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog/mixed-signal ICs for automotive, industrial, and networking applications.

The MC68EN302AG25BT belongs to Freescale's 68k-based Integrated Multiprotocol Processor family, engineered specifically for cost-sensitive, real-time embedded networking systems requiring protocol flexibility without external glue logic.

FAQ

What is the maximum Ethernet data rate supported by the MC68EN302AG25BT?

The MC68EN302AG25BT supports IEEE 802.3-compliant 10 Mbps baseband Ethernet operation. In full-duplex (switched) mode, it achieves 20 Mbps aggregate throughput - 10 Mbps transmit and 10 Mbps receive simultaneously - with no CPU overhead due to autonomous collision handling and dual 128-byte FIFOs. This is confirmed in the Ethernet Features section of the official product brief.

Does the MC68EN302AG25BT include an on-chip DRAM controller, and what are its key capabilities?

Yes, the MC68EN302AG25BT integrates a DRAM controller derived from the MC68306, supporting two independent banks with separate RAS/CAS lines, address multiplexing, programmable wait states (zero-wait achievable with 80 ns DRAM at 25 MHz), and hidden refresh cycles. Each bank is configurable from 128 KB to 8 MB, and write protection is programmable - eliminating need for external DRAM interface logic.

How many serial communication channels does the MC68EN302AG25BT provide, and what types are they?

The MC68EN302AG25BT provides four serial communication channels: three fully compatible Serial Communication Controllers (SCCs) inherited from the MC68302, plus one dedicated Ethernet channel. The SCCs support protocols including HDLC, SDLC, UART, and bisync, while the Ethernet channel implements full IEEE 802.3 MAC-layer functionality - enabling simultaneous ISDN, modem, and LAN connectivity in a single chip.

Is the MC68EN302AG25BT pin-compatible with the standard MC68302 series?

No, the MC68EN302AG25BT is not pin-compatible with the MC68302. It uses a 144-pin TQFP package versus the MC68302's 132-pin PQFP, and introduces new pins for Ethernet (RX/TX/RENA/CLSN/TENA/TCLK), DRAM control (RAS0/RAS1/CAS0/CAS1/DRAMRW), and JTAG (TMS/TCK/TDO/TDI/TRST). Layout redesign is required when upgrading from MC68302 to MC68EN302AG25BT.

What debug and test capabilities does the MC68EN302AG25BT offer?

The MC68EN302AG25BT includes full IEEE 1149.1 JTAG boundary-scan support via dedicated TMS, TCK, TDO, TDI, and TRST pins. This enables production-level structural testing, in-circuit debugging, and emulation without requiring additional probe points. The JTAG module is functionally identical to that in the MC68302 but extended to cover newly added Ethernet and DRAM logic blocks - verified in the Module Bus Controller and Testing sections of the product brief.

MC68EN302AG25BT Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
M683xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10Mbps (1)
SATA:
-
USB:
-
Voltage - I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20x20)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI

MC68EN302AG25BT FAQ

1.How can I place an order for MC68EN302AG25BT through Aetrix?

Please submit a Request for Quotation (RFQ) for MC68EN302AG25BT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC68EN302AG25BT reliable?

The price and inventory of MC68EN302AG25BT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC68EN302AG25BT is usually 5 days.

3.What payment methods are accepted for MC68EN302AG25BT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC68EN302AG25BT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC68EN302AG25BT?

MC68EN302AG25BT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC68EN302AG25BT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC68EN302AG25BT?

For technical support, including MC68EN302AG25BT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC68EN302AG25BT requirements.

6.How does Aetrix verify that MC68EN302AG25BT is sourced from the original manufacturer or authorized distributors?

All MC68EN302AG25BT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC68EN302AG25BT meets industry standards.

7.What is the process for return or replacement of MC68EN302AG25BT?

All MC68EN302AG25BT units undergo pre-shipment inspection (PSI). If there is an issue with MC68EN302AG25BT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC68EN302AG25BT part is unused and in its original packaging.

Return procedure for MC68EN302AG25BT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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