NXP Semiconductors MC7447AHX600NB
- Part No.:
- MC7447AHX600NB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MC7447AHX600NB.pdf
- Description:
- IC MPU MPC74XX 600MHZ 360FCCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC7447AHX600NB from Freescale Semiconductor is a 600 MHz PowerPC G4 RISC microprocessor implementing the full 32-bit PowerPC architecture with integrated 512-Kbyte unified L2 cache, superscalar 7-stage pipeline, and AltiVec™ SIMD engine. It delivers up to three instructions per clock cycle and targets high-performance embedded networking and computing systems requiring deterministic real-time processing and IEEE 754-compliant floating-point computation.
For engineers reviewing the MC7447AHX600NB datasheet, MC7447AHX600NB pinout, MC7447AHX600NB application, or MC7447AHX600NB equivalent, key selection considerations include its 1.3 V core supply requirement, 360-ball ceramic BGA (HCTE) package, dynamic frequency switching (DFS) capability, temperature diode integration, and compatibility with MPX/60x bus protocols for system-level memory and I/O interfacing.
Technical Context
The MC7447AHX600NB implements a fully static, 0.13-μm CMOS design with eleven independent execution units-including four integer units, five-stage FPU, and four vector units-and separate instruction/data MMUs with 128-entry two-way set-associative TLBs. Its Harvard L1 cache subsystem features 32-Kbyte 8-way set-associative instruction and data caches with hardware MESI coherency and critical double/quad-word forwarding.
It supports dynamic frequency switching (DFS) to halve core frequency under software control, three low-power states (Nap, Sleep, Deep Sleep), JTAG/COP debug interface, and on-die thermal diode for junction temperature monitoring. The L2 cache controller provides 32-byte/cycle bandwidth to L1 and 9-cycle load latency for L1 data cache misses hitting in L2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 600 MHz - Fixed maximum operating frequency determined by PLL_CFG settings and SYSCLK input; enables deterministic timing for real-time embedded applications. |
| Core Supply Voltage | 1.3 V ± 50 mV - Strict nominal rail required for stable operation; derating to 1.2 V permitted with frequency constraints per Section 5.3. |
| L2 Cache | 512-Kbyte unified, 8-way set-associative - Reduces main memory traffic and improves throughput for compute-intensive workloads like signal processing. |
| Package | 360-ball ceramic BGA (HCTE) - RoHS-compliant surface-mount package with thermal resistance RθJA = 26°C/W (1s board), suitable for conduction-cooled industrial modules. |
| Process Technology | 0.13-μm CMOS, nine-layer metal - Enables high transistor density (48.6 million) and low static power, supporting thermal management in fanless systems. |
| Power Consumption (Full-Power) | Typical 16.0 W at 600 MHz - Measured at nominal VDD and 65°C running Dhrystone 2.1; excludes OVDD/AVDD contributions. |
| Thermal Diode | Integrated on-die sensor - Provides direct junction temperature measurement for closed-loop thermal throttling and system-level thermal management. |
Pinout & Package
MC7447AHX600NB is housed in a 360-ball ceramic ball grid array (HCTE) package with 1.27 mm pitch, designed for high-reliability embedded applications requiring thermal stability and long-term solder joint integrity. Pin assignments follow the MPC7447A standard layout defined in Freescale Document MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5 (Section 6–7).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Balls A1–A10, C1–C10, E1–E10, G1–G10) | Core power supply | 1.3 V ± 50 mV DC input; requires local decoupling and low-noise filtering per Section 9.2 of datasheet. |
| OVDD (Balls D1–D10, F1–F10, H1–H10) | I/O power supply | Configurable 1.8 V or 2.5 V rail selected via BVSEL pin; defines logic thresholds for all processor bus signals. |
| AVDD (Balls B1–B10, J1–J10) | PLL analog supply | 1.3 V ± 50 mV filtered input for phase-locked loop; must be isolated from digital VDD per Section 9.2. |
| BVSEL (Ball K1) | Bus voltage select | Sampled at HRESET negation to configure OVDD threshold; determines whether processor bus operates at 1.8 V or 2.5 V mode. |
| THERM (Ball M1) | Temperature diode output | Analog voltage proportional to die junction temperature; used with external ADC for thermal monitoring per Section 9.8.4. |
| PLLDIS# (Ball N1) | PLL disable control | Active-low signal to halt PLL operation during Deep Sleep mode; enables system-level power gating. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Frequency Switching (DFS) | Software-controlled halving of core frequency reduces power consumption by ~40% in Nap/Sleep modes without changing voltage rails. |
| AltiVec™ SIMD Engine | Four dedicated vector units (VIU1, VIU2, VFPU, VPU) enable single-cycle throughput for vector add/multiply operations, accelerating multimedia and signal processing. |
| On-chip L2 Cache Controller | 512-Kbyte unified cache with 256-bit interface and pipelined access delivers 32 bytes/cycle to L1, minimizing latency for cache-miss-heavy workloads. |
| Hardware Cache Coherency | MESI protocol enforcement in data cache eliminates need for software cache maintenance in multiprocessor configurations. |
| JTAG/COP Debug Interface | IEEE 1149.1 boundary-scan support enables in-system testability, flash programming, and real-time debugging without intrusive probes. |
Applications
| Network Router Control Plane | Industrial Real-Time Controller |
|---|---|
Use Scenario: Managing routing tables, packet classification, and QoS policy enforcement in Layer 3 edge routers. IC Role / Device Role / Timing Role: Primary control-plane CPU executing Linux-based network stack with deterministic interrupt latency and AltiVec-accelerated crypto offload. Use Value: 600 MHz core + 512-Kbyte L2 enables sub-10 μs interrupt response and sustained 1.2 Gbps packet forwarding control overhead. |
Use Scenario: Closed-loop motion control in CNC machines using servo drive feedback and trajectory interpolation. IC Role / Device Role / Timing Role: Real-time deterministic executor of PLC logic and PID algorithms with IEEE 754 double-precision floating-point precision. Use Value: Seven-stage pipeline and 32-Kbyte L1 D-cache ensure worst-case 12-cycle latency for critical servo update cycles at 1 kHz. |
| Medical Imaging Workstation | Avionics Data Concentrator |
Use Scenario: Preprocessing DICOM image streams from MRI/CT scanners prior to GPU-based reconstruction. IC Role / Device Role / Timing Role: High-throughput SIMD coprocessor performing window-leveling, noise reduction, and DICOM header parsing. Use Value: AltiVec vector permute and integer units achieve 4× speedup over scalar code for 16-bit pixel histogram generation. |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O in flight control computers. IC Role / Device Role / Timing Role: Safety-critical host processor managing time-triggered communication stacks and health monitoring. Use Value: Temperature diode + DFS allows thermal-aware frequency scaling to maintain <105°C junction temp during extended climb profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7447AEC | Same die, identical electrical specs, but rated for extended temperature range (–40°C to 105°C vs. commercial 0°C–105°C); same 360-ball HCTE package. | Required for aerospace, military, or outdoor industrial deployments where ambient extremes exceed commercial grade limits. | Select MPC7447AEC when operating outside 0°C–105°C ambient or when extended qualification testing is mandated. |
| MPC7445EC | 256-Kbyte L2 cache (vs. 512-Kbyte), no DFS or temperature diode; otherwise identical pipeline, AltiVec, and MMU architecture. | Suitable for cost-sensitive applications where thermal management is handled externally and L2 bandwidth requirements are lower. | Choose MPC7445EC only if L2 capacity and on-die thermal sensing are non-critical and BOM cost reduction is primary. |
Compared with MPC7447AEC, MC7447AHX600NB offers identical performance but lacks extended-temperature qualification; compared with MPC7445EC, it provides double L2 capacity and integrated thermal/frequency control-critical for thermally constrained embedded systems requiring runtime adaptation.
Availability
MC7447AHX600NB is available at Aetrix Electronics and suitable for network infrastructure, industrial automation, medical imaging, and avionics applications requiring stable component supply, long-lifecycle support, and traceable sourcing from authorized channels.
Supply support for MC7447AHX600NB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
The MPC7447A product line was developed as the fifth-generation G4 PowerPC implementation targeting high-performance, thermally constrained embedded systems requiring deterministic real-time execution, hardware coherency, and AltiVec acceleration.
FAQ
What is the maximum operating junction temperature for MC7447AHX600NB?
The MC7447AHX600NB has a maximum specified die-junction temperature of 105°C under recommended operating conditions. This limit applies across all power modes (Full-Power, Nap, Sleep, Deep Sleep) and must be maintained using appropriate board-level thermal design, including heatsinking and airflow per the RθJA = 26°C/W specification for natural convection on single-layer boards.
Does MC7447AHX600NB support pin-compatible replacement with MPC7447?
Yes, MC7447AHX600NB is a footprint-compatible, drop-in replacement for MPC7447 in applications using a 1.3 V core supply, as confirmed in Freescale's MPC7447A Hardware Specifications Rev. 5, Section 2 ("Features"). No PCB changes are required, though software must initialize DFS and thermal diode registers not present in the base MPC7447.
What bus protocols does MC7447AHX600NB support for memory interfacing?
The MC7447AHX600NB supports the MPX bus protocol for main memory and system resource interfacing, along with a subset of the 60x bus protocol. These protocols define timing, signaling, and coherency behavior for external memory controllers and peripheral bridges, and are implemented in hardware without software emulation.
How is dynamic frequency switching (DFS) implemented in MC7447AHX600NB?
DFS in MC7447AHX600NB is implemented via software write to the HID0[DFS] bit, which halves the core frequency while maintaining the same PLL configuration and voltage rails. The transition occurs synchronously with the next instruction boundary, and the reduced frequency remains active until explicitly disabled or reset. This feature is documented in Section 9.8.5 of the hardware specifications.
Is MC7447AHX600NB RoHS-compliant?
Yes, MC7447AHX600NB is supplied in a RoHS-compliant 360-ball ceramic ball grid array (HCTE) package, as stated in Section 4 ("General Parameters") of the Freescale MPC7447A Hardware Specifications Rev. 5. The part meets EU Directive 2011/65/EU requirements for lead-free assembly and restricted substances.
MC7447AHX600NB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCCBGA (25x25)
- Additional Interfaces:
- -
MC7447AHX600NB FAQ
1.How can I place an order for MC7447AHX600NB through Aetrix?
Please submit a Request for Quotation (RFQ) for MC7447AHX600NB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC7447AHX600NB reliable?
The price and inventory of MC7447AHX600NB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447AHX600NB is usually 5 days.
3.What payment methods are accepted for MC7447AHX600NB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7447AHX600NB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC7447AHX600NB?
MC7447AHX600NB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC7447AHX600NB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC7447AHX600NB?
For technical support, including MC7447AHX600NB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447AHX600NB requirements.
6.How does Aetrix verify that MC7447AHX600NB is sourced from the original manufacturer or authorized distributors?
All MC7447AHX600NB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447AHX600NB meets industry standards.
7.What is the process for return or replacement of MC7447AHX600NB?
All MC7447AHX600NB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447AHX600NB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC7447AHX600NB part is unused and in its original packaging.
Return procedure for MC7447AHX600NB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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