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NXP Semiconductors MC7447AHX1333LB

Part No.:
MC7447AHX1333LB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
360-BCBGA, FCCBGA
Datasheet:
AetrixMC7447AHX1333LB.pdf
Description:
IC MPU MPC74XX 1.333GHZ 360BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,929

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Product details

Overview

MC7447AHX1333LB from Freescale Semiconductor is a 1333 MHz PowerPC G4 RISC microprocessor implementing the full 32-bit PowerPC architecture, featuring a superscalar core with double-precision FPU and AltiVec SIMD unit, 32-Kbyte L1 instruction/data caches, and an integrated 512-Kbyte unified L2 cache - deployed in high-performance networking and embedded computing systems.

For engineers reviewing the MC7447AHX1333LB datasheet, MC7447AHX1333LB pinout, MC7447AHX1333LB application, or MC7447AHX1333LB equivalent, key selection criteria include confirmed 1333 MHz core frequency at 1.3 V ±50 mV, 360-ball ceramic BGA (HCTE) package, DFS-enabled dynamic power management, temperature diode integration, and MPX/60x bus protocol support for system memory interfacing.

Technical Context

The MC7447AHX1333LB implements a seven-stage pipeline with up to three-issue dispatch (FIQ/VIQ/GIQ), 16-entry completion queue, and hardware-enforced MESI coherency for multiprocessor systems. Its memory subsystem supports both big- and little-endian modes, 4-Kbyte page translation via 128-entry dual TLBs, and programmable write-back/write-through caching per page or block.

It integrates dedicated execution units: four integer units (three identical SFX + one multifunction IU2), five-stage IEEE 754-compliant FPU, four vector units (VIU1/VIU2/VFPU/VPU), and a branch processing unit with 128-entry BTIC and 2048-entry BHT - enabling up to 16 instructions in flight and single-cycle throughput for most scalar operations.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency 1333 MHz - guaranteed maximum operating frequency at 1.3 V ±50 mV nominal core supply
L1 Cache 32-Kbyte instruction + 32-Kbyte data, 8-way set-associative, physically indexed with PLRU replacement
L2 Cache 512-Kbyte unified, 8-way set-associative, 64-byte line size, parity-protected, fully pipelined at 32 bytes/cycle
Power Modes Nap, Sleep, Deep Sleep - with DFS enabling software-controlled halving of core frequency to reduce power
Thermal Diode Integrated on-die temperature sensor - enables real-time thermal monitoring without external components
Bus Interface MPX protocol + subset of 60x protocol - supports coherent memory-mapped I/O and system resource access
Process Technology 0.13-μm CMOS, nine-layer metal - delivers 48.6 million transistors in 8.51 mm × 9.86 mm die

Pinout & Package

MC7447AHX1333LB is housed in a surface-mount 360-ball ceramic ball grid array (HCTE) package compliant with RoHS. The package supports 1.3 V core and 1.8 V / 2.5 V I/O supplies, with thermal resistance RθJA = 26°C/W (natural convection, 1s board).

Pin/Terminal Circuit Role Design Meaning
BVSEL Bus Voltage Select Determines I/O voltage threshold: logic 0 → 1.8 V mode; logic 1 or HRESET → 2.5 V mode
HRESET Hardware Reset Input Asynchronous active-low reset that initializes processor state and samples BVSEL at negation
CLKIN System Clock Input Accepts differential SYSCLK reference; core frequency derived via PLL_CFG[0:4] multiplier settings
TMS/TDI/TDO/TRST JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port for in-system debug, programming, and structural testing
VDD / AVDD / OVDD Power Supply Terminals Separate 1.3 V core (VDD/AVDD) and selectable 1.8 V or 2.5 V I/O (OVDD) rails - decoupling critical for signal integrity

Key Features

Feature Design Value
Dynamic Frequency Switching (DFS) Software-triggered halving of core clock - reduces power consumption while maintaining architectural compatibility
AltiVec SIMD Engine Four dedicated vector units (VIU1/VIU2/VFPU/VPU) supporting 128-bit parallel integer/floating-point operations
Branch Prediction 128-entry BTIC + 2048-entry BHT + 8-entry link stack - minimizes misprediction penalty to 6 cycles
L2 Cache Coherency Hardware-enforced MESI protocol - enables cache-coherent multiprocessing without software intervention
Memory Management Dual MMUs with 128-entry 2-way TLBs, 52-bit virtual addressing, and hardware/software page table walk

Applications

Network Router Control Plane Industrial Real-Time Controller

Use Scenario: High-throughput packet classification and forwarding policy enforcement in Layer 3 routing platforms.

IC Role / Device Role / Timing Role: Primary control-plane processor executing Linux-based routing stacks with deterministic interrupt latency.

Use Value: 1333 MHz core + AltiVec acceleration enables >2.3 Dhrystone MIPs/MHz performance while sustaining 9-cycle L1 miss/L2 hit latency for cache-resident code.

Use Scenario: Deterministic motion control in CNC machines requiring synchronized multi-axis trajectory computation.

IC Role / Device Role / Timing Role: Real-time host controller managing servo drives via MPX-bus peripherals and time-base counter interrupts.

Use Value: Integrated time base counter/decrementer and DFS allow precise jitter control and thermal-aware frequency scaling during sustained compute loads.

Secure Communications Gateway Avionics Data Concentrator

Use Scenario: Cryptographic offload and secure tunnel termination in IPsec/SSL gateways with hardware-accelerated crypto coprocessors.

IC Role / Device Role / Timing Role: Trusted execution environment host for cryptographic libraries leveraging AltiVec parallelism and L2 cache lock-down.

Use Value: 512-Kbyte unified L2 cache with per-page write-back/write-through control ensures predictable timing for security-critical memory accesses.

Use Scenario: ARINC 653-compliant partitioned data acquisition and bus bridging in flight control systems.

IC Role / Device Role / Timing Role: Safety-certifiable processor executing DO-254/DO-178B partitions with JTAG debug and ABIST factory test coverage.

Use Value: IEEE 1149.1 boundary-scan and LSSD scan design enable full structural testability required for avionics certification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC7447EC No DFS or temperature diode; same 1333 MHz speed grade and 360-ball HCTE package Lacks runtime thermal monitoring and dynamic power scaling - suitable only for fixed-frequency, thermally stable environments Select when DFS and thermal diode are unnecessary and cost sensitivity outweighs feature flexibility
MPC7447AEC Identical architecture and pinout; differs only in ordering suffix - MC7447AHX1333LB is the 1333 MHz speed-binned variant of MPC7447AEC No functional difference - both share identical electrical, thermal, and timing specifications per Rev. 5 datasheet MC7447AHX1333LB and MPC7447AEC are functionally interchangeable; use MC7447AHX1333LB when 1333 MHz binning is explicitly required

Compared with MPC7447EC, MC7447AHX1333LB adds DFS and thermal diode for adaptive power/thermal management; compared with MPC7447AEC, it specifies the exact 1333 MHz speed grade - making it optimal for designs requiring guaranteed frequency headroom and runtime thermal awareness.

Availability

MC7447AHX1333LB is available at Aetrix Electronics and suitable for network infrastructure, industrial automation, and aerospace computing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing of legacy PowerPC solutions.

Supply support for MC7447AHX1333LB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC7447A product line was engineered for high-performance embedded computing - delivering G4 PowerPC architecture with enhanced L2 cache, DFS, and thermal sensing to extend viability in demanding networking and control applications.

FAQ

What is the maximum guaranteed operating frequency of the MC7447AHX1333LB?

The MC7447AHX1333LB is speed-binned and guaranteed to operate at 1333 MHz under nominal conditions (1.3 V ±50 mV core supply, junction temperature ≤105°C). This rating is validated per Freescale's Rev. 5 hardware specifications and reflects tested AC timing compliance at this frequency - not a typical or average value.

Does the MC7447AHX1333LB support dynamic voltage scaling in addition to Dynamic Frequency Switching?

The MC7447AHX1333LB supports voltage derating per Section 5.3 of its hardware specification: core voltage may be reduced to 1.2 V ±50 mV to lower power, but only if corresponding frequency constraints are observed. However, MC7447AHX1333LB does not implement closed-loop dynamic voltage scaling - voltage changes require system-level reconfiguration, not autonomous on-die regulation.

Is the MC7447AHX1333LB pin-compatible with the MPC7447 series?

Yes - the MC7447AHX1333LB uses the same 360-ball HCTE package and pinout as the MPC7447, MPC7447AEC, and MPC7447EC. Freescale explicitly states it is a "footprint-compatible, drop-in replacement" in MPC7447 applications when supplied with 1.3 V core voltage, confirming mechanical and electrical pin equivalence.

What thermal management features are integrated into the MC7447AHX1333LB?

The MC7447AHX1333LB integrates two key thermal features: a calibrated on-die temperature diode for real-time junction temperature monitoring, and Dynamic Frequency Switching (DFS) to halve core frequency under thermal stress. These work in tandem - software reads the diode output and triggers DFS to maintain safe Tj ≤105°C without external thermal sensors or hardware throttling circuits.

Can the MC7447AHX1333LB execute little-endian code, and how is endianness configured?

Yes - the MC7447AHX1333LB supports both big- and little-endian operation, including misaligned little-endian accesses. Endianness is controlled dynamically via the MSR[LE] bit in the Machine State Register, allowing runtime switching between modes without reset. The processor boots in big-endian mode by default, but firmware or OS can enable little-endian execution transparently.

MC7447AHX1333LB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
360-BCBGA, FCCBGA
Series:
MPC74xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Multimedia; SIMD
RAM Controllers:
-
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
360-FCCBGA (25x25)
Additional Interfaces:
-

MC7447AHX1333LB FAQ

1.How can I place an order for MC7447AHX1333LB through Aetrix?

Please submit a Request for Quotation (RFQ) for MC7447AHX1333LB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC7447AHX1333LB reliable?

The price and inventory of MC7447AHX1333LB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447AHX1333LB is usually 5 days.

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MC7447AHX1333LB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC7447AHX1333LB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC7447AHX1333LB?

For technical support, including MC7447AHX1333LB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447AHX1333LB requirements.

6.How does Aetrix verify that MC7447AHX1333LB is sourced from the original manufacturer or authorized distributors?

All MC7447AHX1333LB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447AHX1333LB meets industry standards.

7.What is the process for return or replacement of MC7447AHX1333LB?

All MC7447AHX1333LB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447AHX1333LB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC7447AHX1333LB part is unused and in its original packaging.

Return procedure for MC7447AHX1333LB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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