NXP Semiconductors MC7448HX1700LD

Overview

MC7448HX1700LD from Freescale Semiconductor is a PowerPC™-based RISC microprocessor implementing the Power Architecture™ v1.0 instruction set, operating at 1700 MHz core frequency with 1.15 V ± 50 mV core supply voltage, rated for 0–105°C junction temperature, and packaged in a 360-ball FCCBGA (25 mm × 25 mm, 1.27 mm pitch). It serves as a high-performance embedded CPU in telecom infrastructure, industrial control, and military computing systems requiring deterministic real-time execution.

For engineers reviewing the MC7448HX1700LD datasheet, MC7448HX1700LD pinout, MC7448HX1700LD application, or MC7448HX1700LD equivalent, key selection considerations include its 1700 MHz maximum core frequency under 1.15 V operation, thermal power consumption of 13.7 W at 105°C, support for Dynamic Frequency Switching (DFS), and compatibility with MPC7448 hardware specification Rev. 3+ with addendum-specific derating rules.

Technical Context

The MC7448HX1700LD implements a superscalar, seven-stage pipeline PowerPC G4+ core with dual integer units, floating-point unit, and 1 MB on-die L2 cache. Its PLL supports VCO frequencies up to 1700 MHz and enables DFS modes (divide-by-2/divide-by-4) for dynamic power management.

It requires strict power sequencing per MPC7448 Hardware Specifications: VDD must be stable before AVDD and OVDD; core voltage derating to 1.0 V ± 50 mV is supported only when limiting fcore to 1000 MHz, reducing full-power mode thermal power from 13.7 W to 9.9 W.

Key Specifications

Pinout & Package

FCCBGA-360 package with 25 mm × 25 mm body, 1.27 mm ball pitch, ceramic substrate, and surface-mount mounting. MSL 1, unlimited floor life, peak reflow temperature 260°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded microprocessor applications.

Compared with MC7448HX1700LD, MC7447AX1300LD trades 400 MHz performance for 26% lower thermal load and simplified power delivery, while PPC7448HX1700NC offers identical specs but lacks production qualification-making MC7448HX1700LD the sole qualified 1700 MHz option for certified industrial and defense programs.

Availability

MC7448HX1700LD is available at Aetrix Electronics and suitable for telecom infrastructure, military computing, and industrial automation applications requiring stable component supply, long lifecycle support, and guaranteed obsolescence management.

Supply support for MC7448HX1700LD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions, later acquired by NXP Semiconductors in 2015. Its PowerPC portfolio served high-reliability markets for over two decades.

The MPC7448 family-including MC7448HX1700LD-was engineered for demanding embedded computing where deterministic timing, thermal resilience, and long-term availability outweigh consumer-grade cost optimization.

FAQ

What is the maximum validated core frequency for MC7448HX1700LD under nominal conditions?

The MC7448HX1700LD is fully characterized and tested at 1700 MHz core frequency with 1.15 V ± 50 mV VDD supply and junction temperature up to 105°C. This frequency is guaranteed across the full operating range per Table 8 in MPC7448ECS01AD Rev. 6. Operation above 1700 MHz is not supported or tested, and no binning or overclocking margin is specified for MC7448HX1700LD.

Does MC7448HX1700LD support Dynamic Frequency Switching (DFS), and what are the valid frequency ranges?

Yes, MC7448HX1700LD supports DFS with two enabled modes: divide-by-2 (850 MHz maximum) and divide-by-4 (425 MHz maximum), both with 250 MHz minimum. These ranges are validated per Table 8's fcore_DFS specification. DFS transitions occur in hardware without software intervention and maintain cache coherency, making MC7448HX1700LD suitable for adaptive power management in burst-workload systems.

What package type and ball count does MC7448HX1700LD use, and are there thermal pad requirements?

MC7448HX1700LD uses an FCCBGA-360 package (25 mm × 25 mm, 1.27 mm pitch) with ceramic substrate and 360 solder balls. It includes a center thermal pad (exposed die attach paddle) that must be soldered to a solid copper thermal plane on the PCB. Per Freescale hardware guidelines, this pad requires ≥80% solder coverage and connection to ≥4 internal ground planes for effective heat extraction-failure to implement this reduces thermal resistance by up to 40% and risks junction temperature exceedance.

How does the power consumption of MC7448HX1700LD compare across operational modes at 105°C?

At 105°C junction temperature, MC7448HX1700LD consumes 13.7 W in Full-Power Mode, 8.3 W in Nap Mode, 8.0 W in Sleep Mode, and 7.7 W in Deep Sleep Mode (PLL disabled). These values are measured at nominal 1.15 V VDD and reflect typical thermal conditions per Table 7. Deep Sleep Mode achieves lowest power by gating clocks to all execution units while retaining register state-critical for rapid wake-up in always-on industrial gateways using MC7448HX1700LD.

Is MC7448HX1700LD RoHS compliant, and what is its lead-free status?

MC7448HX1700LD is not RoHS compliant and contains lead (Pb) in its solder balls and die attach material. The "LD" suffix explicitly denotes leaded packaging per Freescale part numbering convention (Table 17). It is exempt from RoHS under Annex III Category 7(a) for high-melting-temperature solder, and is intended for applications where Pb-free reflow profiles would compromise joint reliability-such as high-vibration aerospace or high-thermal-cycle industrial environments deploying MC7448HX1700LD.