NXP Semiconductors MC7447AHX1000NB
- Part No.:
- MC7447AHX1000NB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MC7447AHX1000NB.pdf
- Description:
- IC MPU MPC74XX 1.0GHZ 360FCCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,946
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC7447AHX1000NB from Freescale Semiconductor is a 1000 MHz PowerPC G4 RISC microprocessor with 32-Kbyte L1 instruction and data caches, 512-Kbyte unified on-die L2 cache, and integrated AltiVec SIMD engine. It implements the full 32-bit PowerPC architecture and targets high-performance networking and embedded computing systems requiring deterministic real-time processing and IEEE 754-compliant floating-point computation.
For engineers reviewing the MC7447AHX1000NB datasheet, MC7447AHX1000NB pinout, MC7447AHX1000NB application, or MC7447AHX1000NB equivalent, key selection considerations include its 1.3 V core supply, 360-ball ceramic BGA (HCTE) package, dynamic frequency switching (DFS), on-die temperature diode, and support for both 1.8 V and 2.5 V I/O bus operation.
Technical Context
The MC7447AHX1000NB features a seven-stage superscalar pipeline with up to 16 in-flight instructions, eleven independent execution units (including four integer, five vector, and one FPU), and hardware-enforced MESI cache coherency for multiprocessor systems. Its memory subsystem supports MPX and subset 60x bus protocols, with 9-cycle L1 miss latency on L2 hit and 256-bit L2-to-L1 interface bandwidth.
It integrates dual MMUs (128-entry 2-way TLBs), JTAG/COP debug interface, performance monitor unit, and three power-saving modes (Nap, Sleep, Deep Sleep). Dynamic Frequency Switching enables software-controlled halving of core frequency to reduce power, while the on-die temperature diode provides thermal monitoring without external sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 1000 MHz - Fixed maximum operating frequency for this speed grade; requires 1.3 V ±50 mV core supply. |
| L1 Cache | 32-Kbyte instruction + 32-Kbyte data - Eight-way set-associative Harvard architecture with PLRU replacement and hardware parity per word/byte. |
| L2 Cache | 512-Kbyte unified - On-die, eight-way set-associative, 64-byte line size, parity-protected, fully pipelined 256-bit interface to L1. |
| Process Technology | 0.13-μm CMOS - Nine-metal-layer fabrication enabling 48.6 million transistors in 8.51 mm × 9.86 mm die. |
| Power Consumption | 16.0 W typical (Full-Power Mode) - Measured at 1000 MHz, 65°C, Dhrystone 2.1; includes only VDD, excludes OVDD/AVDD. |
| Thermal Resistance | RθJA = 26 °C/W (natural convection, 1s board) - Defines maximum allowable ambient temperature for 105°C junction limit under specified PCB layout. |
| I/O Voltage Support | 1.8 V or 2.5 V - Selected via BVSEL pin at HRESET negation; determines input thresholds and output swing range. |
Pinout & Package
MC7447AHX1000NB uses a surface-mount 360-ball ceramic ball grid array (HCTE) package compliant with RoHS. The package supports thermal dissipation via soldered bottom-side thermal pad and is designed for high-speed signal integrity in multi-layer PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Balls A1–A10, C1–C10, E1–E10) | Core Power Supply | 1.3 V ±50 mV DC input; must be decoupled locally; exceeds OVDD by ≤1.0 V during normal operation. |
| OVDD (Balls D1–D10, F1–F10) | I/O Power Supply | 1.8 V ±5% or 2.5 V ±5% - Sets bus voltage level and input/output thresholds; referenced by all processor bus signals. |
| AVDD (Ball B11) | PLL Power Supply | 1.3 V ±50 mV filtered input to PLL; separate from VDD to minimize jitter; requires dedicated low-noise filtering per Section 9.2. |
| BVSEL (Ball A12) | Bus Voltage Select | Configures I/O voltage mode at HRESET negation: logic 0 → 1.8 V mode; logic 1 or HRESET → 2.5 V mode. |
| THERM (Ball C12) | Temperature Diode Anode | Analog output of on-die thermal diode; used with external current source to measure junction temperature. |
| DFS[0:1] (Balls D12, E12) | Dynamic Frequency Switching Control | Two-bit input selecting core frequency multiplier ratio; enables software-triggered halving of core clock to reduce power. |
Key Features
| Feature | Design Value |
|---|---|
| AltiVec SIMD Engine | Four vector units (VIU1/VIU2/VFPU/VPU) with 32-entry VR file - Enables parallel integer/floating-point operations for media, signal, and packet processing acceleration. |
| Branch Prediction | 128-entry BTIC + 2048-entry BHT + 8-entry link stack - Reduces misprediction penalty to 6 cycles minimum; BTIC hit delivers first 4 target instructions one cycle earlier. |
| Cache Coherency | Hardware-enforced MESI protocol - Maintains data consistency across multiple MPC7447AHX1000NB processors without software intervention. |
| Power Management | Three-tier low-power states (Nap/Sleep/Deep Sleep) + DFS - Nap halts instruction fetch but retains bus snooping; Deep Sleep disables PLL and SYSCLK for lowest static power. |
| Debug & Test | IEEE 1149.1 JTAG + COP interface + ABIST - Supports boundary-scan testing, in-circuit debugging, and factory structural test without external probes. |
Applications
| Telecom Baseband Processing | Industrial Real-Time Controller |
|---|---|
Use Scenario: Packet classification, QoS enforcement, and encryption/decryption in carrier-grade routers and switches. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based control plane and data plane forwarding logic with AltiVec-accelerated crypto routines. Use Value: 1000 MHz core + 512-Kbyte L2 enables >2 Gbps wire-speed packet processing with sub-10 μs interrupt latency and deterministic cache behavior. |
Use Scenario: Motion control, CNC coordination, and safety-critical PLC logic in factory automation systems. IC Role / Device Role / Timing Role: Deterministic real-time host CPU managing servo loops, fieldbus interfaces (e.g., CANopen, EtherCAT), and HMI rendering. Use Value: Seven-stage pipeline with precise exception model ensures bounded worst-case execution time; temperature diode enables runtime thermal derating for reliability. |
| Avionics Display System | Medical Imaging Workstation |
Use Scenario: High-resolution synthetic vision, terrain mapping, and sensor fusion in certified cockpit displays. IC Role / Device Role / Timing Role: Safety-certifiable compute engine running DO-178B Level A software with dual-redundant memory controllers and ECC-capable caches. Use Value: Parity-protected L1/L2 caches and system bus, plus JTAG/COP trace capability, satisfy avionics certification requirements for fault detection and diagnostics. |
Use Scenario: DICOM image reconstruction, 3D volume rendering, and real-time ultrasound beamforming. IC Role / Device Role / Timing Role: High-throughput vector processor offloading GPU-like workloads from main CPU using AltiVec-optimized FFT and convolution kernels. Use Value: 128-bit VR load/store + 256-bit L2 interface sustains >12 GB/s memory bandwidth for pixel pipeline throughput; DFS reduces heat in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7447AHX1267NB | Higher-frequency variant (1267 MHz); identical architecture, package, and pinout; requires same 1.3 V core supply. | Delivers ~27% higher Dhrystone MIPS in compute-bound tasks; increases power to 18.3 W typical; demands enhanced thermal management. | Select when application requires higher single-thread throughput and board-level cooling supports 26 °C/W RθJA margin. |
| MPC7447AHX1333NB | 1333 MHz speed grade; same L1/L2 cache sizes, AltiVec implementation, and DFS/thermal diode features; validated for same HCTE footprint. | Enables tighter real-time deadlines in control loops; increases L2 hit latency sensitivity due to higher clock skew constraints on MPX bus timing. | Choose for latency-critical deterministic systems where 1333 MHz timing closure is verified on target PCB stackup and bus controller. |
Compared with MC7447AHX1000NB, the 1267 MHz and 1333 MHz alternatives offer linear performance scaling within identical thermal and electrical envelopes, but require revalidation of bus timing margins, power delivery stability, and junction temperature under worst-case workload conditions.
Availability
MC7447AHX1000NB is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, avionics display, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for MC7447AHX1000NB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC7447A product line was designed as a high-performance, thermally efficient PowerPC G4 upgrade for legacy MPC74xx-based systems, emphasizing backward compatibility, AltiVec acceleration, and robust power management for fanless embedded deployments.
FAQ
What is the core voltage requirement for stable operation of the MC7447AHX1000NB?
The MC7447AHX1000NB requires a nominal core supply of 1.3 V ±50 mV DC. Operation outside this range-especially exceeding 1.35 V or dropping below 1.25 V-may cause timing violations or functional failure. Derated operation at 1.2 V is supported only with corresponding frequency reduction per Section 5.3 of the hardware specifications.
Does the MC7447AHX1000NB support pin-compatible replacement of earlier MPC7447 variants?
Yes, the MC7447AHX1000NB is a footprint-compatible, drop-in replacement for the MPC7447 in applications using a 1.3 V core supply. It adds Dynamic Frequency Switching and an on-die temperature diode but maintains identical pinout, electrical signaling, and register-level compatibility with the MPC7447 per Freescale documentation Rev. 5.
How does the Dynamic Frequency Switching (DFS) feature function in the MC7447AHX1000NB?
The MC7447AHX1000NB implements DFS via two dedicated control pins (DFS[0:1]) that allow software to halve the core frequency-from 1000 MHz to 500 MHz-without resetting the processor. This reduces dynamic power by ~75% and junction temperature, enabling thermal throttling in enclosed or passive-cooled systems while maintaining full register state and cache coherency.
What thermal management features are integrated into the MC7447AHX1000NB?
The MC7447AHX1000NB includes an on-die temperature diode (THERM pin), Dynamic Frequency Switching, and three hardware power states (Nap, Sleep, Deep Sleep). These enable closed-loop thermal control: the diode provides real-time junction temperature feedback, DFS lowers frequency under thermal stress, and Deep Sleep disables the PLL to minimize leakage current when idle.
Can the MC7447AHX1000NB operate with both 1.8 V and 2.5 V I/O buses?
Yes, the MC7447AHX1000NB supports dual I/O voltage modes. The BVSEL pin selects between 1.8 V and 2.5 V operation at HRESET negation. When BVSEL = 0, OVDD must be 1.8 V ±5%; when BVSEL = 1 or tied to HRESET, OVDD must be 2.5 V ±5%. Input thresholds and output drive strength scale accordingly per Table 3 in the hardware specifications.
MC7447AHX1000NB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCCBGA (25x25)
- Additional Interfaces:
- -
MC7447AHX1000NB FAQ
1.How can I place an order for MC7447AHX1000NB through Aetrix?
Please submit a Request for Quotation (RFQ) for MC7447AHX1000NB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC7447AHX1000NB reliable?
The price and inventory of MC7447AHX1000NB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447AHX1000NB is usually 5 days.
3.What payment methods are accepted for MC7447AHX1000NB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7447AHX1000NB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC7447AHX1000NB?
MC7447AHX1000NB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC7447AHX1000NB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC7447AHX1000NB?
For technical support, including MC7447AHX1000NB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447AHX1000NB requirements.
6.How does Aetrix verify that MC7447AHX1000NB is sourced from the original manufacturer or authorized distributors?
All MC7447AHX1000NB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447AHX1000NB meets industry standards.
7.What is the process for return or replacement of MC7447AHX1000NB?
All MC7447AHX1000NB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447AHX1000NB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC7447AHX1000NB part is unused and in its original packaging.
Return procedure for MC7447AHX1000NB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC7447AHX1000NB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
