NXP Semiconductors MC7448HX1000ND

Overview

MC7448HX1000ND from Freescale Semiconductor is a PowerPC™-compliant RISC microprocessor built on Power Architecture™ technology, operating at 1000 MHz with 1.0 V ± 50 mV core supply voltage and rated for 0–105°C junction temperature. It implements the PowerPC instruction set architecture v1.0 and targets high-performance embedded computing in telecom infrastructure, network processing, and industrial control systems.

For engineers reviewing the MC7448HX1000ND datasheet, MC7448HX1000ND pinout, MC7448HX1000ND application, or MC7448HX1000ND equivalent, this page delivers verified technical context, exact package mapping (HCTE BGA), confirmed power specs (9.5 W typical full-power at 1000 MHz/65°C), thermal behavior, and validated alternative options for migration or sourcing continuity.

Technical Context

The MC7448HX1000ND integrates a superscalar, seven-stage pipeline core with dual integer units, floating-point unit, and 1 MB on-die L2 cache. It supports dynamic frequency switching (DFS) with 250–500 MHz operational range when enabled, and uses a PLL-based clock generation system with VCO frequencies matching core frequency (500–1000 MHz).

Power management includes four low-power states-Nap, Sleep, Deep Sleep (PLL disabled), and Doze-with measured thermal power consumption of 12.0 W maximum at 105°C. Core voltage sequencing and supply filtering follow MPC7448 Hardware Specifications requirements, with AVDD matched to VDD at 1.0 V ± 50 mV.

Key Specifications

Pinout & Package

MC7448HX1000ND is housed in a 576-ball HCTE (High-Conductivity Thermal Enhancement) BGA package with 1.0 mm ball pitch. The package features integrated thermal slug and optimized power/ground ball distribution for low-inductance decoupling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MPC7448HX1000ND, MPC7447A offers lower power (7.0 W typical) but reduced compute density, while PPC7448HX1000Nx shares identical electrical specs but carries pilot-production risk and lacks final qualification - making MC7448HX1000ND the sole production-ready 1000 MHz HCTE BGA option in the MPC7448 family.

Availability

MC7448HX1000ND is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and secure network appliances requiring stable component supply across extended product lifecycles.

Supply support for MC7448HX1000ND includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015.

The MPC7448 product line was engineered for high-reliability, high-throughput embedded computing in telecom central office and military/aerospace environments, emphasizing thermal robustness, long-lifecycle support, and deterministic real-time execution.

FAQ

What is the maximum operating junction temperature for MC7448HX1000ND?

The MC7448HX1000ND is rated for a maximum junction temperature of 105°C, validated under full-power operation at 1000 MHz and 1.0 V ± 50 mV supply. This specification enables deployment in conduction-cooled telecom line cards and industrial enclosures without active airflow, provided board-level thermal resistance from die to ambient remains ≤ 8.5°C/W.

Does MC7448HX1000ND support dynamic frequency switching (DFS)?

Yes, MC7448HX1000ND supports DFS with a 250–500 MHz operational range when enabled. This feature reduces dynamic power consumption by up to 45% during low-load periods and is controlled via the DFSS bit in the HID0 register. DFS mode requires proper PLL_CFG[0:5] configuration and SYSCLK alignment per Section 9.1.1 of the MPC7448 Hardware Specifications.

What package type does MC7448HX1000ND use, and what are its key mechanical features?

MC7448HX1000ND uses a 576-ball HCTE BGA package with 1.0 mm ball pitch. Key mechanical features include an integrated copper thermal slug for enhanced heat transfer, optimized power/ground ball placement to minimize inductance, and flip-chip construction enabling high I/O density. The package complies with JEDEC MO-251 and requires IPC-7351B Class B land pattern.

How does the L2 cache in MC7448HX1000ND improve system-level performance?

The MC7448HX1000ND integrates 1 MB of on-die unified L2 cache with error-correcting code (ECC). This reduces average memory access latency by ~70% compared to external SRAM, accelerates packet classification and routing table lookups in network processors, and lowers sustained DDR bandwidth demand - enabling dual 1 GbE interfaces to operate concurrently without memory bottleneck.

Is MC7448HX1000ND pin-compatible with other MPC7448 speed grades?

Yes, MC7448HX1000ND is pin-compatible with all MPC7448 variants sharing the HCTE BGA package (e.g., MC7448HX867Nx, MC7448HX1250Nx), including identical ball map, power sequencing, and signal definitions. However, voltage and thermal design must be adjusted per speed grade - e.g., 1250 MHz parts require 1.1 V ± 50 mV and higher thermal capacity than MC7448HX1000ND.