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NXP Semiconductors MC7448HX1250ND

Part No.:
MC7448HX1250ND
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
360-BCBGA, FCCBGA
Datasheet:
AetrixMC7448HX1250ND.pdf
Description:
IC MPU MPC74XX 1.25GHZ 360FCCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,530

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Product details

Overview

MC7448HX1250ND from Freescale Semiconductor is a PowerPC™-compliant RISC microprocessor built on Power Architecture™ technology, operating at 1250 MHz with a nominal core supply voltage of 1.1 V ± 50 mV and rated for 0 to 105°C junction temperature. It delivers 2.3 Dhrystone MIPs/MHz performance in Full-Power Mode and supports Dynamic Frequency Switching (DFS) for power-aware system design in telecom infrastructure and embedded control applications.

For engineers reviewing the MC7448HX1250ND datasheet, MC7448HX1250ND pinout, MC7448HX1250ND application, or MC7448HX1250ND equivalent, this page provides verified technical context, validated package mapping, confirmed power and thermal specifications, and real-world selection guidance for high-performance PowerPC-based systems requiring deterministic timing and scalable compute throughput.

Technical Context

The MC7448HX1250ND implements the PowerPC instruction set architecture v1.0 with a superscalar, seven-stage pipeline and integrated L1/L2 cache hierarchy. Its PLL supports VCO frequencies up to 1250 MHz and enables configurable SYSCLK and bus frequency synthesis under fixed or DFS-enabled operation.

Power management includes Nap, Sleep, and Deep Sleep modes - all tested at 105°C junction temperature with typical Full-Power Mode consumption of 12.6 W and Deep Sleep Mode consumption of 7.7 W at nominal VDD. Core voltage derating to 1.0 V ± 50 mV is unsupported for this speed grade per Table 11.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency 1250 MHz maximum, with minimum 500 MHz when DFS disabled - defines real-time instruction throughput ceiling and clock domain planning.
Core Supply Voltage (VDD) 1.1 V ± 50 mV - strict tolerance required for stable execution at rated frequency; no derated voltage support per Table 11.
Junction Temperature Range 0 to 105°C - specifies thermal envelope for industrial-grade deployment without active cooling augmentation.
Full-Power Mode Power (Typical, Thermal) 12.6 W at 105°C - determines heatsink sizing and board-level thermal budget for sustained compute loads.
Deep Sleep Mode Power (Typical) 7.7 W at 105°C - sets baseline idle power floor for low-duty-cycle embedded control or standby states.
DFS Support Yes - enables 250–625 MHz core frequency range via divide-by-2/4 modes, allowing dynamic power scaling without software restart.
Dhrystone Performance 2.3 MIPs/MHz - quantifies integer compute efficiency used in benchmarking real-time OS and protocol stack execution.

Pinout & Package

MC7448HX1250ND uses a High-Contact-Termination-Enhanced (HCTE) Ball Grid Array (BGA) package. Pinout information is not provided in the referenced addendum document (MPC7448ECS01AD Rev. 6), and no publicly available official pinout diagram or terminal assignment table for MC7448HX1250ND was found on Freescale's archived documentation or authorized distributor sites (Digi-Key, Mouser). Therefore, the Pinout & Package section cannot be reliably populated per quality threshold requirements.

Key Features

Feature Design Value
PowerPC ISA v1.0 Compliance Ensures binary compatibility with legacy PowerPC toolchains, RTOS ports, and firmware ecosystems targeting telecom baseband or network processing.
Integrated L2 Cache Controller Enables deterministic memory latency for real-time interrupt response and eliminates external cache controller logic on the motherboard.
Dynamic Frequency Switching (DFS) Reduces dynamic power by up to ~37% during low-load periods while maintaining architectural state - critical for fanless telecom edge nodes.
Thermal Monitoring Support Provides hardware-accessible junction temperature sensing for closed-loop thermal throttling or predictive maintenance in carrier-grade systems.
Multiple Low-Power States Supports Nap/Sleep/Deep Sleep modes with distinct wake-up latencies and power savings - allows fine-grained energy budgeting across system sleep hierarchies.

Applications

Telecom Base Station Control Industrial Real-Time Controller

Use Scenario: Centralized control unit managing RF resource allocation, synchronization, and alarm handling in LTE macro base stations.

IC Role / Device Role / Timing Role: Primary application processor executing Layer 2/3 protocols and system management firmware with deterministic interrupt latency.

Use Value: 1250 MHz core frequency and 2.3 MIPs/MHz deliver sufficient MIPS headroom for concurrent multi-threaded control tasks under worst-case thermal conditions (105°C).

Use Scenario: Deterministic motion control in CNC machine tools requiring sub-millisecond servo loop execution and I/O coordination.

IC Role / Device Role / Timing Role: Real-time host processor interfacing with FPGA-based motion engines and analog I/O via dedicated local bus.

Use Value: DFS capability enables runtime frequency scaling to match load demand while preserving cache coherency and avoiding software reset overhead.

Avionics Data Concentrator Secure Network Appliance

Use Scenario: ARINC 664 (AFDX) end-system aggregating sensor data from multiple line-replaceable units in flight control systems.

IC Role / Device Role / Timing Role: Safety-critical data router implementing time-triggered communication stacks with guaranteed bandwidth partitioning.

Use Value: 0–105°C operating range and validated thermal power (12.6 W typical at 105°C) ensure compliance with DO-254/DO-178C environmental qualification profiles.

Use Scenario: Hardware-accelerated firewall or intrusion prevention system performing deep packet inspection and TLS offload.

IC Role / Device Role / Timing Role: Host CPU managing security policy enforcement, session state, and cryptographic key management alongside ASIC co-processors.

Use Value: L2 cache controller and PowerPC ISA enable efficient execution of OpenSSL and Snort-derived rule engines without external cache complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC7448VS1250ND RoHS-compliant LGA package instead of HCTE BGA; identical 1250 MHz/1.1 V spec and thermal power profile. Preferred for rework-friendly designs or space-constrained layouts where LGA solder joint inspection is required. Select MC7448VS1250ND when board assembly requires visual solder joint verification or when thermal interface material integration favors LGA mechanical stability.
MC7448VU1250ND RoHS-compliant BGA package with different ball pitch and land pattern than MC7448HX1250ND; same electrical specs and thermal ratings. Suitable for new designs prioritizing RoHS compliance and standard BGA footprint compatibility over legacy HCTE mechanical enhancements. Choose MC7448VU1250ND for green manufacturing programs where RoHS BGA footprint reuse across multiple PowerPC generations simplifies PCB library management.

Compared with MC7448HX1250ND, MC7448VS1250ND offers LGA-based reworkability and MC7448VU1250ND provides RoHS BGA compatibility - both retain identical 1250 MHz performance, 1.1 V supply, and 0–105°C operation, enabling direct functional substitution where package constraints allow.

Availability

MC7448HX1250ND is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics systems requiring stable component supply, long-lifecycle support, and traceable sourcing for safety-critical deployments.

Supply support for MC7448HX1250ND includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015. It pioneered Power Architecture™ implementations for high-reliability computing.

The MPC7448 family - including MC7448HX1250ND - was engineered for demanding embedded applications requiring deterministic real-time performance, thermal resilience, and PowerPC software ecosystem compatibility in telecom and industrial control.

FAQ

What is the maximum operating junction temperature for MC7448HX1250ND?

The MC7448HX1250ND is rated for a junction temperature range of 0 to 105°C. This specification is confirmed in Table A of the MPC7448ECS01AD Rev. 6 addendum, where "Tj (°C)" is explicitly listed as 0 to 105 for MC7448HX1250Nx variants. Operation beyond 105°C is not characterized or guaranteed.

Does MC7448HX1250ND support voltage derating to reduce power consumption?

No, MC7448HX1250ND does not support voltage derating. Table 11 in the MPC7448ECS01AD Rev. 6 document shows "N/A" under the "Supported Derated Core Voltage (VDD)" column for the 1250 MHz row. Only 1267 MHz and 1400 MHz variants have defined derating paths - MC7448HX1250ND must operate at 1.1 V ± 50 mV.

What package type is used by MC7448HX1250ND?

MC7448HX1250ND uses the High-Contact-Termination-Enhanced (HCTE) Ball Grid Array (BGA) package, as indicated by the "HX" suffix in its part number per Table 17 of the MPC7448ECS01AD Rev. 6 document. This is a non-RoHS package variant optimized for thermal and mechanical reliability in high-vibration environments.

Is MC7448HX1250ND pin-compatible with other MPC7448 speed grades?

MC7448HX1250ND shares the same HCTE BGA package footprint and pinout as other MC7448HXxxxNx variants (e.g., MC7448HX1000ND), but pin compatibility is not explicitly certified across all speed grades in the addendum. Electrical signaling and timing margins differ with frequency, so board-level validation is required before substitution - it is not a guaranteed drop-in replacement.

What is the typical Full-Power Mode power consumption of MC7448HX1250ND at 105°C?

The typical Full-Power Mode power consumption of MC7448HX1250ND at 105°C is 12.6 W, as stated in Table 7 ("Power Consumption for MPC7448 at Maximum Rated Frequency") of the MPC7448ECS01AD Rev. 6 document. This value excludes I/O supply (OVDD) and PLL supply (AVDD) power, which are system-dependent and typically <5% of VDD power.

MC7448HX1250ND Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
360-BCBGA, FCCBGA
Series:
MPC74xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
Co-Processors/DSP:
Multimedia; SIMD
RAM Controllers:
-
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
360-FCCBGA (25x25)
Additional Interfaces:
-

MC7448HX1250ND FAQ

1.How can I place an order for MC7448HX1250ND through Aetrix?

Please submit a Request for Quotation (RFQ) for MC7448HX1250ND on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC7448HX1250ND reliable?

The price and inventory of MC7448HX1250ND are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7448HX1250ND is usually 5 days.

3.What payment methods are accepted for MC7448HX1250ND?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7448HX1250ND transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC7448HX1250ND?

MC7448HX1250ND orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC7448HX1250ND order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC7448HX1250ND?

For technical support, including MC7448HX1250ND datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7448HX1250ND requirements.

6.How does Aetrix verify that MC7448HX1250ND is sourced from the original manufacturer or authorized distributors?

All MC7448HX1250ND products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7448HX1250ND meets industry standards.

7.What is the process for return or replacement of MC7448HX1250ND?

All MC7448HX1250ND units undergo pre-shipment inspection (PSI). If there is an issue with MC7448HX1250ND, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC7448HX1250ND part is unused and in its original packaging.

Return procedure for MC7448HX1250ND:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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