NXP Semiconductors MC8610TPX800GB

Overview

MC8610TPX800GB from Freescale Semiconductor is a high-performance 32-bit Power Architecture™ e600-core integrated host processor with 256-Kbyte L2 cache (ECC), dual PCI Express® controllers (x1/x2/x4/x8), DDR2 memory controller supporting up to 533-MHz data rate, and integrated display interface unit (1280×1024 @ 60 Hz). It serves as a system-on-chip host controller in telecom infrastructure and industrial control systems requiring deterministic I/O, multi-protocol connectivity, and real-time processing.

For engineers reviewing the MC8610TPX800GB datasheet, MC8610TPX800GB pinout, MC8610TPX800GB application, or MC8610TPX800GB equivalent, key selection criteria include its 800 MHz core frequency, 783-pin FC-PBGA package, dual PCIe lanes with configurable link widths, DDR2 SDRAM timing compliance, and integrated MPX coherency module for multiprocessing support.

Technical Context

The MC8610TPX800GB implements the Power Architecture e600 core with eleven execution units, separate 32-Kbyte L1 instruction and data caches, and an integrated 256-Kbyte unified L2 cache with ECC protection. Its memory subsystem includes a 64-bit DDR2 controller supporting up to 16 Gbytes and 533-MHz data rates, plus an enhanced local bus controller (eLBC) operating at up to 133 MHz with eight chip selects.

It integrates dual PCI Express 1.0a controllers - one supporting x1/x2/x4 links and the other x1/x2/x4/x8 - each operating at 2.5 Gbaud per lane. The device also embeds a display interface unit with parallel TTL output, OpenPIC-compliant interrupt controller, dual I²C masters, DUART, SPI, SSI, and two four-channel DMA controllers accessible by both local and remote masters.

Key Specifications

Pinout & Package

MC8610TPX800GB uses a 783-pin FC-PBGA package with 35 distinct power domains (VDD_Core, GVDD, BVDD, OVDD, S1VDD, X1VDD, etc.) and dedicated analog/thermal sensing pins (TEMP_ANODE/CATHODE, SENSEVDD/VSS). Pin assignments follow Freescale's MPC8610EC Rev. 2 specification, including multiplexed functions such as LA10/SSI1_TXD (P19), DIU_LD[15:0]/GPIO1[31:16] (T3–V6), and PCIe differential pairs (SD1_TX[3:0], SD2_RX[7:0]).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated host processor applications.

Compared with MPC8641DZQALG and P2020NSN2KFC, MC8610TPX800GB uniquely balances 800-MHz deterministic performance, integrated DIU for HMI, eLBC for flash/FPGA control, and dual PCIe for expansion-making it optimal for consolidated industrial and telecom edge platforms where peripheral integration reduces board area and BOM count.

Availability

MC8610TPX800GB is available at Aetrix Electronics and suitable for telecom line card control, industrial HMI systems, multi-protocol gateways, and ruggedized network appliances requiring stable component supply across extended product lifecycles.

Supply support for MC8610TPX800GB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC8610 product line was designed as a highly integrated Power Architecture host processor targeting telecom infrastructure, industrial control, and multimedia edge devices requiring consolidated I/O, multiprocessing coherence, and deterministic real-time response.

FAQ

What is the maximum DDR2 data rate supported by the MC8610TPX800GB?

The MC8610TPX800GB supports up to 533-MHz DDR2 data rates, corresponding to PC2-4200 bandwidth. This is achieved through its integrated 64-bit DDR2 memory controller with on-die termination calibration (MDIC[0:1]) and programmable write leveling, enabling reliable operation with standard DDR2-533 modules without external PHY assistance. The MC8610TPX800GB datasheet specifies timing compliance under 1.8 V and 2.5 V GVDD conditions.

Does the MC8610TPX800GB include a built-in display controller, and what resolutions does it support?

Yes, the MC8610TPX800GB includes an integrated Display Interface Unit (DIU) supporting maximum resolution of 1280×1024 at 60 Hz with 24-bit color depth. It outputs parallel TTL signals (DIU_LD[23:0], DIU_HSYNC, DIU_VSYNC, DIU_DE, DIU_CLK_OUT) directly compatible with LVDS transmitters or panel timing controllers. The DIU operates independently of the e600 core, allowing concurrent graphics generation and application processing without resource contention.

How many PCI Express lanes does the MC8610TPX800GB provide, and what link widths are configurable?

The MC8610TPX800GB provides two independent PCI Express controllers: Controller 1 supports x1, x2, or x4 link widths; Controller 2 supports x1, x2, x4, or x8. Each lane operates at 2.5 Gbaud (PCIe 1.0a), delivering up to 2.0 Gbps per lane. Configuration is performed via reset configuration pins (cfg_pci_impd, cfg_pci_arb) and software registers; physical pin mapping follows the SD1/SD2 SerDes banks as defined in the MPC8610EC Rev. 2 datasheet.

What package type and pin count does the MC8610TPX800GB use?

The MC8610TPX800GB uses a 783-pin flip-chip plastic ball grid array (FC-PBGA) package. This package features 35 distinct power domains (including VDD_Core, GVDD, BVDD, OVDD, S1VDD, X1VDD, etc.), dedicated thermal sensing pins (TEMP_ANODE/CATHODE), and voltage-sensing pins (SENSEVDD/VSS). Mechanical dimensions and solder mask specifications are documented in Section 5 of the MPC8610EC Rev. 2 datasheet.

Is the MC8610TPX800GB suitable for extended temperature industrial applications?

Yes, the MC8610TPX800GB is rated for a junction temperature range of –40°C to 105°C, making it suitable for extended temperature industrial deployments. Its thermal design requires proper PCB copper pour, thermal vias under the package, and adherence to Freescale's recommended power supply decoupling and sequencing (Section 3.2 of MPC8610EC Rev. 2). The TEMP_ANODE and TEMP_CATHODE pins enable on-board thermal monitoring via external circuitry.