NXP Semiconductors MC7457RX1000LC
- Part No.:
- MC7457RX1000LC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 483-BCBGA, FCCBGA
- Datasheet:
-
MC7457RX1000LC.pdf
- Description:
- IC MPU MPC74XX 1.0GHZ 483FCCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC7457RX1000LC from Freescale Semiconductor is a 1.0 GHz PowerPC G4 RISC microprocessor with 512-Kbyte on-die L2 cache, 1.3-V core supply, and support for 1–4 MB external L3 SRAM via dedicated high-bandwidth interface. It implements full 32-bit PowerPC architecture with AltiVec SIMD unit, double-precision FPU, and superscalar seven-stage pipeline - deployed in high-performance networking and computing systems requiring deterministic real-time processing.
For engineers reviewing the MC7457RX1000LC datasheet, MC7457RX1000LC pinout, MC7457RX1000LC application, or MC7457RX1000LC equivalent, key selection considerations include L3 interface voltage configuration (1.5/1.8/2.5 V), MPX/60x bus protocol compatibility, thermal resistance (RθJA = 20°C/W), L2 cache latency (9-cycle L1 miss → L2 hit), and footprint compatibility with MPC7455 at 1.3-V core.
Technical Context
The MC7457RX1000LC integrates a superscalar core with four integer units, five-stage FPU, and four vector units supporting AltiVec instructions. Its memory subsystem uses separate instruction/data MMUs with 128-entry two-way TLBs, 32-Kbyte L1 caches (8-way set associative), and a fully pipelined 512-Kbyte unified L2 cache delivering 32 bytes/cycle to L1.
L3 interface operates at configurable core-to-L3 frequency divisors with 64-bit data bus, supports MSUG2 DDR/PB2/LW synchronous burst SRAMs, and enables private memory allocation (up to 2 MB of 4-MB total SRAM). Power management includes Nap/Sleep/Deep Sleep modes controlled via JTAG/COP interface and thermal exception handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 1.0 GHz - fixed clock rate enabling deterministic instruction throughput of up to three per cycle. |
| L2 Cache Size | 512-Kbyte unified - eight-way set associative, 64-byte line size, parity-protected, reduces main memory access pressure. |
| L3 Interface Support | 1/2/4 MB external SRAM - dedicated high-bandwidth interface with configurable cache/private memory split (max 2 MB cache). |
| Core Supply Voltage | 1.3 V ±50 mV - strict regulation required; exceeds OVDD/GVDD by ≤1.0 V during operation. |
| I/O Supply Options | 1.5 V / 1.8 V / 2.5 V - selected via L3VSEL/BVSEL pins sampled at ¬HRESET; defines input thresholds and drive strength. |
| Thermal Resistance | RθJA = 20°C/W - measured on natural convection, four-layer board; informs heatsink sizing for 105°C max junction temperature. |
| Package Type | 483-ball CBGA - ceramic ball grid array with 9.1 mm × 10.8 mm die, 0.13 μm CMOS process, 58 million transistors. |
Pinout & Package
MC7457RX1000LC uses a 483-ball ceramic ball grid array (CBGA) package with 1.27 mm pitch, designed for high-density routing and thermal dissipation in demanding embedded computing applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 1.3 V ±50 mV DC input; must be decoupled locally; violation risks logic corruption or latch-up. |
| OVDD | Processor bus I/O supply | Selectable 1.8 V or 2.5 V; sets output swing and input threshold for MPX/60x bus signals. |
| GVDD | L3 bus I/O supply | Selectable 1.5 V / 1.8 V / 2.5 V; configures L3 SRAM interface voltage and timing margins. |
| BVSEL | Bus voltage select | Samples at ¬HRESET to configure OVDD threshold; determines 1.8 V or 2.5 V processor bus mode. |
| L3VSEL | L3 voltage select | Samples at ¬HRESET to configure GVDD threshold; enables 1.5 V (DDR), 1.8 V (PB2), or 2.5 V (LW) L3 modes. |
| SYSCLK | System clock input | Differential or single-ended reference; drives internal PLL; VIH/VIL thresholds scale with OVDD. |
| HRESET | Hardware reset input | Active-low asynchronous reset; samples BVSEL/L3VSEL to lock I/O voltage configuration on deassertion. |
Key Features
| Feature | Design Value |
|---|---|
| AltiVec SIMD Engine | Four vector units (VIU1/VIU2/VFPU/VPU) with 32-entry VR file - accelerates media processing, signal analysis, and cryptographic operations without software emulation. |
| Branch Prediction | 128-entry BTIC + 2048-entry BHT + 8-entry link stack - reduces misprediction penalty to 6 cycles and enables speculative execution of up to three branches. |
| L1 Cache Architecture | 32-Kbyte instruction + 32-Kbyte data, eight-way set associative, PLRU replacement - delivers four instructions or four words per cycle with hardware MESI coherency. |
| Power Management Modes | Nap/Sleep/Deep Sleep - halts instruction fetch, disables snooping, or stops PLL to reduce dynamic/static power while preserving state or enabling fast wake-up. |
| JTAG Boundary Scan | IEEE 1149.1 compliant - enables in-system testability, debug visibility, and production-level fault isolation without physical probe access. |
Applications
| Network Router Control Plane | High-End Print Controller |
|---|---|
Use Scenario: Real-time packet classification, ACL enforcement, and control-plane protocol stacks (BGP/OSPF) in carrier-grade routers. IC Role / Device Role / Timing Role: Primary system controller executing Linux-based network OS with deterministic interrupt latency and AltiVec-accelerated crypto offload. Use Value: 1.0 GHz core + 512-Kbyte L2 cache sustains >800 MIPS sustained throughput under multi-threaded forwarding control load. | Use Scenario: RIP-to-print-stream conversion, color space transformation, and raster image processing in enterprise multifunction printers. IC Role / Device Role / Timing Role: Main application processor managing USB/Ethernet host interfaces, flash storage, and parallel print engine timing via MPX bus. Use Value: AltiVec vector units execute 16×16 pixel transforms in single-cycle throughput, reducing RIP latency by 42% vs scalar-only implementation. |
| Medical Imaging Workstation | Avionics Data Concentrator |
Use Scenario: DICOM image reconstruction, real-time DICOM streaming, and UI rendering in portable ultrasound and MRI consoles. IC Role / Device Role / Timing Role: High-reliability compute node interfacing with FPGA-accelerated FFT engines and dual-channel DDR2 memory controllers. Use Value: L3 interface supports 2 MB private SRAM for zero-latency frame buffering, eliminating DRAM contention during burst acquisition windows. | Use Scenario: ARINC 664 (AFDX) end-system aggregation, time-triggered scheduling, and health monitoring in flight control computers. IC Role / Device Role / Timing Role: Deterministic real-time processor implementing DO-254-compliant partitioning with JTAG debug trace and thermal exception signaling. Use Value: Thermal management registers and performance monitor enable runtime validation of worst-case execution time (WCET) under 105°C junction conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7455EC | Same 483-ball CBGA footprint, 900 MHz max frequency, 256-Kbyte L2 cache, no L3 interface support. | Lower thermal envelope (RθJA = 22°C/W), suitable for cost-sensitive telecom line cards without L3 expansion. | Select MPC7455EC when L3 SRAM is unnecessary and 900 MHz performance suffices with reduced power budget. |
| MPC7447A | Identical core architecture and L2 cache, but omits L3 interface; supports same 1.3-V core and 1.8/2.5-V I/O; available in 360-ball CBGA. | Smaller package reduces PCB area and routing complexity; used in space-constrained embedded controllers where L3 is unused. | Choose MPC7447A for footprint-constrained designs needing identical compute capability without L3 expansion path. |
Compared with MPC7455EC and MPC7447A, MC7457RX1000LC provides higher clock rate (1.0 GHz), larger L2 cache (512 KB), and unique L3 interface - making it optimal for applications requiring sustained bandwidth to external SRAM, while MPC7455EC and MPC7447A serve lower-power or space-constrained alternatives without L3 dependency.
Availability
MC7457RX1000LC is available at Aetrix Electronics and suitable for network router control planes, medical imaging workstations, avionics data concentrators, and high-end print controllers requiring stable component supply across extended product lifecycles.
Supply support for MC7457RX1000LC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
The MPC7457 belongs to Freescale's PowerPC G4 microprocessor family, designed specifically for high-performance embedded computing applications demanding AltiVec acceleration, large on-die cache, and deterministic real-time behavior in networking and signal processing systems.
FAQ
What is the maximum operating frequency of the MC7457RX1000LC?
The MC7457RX1000LC is rated for a fixed maximum operating frequency of 1.0 GHz. This speed is guaranteed under recommended operating conditions including 1.3 V ±50 mV core supply, 105°C maximum junction temperature, and proper decoupling. The device does not support frequency scaling beyond this rating, and overclocking is not supported or characterized.
Does the MC7457RX1000LC support L3 cache configuration with 4 MB of external SRAM?
Yes, the MC7457RX1000LC supports up to 4 MB of total external SRAM via its L3 interface, but only 2 MB may be configured as cache memory; the remaining 2 MB must be allocated as private memory or left unused. This constraint is enforced by the internal L3 cache controller and documented in the hardware specification Rev. 8.
What are the valid I/O voltage configurations for the MC7457RX1000LC processor bus?
The MC7457RX1000LC processor bus supports two I/O voltage configurations: 1.8 V ±5% (BVSEL = 0) or 2.5 V ±5% (BVSEL = HRESET or OVDD). These settings are latched at ¬HRESET and determine both input thresholds and output drive levels - mixing voltages within one bus is not permitted.
Is the MC7457RX1000LC pin-compatible with the MPC7455?
Yes, the MC7457RX1000LC is footprint-compatible and functions as a drop-in replacement for the MPC7455 in applications using a 1.3-V core supply. However, differences in L2 cache size (512 KB vs 256 KB) and L3 interface presence require validation of timing margins and software cache management routines before substitution.
What thermal management features does the MC7457RX1000LC provide?
The MC7457RX1000LC includes hardware-enforced thermal management via three supervisor-level registers and a dedicated thermal management exception. It supports instruction cache throttling, Nap/Sleep/Deep Sleep power modes, and software-controllable thermal shutdown - all accessible through the MPC7457-specific thermal management unit referenced in the hardware specification.
MC7457RX1000LC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 483-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 483-FCCBGA (29x29)
- Additional Interfaces:
- -
MC7457RX1000LC FAQ
1.How can I place an order for MC7457RX1000LC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC7457RX1000LC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC7457RX1000LC reliable?
The price and inventory of MC7457RX1000LC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC7457RX1000LC is usually 5 days.
3.What payment methods are accepted for MC7457RX1000LC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC7457RX1000LC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC7457RX1000LC?
MC7457RX1000LC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC7457RX1000LC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC7457RX1000LC?
For technical support, including MC7457RX1000LC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC7457RX1000LC requirements.
6.How does Aetrix verify that MC7457RX1000LC is sourced from the original manufacturer or authorized distributors?
All MC7457RX1000LC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC7457RX1000LC meets industry standards.
7.What is the process for return or replacement of MC7457RX1000LC?
All MC7457RX1000LC units undergo pre-shipment inspection (PSI). If there is an issue with MC7457RX1000LC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC7457RX1000LC part is unused and in its original packaging.
Return procedure for MC7457RX1000LC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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