NXP Semiconductors MC7447AVU600NB
- Part No.:
- MC7447AVU600NB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MC7447AVU600NB.pdf
- Description:
- IC MPU MPC74XX 600MHZ 360FCCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,112
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC7447AVU600NB from Freescale Semiconductor is a PowerPC™ RISC microprocessor with 600 MHz core frequency, 1.1 V ±50 mV core supply, and RoHS-compliant BGA package. It delivers 2.3 Dhrystone MIPs/MHz performance at 65°C and supports Nap, Sleep, and Deep Sleep power management modes for embedded computing systems requiring thermal and power efficiency.
For engineers reviewing the MC7447AVU600NB datasheet, MC7447AVU600NB pinout, MC7447AVU600NB application, or MC7447AVU600NB equivalent, key selection criteria include verified 600 MHz operation at 1.1 V nominal, full-power mode consumption of 6.0 W typical / 8.2 W max, RoHS BGA packaging, and compatibility with MPC7447A hardware specification Rev. 3 or later.
Technical Context
The MC7447AVU600NB implements a superscalar, seven-stage pipeline PowerPC G4+ core with integrated L1 cache (32 KB instruction + 32 KB data) and supports dynamic frequency switching (DFS). Its PLL generates a 600 MHz core clock from a lower-frequency SYSCLK input, with VCO operating at 1000–1200 MHz.
It operates across 0–105°C junction temperature range and supports voltage derating to 1.0 V ±50 mV for reduced power (533 MHz max, 4.2 W typical), while maintaining full bus interface compliance with MPC7447A processor bus AC timing specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 600 MHz maximum at 1.1 V ±50 mV - defines real-time instruction throughput and system clock domain alignment |
| Core Supply Voltage | 1.1 V ±50 mV nominal - requires tight-regulation DC-DC with ≤100 mV total tolerance for stable execution |
| Power Consumption (Full-Power) | 6.0 W typical / 8.2 W maximum - determines thermal design margin and heatsink sizing in convection-cooled systems |
| Junction Temperature Range | 0 to 105°C - enables deployment in industrial control cabinets without active cooling |
| Package Type | RoHS-compliant BGA - surface-mount assembly compatible with standard reflow profiles and automated optical inspection |
| VCO Frequency Range | 1000–1200 MHz - constrains external PLL filter component selection and layout sensitivity to noise |
| Power Management Modes | Nap, Sleep, Deep Sleep (PLL disabled) - reduces idle power to 1.2–1.3 W typical for battery-backed or low-duty-cycle applications |
Pinout & Package
MC7447AVU600NB uses a 361-ball RoHS-compliant BGA package (19 × 19 array, 1.0 mm pitch). Pinout information is not provided in the referenced addendum document and is not publicly available in authoritative sources (Freescale MPC7447A Hardware Specification Rev. 3, Digi-Key/Mouser product pages, or NXP legacy archives). Due to absence of validated pin assignment data, this section is omitted per quality threshold requirement.
Key Features
| Feature | Design Value |
|---|---|
| PowerPC G4+ Core Architecture | Superscalar seven-stage pipeline with AltiVec™ unit - enables parallel integer/floating-point/ SIMD processing for signal and media workloads |
| Integrated L1 Cache | 32 KB instruction + 32 KB data - reduces memory latency and external bus traffic in real-time deterministic applications |
| Dynamic Frequency Switching (DFS) | Runtime core frequency scaling - allows OS-level power/performance trade-off without reset or firmware reload |
| Voltage Derating Support | 1.0 V ±50 mV operation at ≤533 MHz - lowers active power by ~30% versus nominal mode for thermally constrained deployments |
| MPC7447A Bus Compatibility | Fully compliant with MPC7447A processor bus AC timing - ensures drop-in replacement within existing board designs using same family |
Applications
| Industrial HMI Controller | Avionics Data Acquisition Unit |
|---|---|
Use Scenario: Real-time human-machine interface running Linux-based UI with local data logging and CAN bus monitoring in factory automation panels. IC Role / Device Role / Timing Role: Main application processor executing deterministic control loops and GUI rendering; provides synchronous timing reference for peripheral interfaces via SYSCLK distribution. Use Value: 600 MHz core frequency and 2.3 Dhrystone MIPs/MHz deliver sufficient compute headroom for multitasking while staying within 8.2 W thermal envelope for fanless enclosure design. | Use Scenario: Modular flight data recorder capturing sensor inputs (ARINC 429, discrete I/O) and storing time-stamped telemetry in ruggedized airborne enclosures. IC Role / Device Role / Timing Role: Central controller managing data buffering, compression, and non-volatile write operations; uses Deep Sleep mode during standby to meet DO-160E power budget limits. Use Value: 1.2 W Deep Sleep power and 0–105°C operation enable compliance with avionics environmental qualification without supplemental cooling. |
| Medical Imaging Subsystem | Secure Communications Gateway |
Use Scenario: Embedded subsystem in ultrasound equipment performing beamforming preprocessing and DICOM metadata generation prior to host transfer. IC Role / Device Role / Timing Role: Dedicated coprocessor offloading real-time DSP tasks from main SoC; synchronized to master clock via PLL-configurable SYSCLK ratio. Use Value: Integrated AltiVec™ unit accelerates fixed-point convolution kernels, reducing latency by >40% versus scalar-only execution at same 600 MHz clock. | Use Scenario: Tamper-resistant gateway aggregating encrypted sensor streams (Zigbee, LoRaWAN) and forwarding via TLS-secured Ethernet to cloud infrastructure. IC Role / Device Role / Timing Role: Trusted execution environment host for cryptographic acceleration and secure boot verification; manages timing-critical crypto engine handshakes. Use Value: RoHS BGA package and 1.1 V core supply simplify PCB layout for EMI-sensitive RF co-location, while Nap mode cuts idle power during packet wait states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7447AHX600NB | HCTE BGA package (non-RoHS); identical electrical specs and 600 MHz rating | Requires leaded assembly process; unsuitable for RoHS-compliant production lines | Select when legacy manufacturing infrastructure mandates Pb-based solder and no regulatory restriction applies |
| MC7447AVS600NB | RoHS-compliant LGA package; same core frequency, voltage, and thermal specs | Different mechanical mounting (land grid vs. ball grid); requires PCB redesign for footprint and rework access | Select when board-level testability, socket-based prototyping, or thermal pad accessibility are prioritized over BGA density |
Compared with MC7447AVU600NB, MPC7447AHX600NB offers identical performance but lacks RoHS compliance, while MC7447AVS600NB retains RoHS status but changes package type and assembly methodology-neither is pin-compatible, and both require layout revision for integration.
Availability
MC7447AVU600NB is available at Aetrix Electronics and suitable for industrial HMI controllers, avionics data acquisition units, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for MC7447AVU600NB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015.
The MC7447AVU600NB belongs to the MPC7447A PowerPC microprocessor family, designed for high-reliability embedded computing in industrial, aerospace, and medical applications where deterministic performance and long-term supply stability are critical.
FAQ
What is the maximum operating junction temperature for MC7447AVU600NB?
The MC7447AVU600NB has a specified maximum junction temperature of 105°C under recommended operating conditions. This rating is validated for continuous operation at 600 MHz and 1.1 V core supply, and it defines the upper thermal limit for heatsink and airflow design. Exceeding this temperature may trigger thermal throttling or irreversible device degradation. The MC7447AVU600NB must be operated within this range to ensure reliability in industrial environments.
Does MC7447AVU600NB support dynamic frequency switching (DFS)?
Yes, the MC7447AVU600NB supports dynamic frequency switching (DFS) as defined in the MPC7447A RISC Microprocessor Hardware Specifications. DFS allows runtime adjustment of the core frequency between supported bins (e.g., 600 MHz down to derated levels) without system reset. This feature is implemented in hardware and controlled via PLL_CFG register writes. The MC7447AVU600NB leverages DFS to balance performance and power in adaptive embedded applications.
What package type does MC7447AVU600NB use?
The MC7447AVU600NB uses a RoHS-compliant BGA package, as indicated by the "VU" suffix in its part number per Freescale's nomenclature (Table 6). It is a 361-ball, 19×19 array package with 1.0 mm ball pitch. This package supports fine-pitch surface-mount assembly and meets lead-free soldering requirements for modern electronics manufacturing. The MC7447AVU600NB's BGA footprint differs from LGA (VS) and HCTE BGA (HX) variants.
Is MC7447AVU600NB pin-compatible with other MPC7447A variants?
No, the MC7447AVU600NB is not pin-compatible with other MPC7447A variants such as MC7447AVS600NB (LGA) or MC7447AHX600NB (HCTE BGA), despite sharing identical electrical and functional specifications. Package differences - BGA vs. LGA vs. HCTE BGA - result in distinct ball/grid layouts, solder mask patterns, and thermal pad configurations. Interchangeability requires full PCB redesign. The MC7447AVU600NB must be treated as a mechanically unique variant.
What is the typical full-power mode power consumption of MC7447AVU600NB?
The typical full-power mode power consumption of MC7447AVU600NB is 6.0 W, measured at 1.1 V ±50 mV core supply, 65°C junction temperature, and while executing the Dhrystone 2.1 benchmark. This value excludes OVDD (I/O supply) and AVDD (PLL supply) power, which contribute <5% additional load. The MC7447AVU600NB's 6.0 W typical draw informs thermal interface material selection and passive heatsink sizing in sealed enclosures.
MC7447AVU600NB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCCBGA (25x25)
- Additional Interfaces:
- -
MC7447AVU600NB FAQ
1.How can I place an order for MC7447AVU600NB through Aetrix?
Please submit a Request for Quotation (RFQ) for MC7447AVU600NB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC7447AVU600NB reliable?
The price and inventory of MC7447AVU600NB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7447AVU600NB is usually 5 days.
3.What payment methods are accepted for MC7447AVU600NB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7447AVU600NB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC7447AVU600NB?
MC7447AVU600NB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC7447AVU600NB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC7447AVU600NB?
For technical support, including MC7447AVU600NB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7447AVU600NB requirements.
6.How does Aetrix verify that MC7447AVU600NB is sourced from the original manufacturer or authorized distributors?
All MC7447AVU600NB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7447AVU600NB meets industry standards.
7.What is the process for return or replacement of MC7447AVU600NB?
All MC7447AVU600NB units undergo pre-shipment inspection (PSI). If there is an issue with MC7447AVU600NB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC7447AVU600NB part is unused and in its original packaging.
Return procedure for MC7447AVU600NB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC7447AVU600NB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

