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NXP Semiconductors MC7447AHX1167NB
- Part No.:
- MC7447AHX1167NB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MC7447AHX1167NB.pdf
- Description:
- IC MPU MPC74XX 1.167GHZ 360BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,406
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Product details
Overview
MC7447AHX1167NB from Freescale Semiconductor is a 32-bit PowerPC G4 RISC microprocessor with a 512-Kbyte unified L2 cache, 1.3 V core supply, and 1167 MHz core frequency. It integrates a superscalar core with dual-precision FPU, AltiVec SIMD unit, and hardware-enforced MESI coherency-designed for high-performance networking and embedded computing systems.
For engineers reviewing the MC7447AHX1167NB datasheet, MC7447AHX1167NB pinout, MC7447AHX1167NB application, or MC7447AHX1167NB equivalent, key selection criteria include its 1167 MHz operation at 1.3 V ±50 mV, DFS-enabled dynamic frequency switching, integrated temperature diode, and HCTE 360-ball ceramic BGA package compatibility with MPC7447 designs.
Technical Context
The MC7447AHX1167NB implements the full PowerPC 32-bit architecture with a seven-stage pipeline, supporting up to three instructions per cycle dispatch and 16 simultaneous in-flight instructions. Its memory subsystem uses MPX bus protocol and includes separate 32-Kbyte L1 instruction and data caches with PLRU replacement and hardware MESI coherency.
It features dual MMUs (128-entry 2-way TLBs), 512-Kbyte unified L2 cache with 9-cycle L1 miss latency, and dynamic frequency switching that halves core frequency under software control. The processor supports both big- and little-endian modes, JTAG/COP debug interface, and thermal management via on-die temperature diode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 1167 MHz - delivers deterministic real-time throughput for telecom control plane and packet processing |
| Core Supply Voltage | 1.3 V ±50 mV - enables stable operation at rated speed with defined derating path to 1.2 V |
| L2 Cache Size | 512-Kbyte unified - reduces external memory bandwidth demand in network forwarding applications |
| Package Type | HCTE 360-ball ceramic BGA - RoHS-compliant surface-mount package with 1.27 mm pitch and thermal performance optimized for convection cooling |
| Thermal Diode | Integrated - provides direct die-junction temperature monitoring without external sensors |
| Dynamic Frequency Switching | Software-controllable halving of core clock - reduces power by ~40% in Nap/Sleep modes while retaining state |
| Process Technology | 0.13-μm CMOS, nine-layer metal - balances performance, leakage, and thermal density for embedded compute |
Pinout & Package
The MC7447AHX1167NB is housed in a surface-mount 360-ball ceramic ball grid array (HCTE) package with 1.27 mm ball pitch and thermal pad on underside. Pin assignments follow the MPC7447A standard layout per Freescale Document MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BVSEL | Bus Voltage Select | Determines I/O voltage mode (1.8 V or 2.5 V) sampled at HRESET negation; critical for system-level voltage domain alignment |
| HRESET | Hardware Reset Input | Asynchronous active-low reset that initializes all internal logic, PLL, and cache controllers |
| CLKIN | System Clock Input | Accepts differential or single-ended SYSCLK reference; feeds PLL to generate 1167 MHz core clock |
| VDD / AVDD | Core & PLL Power | 1.3 V ±50 mV supplies; AVDD filtered separately to minimize PLL jitter; must not exceed OVDD by >1.0 V |
| OVDD | I/O Power Supply | 1.8 V ±5% or 2.5 V ±5% - sets output swing and input thresholds for all processor bus signals |
| TMS / TCK / TDI / TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for in-system verification, debug, and manufacturing test |
Key Features
| Feature | Design Value |
|---|---|
| Superscalar Execution | Up to 3 instructions dispatched/cycle with 16-entry completion queue - sustains high IPC in control-intensive workloads |
| AltiVec SIMD Engine | Four vector units (VIU1/VIU2/VFPU/VPU) with 32-entry VR file - accelerates media encoding, signal processing, and crypto operations |
| L1 Cache Architecture | Separate 32-Kbyte 8-way set-associative I/D caches with parity, lockable ways, and critical-word forwarding - minimizes instruction fetch stalls and data access latency |
| DFS + Thermal Diode | Runtime core frequency halving + on-die temperature sensing - enables closed-loop thermal management without external components |
| Multiprocessing Support | Hardware MESI coherency, load/store-with-reservation, and atomic semaphore primitives - simplifies dual-CPU board design and OS scheduler integration |
Applications
| Telecom Control Plane | Industrial Real-Time Controller |
|---|---|
Use Scenario: Managing call setup, routing tables, and protocol stacks in carrier-grade routers and media gateways. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based control software with deterministic interrupt response. Use Value: 1167 MHz core + 512-Kbyte L2 enables sub-millisecond route table lookups and concurrent SIP/SS7 stack execution. | Use Scenario: Running motion control algorithms and safety-critical PLC logic in CNC machines and robotics. IC Role / Device Role / Timing Role: Deterministic real-time CPU with hardware timer support and JTAG debug for certification traceability. Use Value: Integrated temperature diode and DFS allow runtime thermal throttling without violating hard real-time deadlines. |
| Secure Network Appliance | High-End Embedded Visualization |
Use Scenario: Accelerating IPsec encryption/decryption and deep packet inspection in firewall appliances. IC Role / Device Role / Timing Role: Host processor offloading crypto to AltiVec units while managing network interfaces and policy engine. Use Value: Vector permute and integer multiply-add units deliver >2× throughput over scalar-only implementations for AES and SHA-1. | Use Scenario: Rendering 3D HMI graphics and video overlays in medical imaging and avionics displays. IC Role / Device Role / Timing Role: Graphics co-processor companion with high-bandwidth L2-to-memory subsystem and big/little-endian flexibility. Use Value: 256-bit L2 bus interface and 32-byte cache lines sustain >1.2 GB/s memory bandwidth for texture streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7447AHX1333B | 1333 MHz core, same 1.3 V supply and HCTE package - higher frequency bin with identical feature set | Requires tighter thermal design and higher-power PCB layout; suitable where latency-bound tasks dominate | Select when benchmarked workload shows >12% IPC gain at 1333 MHz and thermal margin permits |
| MPC7448AHX1200B | 1200 MHz core, adds double-precision FPU enhancements and improved L2 prefetch - same 0.13-μm process and pinout | Offers better floating-point throughput for radar signal processing but lacks DFS in early revisions | Prefer for math-intensive applications where thermal diode is secondary to computational accuracy |
Compared with MC7447AHX1167NB, the MPC7447AHX1333B delivers higher deterministic throughput at increased power and thermal cost, while the MPC7448AHX1200B trades DFS for enhanced FPU precision-making MC7447AHX1167NB optimal for thermally constrained, latency-sensitive control-plane deployments.
Availability
MC7447AHX1167NB is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and secure network appliance designs requiring stable component supply across extended product lifecycles.
Supply support for MC7447AHX1167NB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015.
The MPC7447A product line was developed for high-reliability, high-performance embedded computing in networking and industrial systems-emphasizing thermal resilience, debuggability, and long-term supply stability.
FAQ
What is the maximum operating junction temperature for MC7447AHX1167NB?
The MC7447AHX1167NB has a maximum tested junction temperature of 105°C under recommended operating conditions. This limit applies during full-power operation at 1167 MHz and 1.3 V core supply. Thermal design must ensure RθJA ≤ 26°C/W on single-layer boards or ≤16°C/W with 200 ft/min airflow to maintain reliability within specification.
Does MC7447AHX1167NB support pin-compatible replacement for MPC7447 designs?
Yes, MC7447AHX1167NB is a footprint-compatible, drop-in replacement for MPC7447 applications when the core power supply is 1.3 V. It retains identical pinout, package dimensions, and electrical interface-adding DFS and temperature diode without requiring PCB changes.
What bus protocols does MC7447AHX1167NB implement?
MC7447AHX1167NB implements the MPX bus protocol for main memory and system resource interfacing, along with a subset of the 60x bus protocol. It does not support PCI Express, AMBA, or AXI; interface design must adhere to Freescale's MPX timing and signaling requirements as defined in the hardware specifications document.
How does Dynamic Frequency Switching (DFS) operate in MC7447AHX1167NB?
DFS in MC7447AHX1167NB allows software to halve the core frequency (e.g., from 1167 MHz to 583.5 MHz) while preserving register state and cache contents. It is implemented via PLL_CFG[0:4] register writes and requires no external hardware changes-enabling immediate power reduction in Nap or Sleep modes without system reset.
Is MC7447AHX1167NB RoHS-compliant?
Yes, MC7447AHX1167NB is supplied in a RoHS-compliant 360-ball ceramic BGA (HCTE) package. Freescale documentation explicitly lists "Surface mount RoHS-compliant 360 ceramic ball grid array (HCTE)" as one of the qualified package variants for the MPC7447A family.
MC7447AHX1167NB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.167GHZ
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCCBGA (25x25)
- Additional Interfaces:
- -
MC7447AHX1167NB FAQ
1.How can I place an order for MC7447AHX1167NB through Aetrix?
Please submit a Request for Quotation (RFQ) for MC7447AHX1167NB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC7447AHX1167NB reliable?
The price and inventory of MC7447AHX1167NB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447AHX1167NB is usually 5 days.
3.What payment methods are accepted for MC7447AHX1167NB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7447AHX1167NB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC7447AHX1167NB?
MC7447AHX1167NB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC7447AHX1167NB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC7447AHX1167NB?
For technical support, including MC7447AHX1167NB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447AHX1167NB requirements.
6.How does Aetrix verify that MC7447AHX1167NB is sourced from the original manufacturer or authorized distributors?
All MC7447AHX1167NB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447AHX1167NB meets industry standards.
7.What is the process for return or replacement of MC7447AHX1167NB?
All MC7447AHX1167NB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447AHX1167NB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC7447AHX1167NB part is unused and in its original packaging.
Return procedure for MC7447AHX1167NB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC7447AHX1167NB Tags
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