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NXP Semiconductors MC7447AHX867NB

Part No.:
MC7447AHX867NB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
360-BCBGA, FCCBGA
Datasheet:
AetrixMC7447AHX867NB.pdf
Description:
IC MPU MPC74XX 867MHZ 360FCCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,716

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Product details

Overview

MC7447AHX867NB from Freescale Semiconductor is a 1.3 V, 867 MHz PowerPC G4 RISC microprocessor with integrated 512-Kbyte unified L2 cache, superscalar 7-stage pipeline, and AltiVec™ SIMD engine - deployed in high-performance networking control planes and embedded computing systems requiring deterministic real-time processing.

For engineers reviewing the MC7447AHX867NB datasheet, MC7447AHX867NB pinout, MC7447AHX867NB application, or MC7447AHX867NB equivalent, key selection criteria include core voltage tolerance (±50 mV), DFS-enabled dynamic frequency switching, thermal diode integration, and MPX/60x bus protocol compatibility for legacy system upgrades.

Technical Context

The MC7447AHX867NB implements the full PowerPC 32-bit architecture with dual-integer, vector, and floating-point execution units - supporting up to 16 simultaneous in-flight instructions and precise exception handling via a 16-entry completion queue. Its Harvard L1 cache (32-Kbyte I/D) uses PLRU replacement and hardware MESI coherency.

It integrates a 512-Kbyte eight-way set-associative L2 cache with 64-byte line size, 9-cycle L1 data miss latency on L2 hit, and 256-bit interface to L1 - paired with dual MMUs (128-entry 2-way TLBs), BTIC/BHT branch prediction, and JTAG/COP debug infrastructure.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency867 MHz - fixed-frequency variant validated at nominal 1.3 V ±50 mV; supports DFS to 433.5 MHz for thermal/power throttling
L2 Cache512-Kbyte unified, eight-way set-associative - enables low-latency access to instruction/data with 9-cycle L1 miss penalty
Process Technology0.13-μm CMOS, nine-layer metal - delivers 48.6 million transistors in 8.51 mm × 9.86 mm die
Power ConsumptionTypical 18.0 W at 867 MHz full-power mode - includes core (VDD) only; excludes OVDD/AVDD contributions
Thermal ManagementIntegrated temperature diode + DFS + Nap/Sleep/Deep Sleep modes - junction temp rated 0–105°C, RθJA = 26°C/W (1s board)
Bus InterfaceMPX protocol + subset of 60x bus - supports 1.8 V or 2.5 V I/O with BVSEL-configurable thresholds
Execution Units11 independent units: 4 integer, 1 FPU, 4 vector, 1 permute, 1 load/store - enables 3-issue dispatch (FIQ/VIQ/GIQ)

Pinout & Package

MC7447AHX867NB is housed in a surface-mount 360-ball ceramic ball grid array (HCTE) package with 1.27 mm pitch, RoHS-compliant construction, and thermal pad on underside for board-level heat dissipation.

Pin/Terminal Circuit Role Design Meaning
VDD (Balls A1–A10, C1–C10, E1–E10)Core power supply1.3 V ±50 mV DC input; requires local decoupling per Freescale layout guidelines
OVDD (Balls D1–D10, F1–F10)I/O power supplyConfigurable 1.8 V or 2.5 V; sets bus signal thresholds via BVSEL sampling at HRESET negation
AVDD (Balls G1–G5, J1–J5)PLL analog supply1.3 V ±50 mV filtered input; isolated from digital VDD per Section 9.2 of datasheet
BVSEL (Ball H1)Bus voltage selectResistor-configurable pin determining OVDD threshold mode (1.8 V or 2.5 V); must match applied OVDD
THERM (Ball K1)Temperature diode outputAnalog voltage proportional to die junction temperature; used for closed-loop thermal management
HRESET (Ball L1)Hardware reset inputActive-low synchronous reset; samples BVSEL state to configure I/O voltage thresholds

Key Features

Feature Design Value
Dynamic Frequency Switching (DFS)Software-controlled halving of core clock (867 → 433.5 MHz) to reduce power by ~50% without firmware changes
AltiVec™ SIMD EngineFour vector units (VIU1/VIU2/VFPU/VPU) with 32-entry VR file - accelerates media, signal, and crypto workloads in single-instruction multiple-data flow
Branch Prediction Architecture128-entry 4-way BTIC + 2048-entry BHT + 8-entry link stack - reduces misprediction penalty to 6 cycles and enables 3 outstanding speculative branches
L1 Cache CoherencyHardware-enforced MESI protocol with separate I/D caches - eliminates software cache-flush overhead in multiprocessor configurations
JTAG/COP Debug InterfaceIEEE 1149.1 boundary-scan + COP coprocessor port - enables non-intrusive real-time tracing, breakpoint injection, and memory inspection

Applications

Networking Control Plane Industrial Real-Time Controller

Use Scenario: Packet classification, ACL enforcement, and routing table lookups in Layer 3 switches and firewalls.

IC Role / Device Role / Timing Role: Primary control processor executing Linux-based network stack with deterministic interrupt latency under 1 μs.

Use Value: 867 MHz core + AltiVec acceleration delivers >2.3 Dhrystone MIPs/MHz while sustaining 9-cycle L2 hit latency for fast forwarding path decisions.

Use Scenario: Motion control loop execution in CNC machines and robotic arms with sub-millisecond jitter requirements.

IC Role / Device Role / Timing Role: Deterministic real-time host CPU managing EtherCAT or SERCOS III master stacks via MPX bus-connected peripherals.

Use Value: DFS and thermal diode enable adaptive clock scaling during thermal stress, maintaining <105°C junction temperature without external fan control.

Avionics Data Concentrator Secure Communications Gateway

Use Scenario: ARINC 664 (AFDX) end-system data aggregation with time-triggered scheduling and redundancy management.

IC Role / Device Role / Timing Role: Safety-critical host processor running DO-178B certifiable RTOS with lockstep cache control and parity-checked L1/L2 memory subsystems.

Use Value: Hardware parity on caches, buses, and TLBs ensures single-bit error detection - meeting ED-80/DO-254 functional safety requirements.

Use Scenario: IPsec and TLS offload in encrypted satellite ground station modems operating in extended temperature environments.

IC Role / Device Role / Timing Role: Cryptographic accelerator host with AltiVec-enabled AES-NI-like operations and JTAG-secured debug lockdown.

Use Value: Integrated temperature diode + Deep Sleep mode (PLL disabled) reduces standby power to 4.0 W - critical for solar-powered remote deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC7447AHX800B800 MHz core, same 1.3 V supply and 360-ball HCTE package - lacks DFS and thermal diode per Table 1 comparisonLower thermal headroom in sealed enclosures; no runtime frequency adaptation for burst workloadsSelect when fixed-frequency operation suffices and cost sensitivity outweighs thermal management needs
MPC7447AHX1000B1000 MHz core, identical feature set and pinout - validated at same 1.3 V ±50 mV but higher power (23.0 W max)Requires enhanced thermal solution (RθJA ≤ 19°C/W) and tighter PCB decoupling; not drop-in for 867 MHz board layoutsSelect when deterministic 1000 MHz throughput is required and thermal design accommodates +5 W peak dissipation

Compared with MPC7447AHX800B, MC7447AHX867NB adds DFS and thermal diode for adaptive thermal control; compared with MPC7447AHX1000B, it trades 133 MHz peak performance for lower power envelope and relaxed thermal design constraints.

Availability

MC7447AHX867NB is available at Aetrix Electronics and suitable for networking control planes, industrial real-time controllers, avionics data concentrators, and secure communications gateways requiring stable component supply across long-lifecycle embedded programs.

Supply support for MC7447AHX867NB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC7447A product line was designed for high-reliability, high-throughput embedded computing applications demanding PowerPC 32-bit ISA compliance, hardware coherency, and deterministic real-time response - particularly in legacy telecom and defense platforms.

FAQ

What is the maximum junction temperature specification for MC7447AHX867NB?

The MC7447AHX867NB has a specified die-junction temperature range of 0°C to 105°C under recommended operating conditions. This limit applies during full-power operation at 867 MHz and 1.3 V core supply. Thermal design must ensure RθJA ≤ 26°C/W on single-layer boards or ≤19°C/W on four-layer boards to maintain reliability within this range. The integrated temperature diode provides direct monitoring of actual junction temperature in-system.

Does MC7447AHX867NB support pin-compatible replacement with earlier MPC7447 variants?

Yes, MC7447AHX867NB is a footprint-compatible, drop-in replacement for MPC7447 designs when the core power supply is 1.3 V, as explicitly stated in the Freescale documentation. It retains identical 360-ball HCTE packaging, MPX/60x bus signaling, and pin assignments - while adding DFS and thermal diode functionality without requiring PCB layout changes.

What bus voltage options does MC7447AHX867NB support for its processor interface?

MC7447AHX867NB supports two configurable I/O voltage modes: 1.8 V ±5% and 2.5 V ±5%, selected by the BVSEL pin sampled at HRESET negation. The device's input thresholds (VIH/VIL) and output swing are dynamically aligned to the chosen OVDD level, enabling interoperability with both legacy 1.8 V logic and newer 2.5 V system controllers without level-shifting circuitry.

How does Dynamic Frequency Switching (DFS) operate in MC7447AHX867NB?

DFS in MC7447AHX867NB allows software to halve the core clock frequency from 867 MHz to 433.5 MHz without resetting the processor or altering the instruction stream. This is implemented via PLL reconfiguration and reduces typical power consumption by approximately 50%. The transition is transparent to running code and maintains cache coherency and register state - making it ideal for thermal throttling in sealed or fanless enclosures.

Is MC7447AHX867NB compatible with the MPC7450 RISC Microprocessor Family Reference Manual?

Yes, MC7447AHX867NB's functional characteristics - including instruction set architecture, exception model, MMU behavior, and AltiVec programming model - are fully documented in the MPC7450 RISC Microprocessor Family Reference Manual, as confirmed in the Freescale hardware specifications document. Electrical, thermal, and pinout details remain specific to the MC7447AHX867NB datasheet, but software development and system integration rely directly on the MPC7450 reference manual.

MC7447AHX867NB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
360-BCBGA, FCCBGA
Series:
MPC74xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
867MHz
Co-Processors/DSP:
Multimedia; SIMD
RAM Controllers:
-
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
360-FCCBGA (25x25)
Additional Interfaces:
-

MC7447AHX867NB FAQ

1.How can I place an order for MC7447AHX867NB through Aetrix?

Please submit a Request for Quotation (RFQ) for MC7447AHX867NB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC7447AHX867NB reliable?

The price and inventory of MC7447AHX867NB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447AHX867NB is usually 5 days.

3.What payment methods are accepted for MC7447AHX867NB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7447AHX867NB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC7447AHX867NB?

MC7447AHX867NB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC7447AHX867NB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC7447AHX867NB?

For technical support, including MC7447AHX867NB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447AHX867NB requirements.

6.How does Aetrix verify that MC7447AHX867NB is sourced from the original manufacturer or authorized distributors?

All MC7447AHX867NB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447AHX867NB meets industry standards.

7.What is the process for return or replacement of MC7447AHX867NB?

All MC7447AHX867NB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447AHX867NB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC7447AHX867NB part is unused and in its original packaging.

Return procedure for MC7447AHX867NB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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