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NXP Semiconductors MC7447ATHX1167NB
- Part No.:
- MC7447ATHX1167NB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MC7447ATHX1167NB.pdf
- Description:
- IC MPU MPC74XX 1.167GHZ 360BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,344
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Product details
Overview
MC7447ATHX1167NB from Freescale Semiconductor is a 1.3 V, 1167 MHz PowerPC G4 RISC microprocessor with integrated 512-Kbyte unified L2 cache, superscalar 7-stage pipeline, and AltiVec SIMD engine - deployed in high-performance networking and embedded computing systems requiring deterministic real-time processing and IEEE 754-compliant floating-point execution.
For engineers reviewing the MC7447ATHX1167NB datasheet, MC7447ATHX1167NB pinout, MC7447ATHX1167NB application, or MC7447ATHX1167NB equivalent, key selection criteria include core voltage tolerance (±50 mV), MPX/60x bus protocol support, dynamic frequency switching (DFS) capability, thermal diode integration, and 360-ball HCTE ceramic BGA package compatibility with legacy MPC7447 designs.
Technical Context
The MC7447ATHX1167NB implements the full PowerPC 32-bit architecture with dual 32-Kbyte L1 instruction and data caches (8-way set-associative, PLRU), hardware-enforced MESI coherency, and separate instruction/data MMUs featuring 128-entry 2-way TLBs and 8 IBAT/DBAT registers. Its memory subsystem supports 32-bit physical addressing with 4-Kbyte pages and 256-Mbyte segments.
It integrates eleven execution units - including four integer units (three SFX + one IU2), five-stage IEEE 754-1985 FPU, four vector units (VIU1/VIU2/VFPU/VPU), and branch prediction via 128-entry BTIC and 2048-entry BHT - enabling up to 16 in-flight instructions and three-per-cycle completion under precise exception model.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 1167 MHz - fixed maximum operating frequency at nominal 1.3 V ±50 mV core supply; enables Dhrystone 2.1 benchmark performance of ~2.3 MIPS/MHz. |
| L2 Cache | 512-Kbyte unified, 8-way set-associative - reduces average memory latency to 9 cycles on L1 data miss hit in L2; supports write-back/write-through per-page control. |
| Process Technology | 0.13-μm CMOS, nine-layer metal - delivers 48.6 million transistors in 8.51 mm × 9.86 mm die; enables low-power operation with DFS and voltage derating support. |
| Thermal Management | Integrated temperature diode + DFS - allows software-triggered halving of core frequency to reduce power; junction temperature rated 0–105°C. |
| I/O Voltage Support | 1.8 V or 2.5 V selectable via BVSEL pin - ensures backward compatibility with existing 1.8-V systems and forward readiness for 2.5-V interfaces. |
| Power Consumption | Typical 18.0 W at 1167 MHz full-power mode - measured at 65°C with Dhrystone 2.1; nap/sleep modes draw ~4.1 W, deep sleep draws ~4.0 W with PLL disabled. |
| Bus Interface | MPX protocol + subset of 60x protocol - provides coherent system bus interface with up to 16 outstanding out-of-order transactions and store merging capability. |
Pinout & Package
MC7447ATHX1167NB uses a surface-mount 360-ball ceramic ball grid array (HCTE) package with 1.27 mm pitch, RoHS-compliant, thermally enhanced construction. Pin assignments follow Freescale's standardized MPC7447A layout with dedicated VDD, OVDD, AVDD, and ground balls distributed across perimeter and center arrays for optimal decoupling and signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BVSEL | Bus Voltage Select | Determines I/O voltage threshold at HRESET negation: logic 0 → 1.8-V mode; logic 1/HRESET → 2.5-V mode; requires resistor/jumper configuration for field reprogrammability. |
| CLKIN | System Clock Input | Accepts differential or single-ended SYSCLK reference; feeds PLL to generate 1167 MHz core clock; timing critical for setup/hold compliance per Table 8. |
| HRESET | Hardware Reset Input | Asynchronous active-low reset that initializes all internal state, disables clocks except JTAG/time base, and samples BVSEL to configure I/O thresholds. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port supporting in-system debug, ABIST, and LSSD scan chain for production test and failure analysis. |
| VDD / AVDD / OVDD | Power Supply Inputs | VDD/AVDD = 1.3 V ±50 mV (core/PLL); OVDD = 1.8 V ±5% or 2.5 V ±5% (I/O); strict sequencing required: OVDD must not exceed VDD by >2.0 V during power-up/down. |
| TDIODE | Temperature Diode Output | Analog output proportional to die junction temperature; used with external ADC to implement closed-loop thermal management without external sensor. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Frequency Switching (DFS) | Software-controlled halving of core frequency to reduce power consumption in real time - preserves architectural state and enables rapid return to full speed without reboot. |
| AltiVec SIMD Engine | Four dedicated vector units (VIU1/VIU2/VFPU/VPU) with 32-entry VR file - accelerates multimedia, signal processing, and encryption workloads with 1-cycle throughput for simple vector ops. |
| L1 Cache Architecture | Separate 32-Kbyte 8-way instruction and data caches with critical double/quad-word forwarding - delivers 4 instructions/cycle fetch and 4 words/cycle load bandwidth. |
| Branch Prediction | 128-entry BTIC + 2048-entry BHT + 8-entry link stack - reduces misprediction penalty to minimum 6 cycles and enables 3 outstanding speculative branches. |
| Memory Management | Dual MMUs with 128-entry TLBs, 8 IBAT/DBAT registers, and hardware/software page table walk - supports 52-bit virtual addressing and fine-grained memory attribute control per page/block. |
| Power-Saving Modes | Nap (bus snooping active), Sleep (no snooping, PLL running), Deep Sleep (PLL disabled) - provides hierarchical power reduction while maintaining JTAG accessibility and time base continuity. |
Applications
| Telecom Line Cards | Industrial Control Systems |
|---|---|
|
Use Scenario: Real-time packet classification and QoS enforcement in carrier-grade Ethernet switches and routers. IC Role / Device Role / Timing Role: Primary control processor executing Linux-based network stack with hardware-accelerated crypto and traffic shaping via AltiVec. Use Value: 1167 MHz deterministic execution and 512-Kbyte L2 cache enable sub-millisecond packet processing latency with sustained 18 W thermal envelope. |
Use Scenario: Deterministic motion control in CNC machines and PLC-based automation with synchronized I/O and safety monitoring. IC Role / Device Role / Timing Role: Central RISC controller managing servo loops, fieldbus communication (CAN/PCI), and HMI rendering using integrated FPU and vector units. Use Value: IEEE 754-compliant double-precision FPU and temperature-diode–based thermal throttling ensure stable operation under variable industrial ambient conditions. |
| Avionics Data Concentrators | Medical Imaging Processors |
|
Use Scenario: ARINC 664 (AFDX) end-system data aggregation and health monitoring in flight control networks. IC Role / Device Role / Timing Role: Safety-critical host processor executing DO-178B certified firmware with lockable L1 caches and parity-protected L2 cache. Use Value: Hardware-enforced MESI coherency, parity on caches/bus, and JTAG boundary-scan support meet RTCA DO-254/DO-178B verification requirements. |
Use Scenario: Real-time image reconstruction in portable ultrasound and MRI front-end processors. IC Role / Device Role / Timing Role: High-throughput signal processor performing FFT, filtering, and beamforming using AltiVec vector instructions and L2 cache streaming. Use Value: 256-bit L2 bus interface and 3-cycle GPR load latency enable >1.2 GB/s memory bandwidth for pixel pipeline acceleration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7447EC | Same 0.13-μm G4 core, identical pinout and L2 cache, but lacks DFS and temperature diode; rated for 1.2 V core supply only. | No dynamic thermal/power scaling; requires external temperature sensing and fixed-frequency operation. | Select when DFS and on-die thermal monitoring are unnecessary and cost sensitivity outweighs feature flexibility. |
| MPC7448EC | Successor with 90-nm process, 1.1 V core, larger 1-Mbyte L2, and enhanced AltiVec; pin-compatible but requires updated power delivery and thermal design. | Higher performance per watt and extended L2 bandwidth, but demands revised PCB layout for AVDD decoupling and thermal pad attachment. | Select for new designs targeting >2 GHz equivalent throughput and lower long-term power density; not drop-in for MC7447ATHX1167NB. |
Compared with MPC7447EC, MC7447ATHX1167NB adds runtime power/thermal adaptability; compared with MPC7448EC, it trades higher clock stability and mature qualification for lower peak performance and larger die size - making it optimal for field-deployed systems requiring proven reliability over generational upgrade.
Availability
MC7447ATHX1167NB is available at Aetrix Electronics and suitable for telecom infrastructure, avionics data concentrators, industrial motion controllers, and medical imaging processors requiring stable component supply and long-lifecycle support.
Supply support for MC7447ATHX1167NB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC7447A product line was designed for high-reliability, high-performance embedded computing applications where deterministic real-time behavior, IEEE-compliant floating-point accuracy, and thermal-aware power management are critical.
FAQ
What is the maximum operating junction temperature for MC7447ATHX1167NB?
The MC7447ATHX1167NB has a specified maximum junction temperature of 105°C under recommended operating conditions. This limit applies during full-power operation at 1167 MHz and 1.3 V core supply. The integrated temperature diode enables real-time monitoring to prevent thermal runaway, and dynamic frequency switching (DFS) can be engaged to reduce power dissipation before reaching this threshold. Thermal design must account for RθJA = 26°C/W (natural convection, single-layer board) to ensure safe operation.
Is MC7447ATHX1167NB pin-compatible with earlier MPC7447 variants?
Yes, MC7447ATHX1167NB is footprint-compatible and functions as a drop-in replacement for MPC7447 in applications using 1.3 V core supply, per Freescale documentation. It retains identical 360-ball HCTE BGA pinout, MPX/60x bus interface signals, and power/ground ball mapping. However, the addition of DFS and temperature diode functionality requires software enablement and may necessitate minor firmware updates to leverage these features fully.
Does MC7447ATHX1167NB support little-endian operation?
Yes, MC7447ATHX1167NB supports both big-endian and little-endian modes at the architectural level, including misaligned little-endian accesses. This capability is implemented in the load/store unit and MMU, allowing flexible software deployment across heterogeneous systems. Endianness is controlled via the MSR[LE] bit and affects instruction fetch, data load/store, and exception handling - verified in the MPC7450 RISC Microprocessor Family Reference Manual.
What bus protocols does MC7447ATHX1167NB implement?
MC7447ATHX1167NB implements the MPX bus protocol as its primary system interface and supports a defined subset of the 60x bus protocol for compatibility with legacy PowerPC peripherals and memory controllers. The MPX interface enables coherent multiprocessor operation with hardware-enforced MESI protocol, while the 60x subset allows integration with existing 60x-based chipsets without requiring full protocol emulation.
Can MC7447ATHX1167NB operate at reduced core voltage?
Yes, MC7447ATHX1167NB supports core voltage derating to 1.2 V ±50 mV DC, as documented in Section 5.3 of its hardware specifications. At this derated voltage, maximum operating frequency is reduced per validated voltage/frequency curves - for example, 1.2 V enables up to ~1000 MHz operation. Derating is intended to lower power consumption and thermal load while maintaining functional correctness, subject to system-level timing validation.
MC7447ATHX1167NB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.167GHZ
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 2.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCCBGA (25x25)
- Additional Interfaces:
- -
MC7447ATHX1167NB FAQ
1.How can I place an order for MC7447ATHX1167NB through Aetrix?
Please submit a Request for Quotation (RFQ) for MC7447ATHX1167NB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC7447ATHX1167NB reliable?
The price and inventory of MC7447ATHX1167NB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447ATHX1167NB is usually 5 days.
3.What payment methods are accepted for MC7447ATHX1167NB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7447ATHX1167NB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC7447ATHX1167NB?
MC7447ATHX1167NB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC7447ATHX1167NB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC7447ATHX1167NB?
For technical support, including MC7447ATHX1167NB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447ATHX1167NB requirements.
6.How does Aetrix verify that MC7447ATHX1167NB is sourced from the original manufacturer or authorized distributors?
All MC7447ATHX1167NB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447ATHX1167NB meets industry standards.
7.What is the process for return or replacement of MC7447ATHX1167NB?
All MC7447ATHX1167NB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447ATHX1167NB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC7447ATHX1167NB part is unused and in its original packaging.
Return procedure for MC7447ATHX1167NB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC7447ATHX1167NB Tags
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