Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC8641DHX1000NE

Part No.:
MC8641DHX1000NE
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1023-BBGA, FCBGA
Datasheet:
AetrixMC8641DHX1000NE.pdf
Description:
IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,824

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC8641DHX1000NE from Freescale Semiconductor is a single-core Power Architecture® e600-based integrated host processor targeting networking, storage, and wireless infrastructure applications. It features a 32-bit superscalar CPU with 32-Kbyte L1 instruction and data caches, 1-Mbyte unified L2 cache with ECC, dual 64-bit DDR/DDR2 memory controllers (72-bit with ECC), four enhanced three-speed Ethernet controllers (10/100/1000 Mbps), PCI Express 1.0a x1/x2/x4/x8 interface, and Serial RapidIO 1.2 1x/4x support.

For engineers reviewing the MC8641DHX1000NE datasheet, MC8641DHX1000NE pinout, MC8641DHX1000NE application, or MC8641DHX1000NE equivalent, key selection considerations include its 1000 MHz core frequency, 0.95 V core supply requirement, 1023-pin FC-CBGA package, dual DDR2-533 support, and eTSEC interface flexibility across MII/RGMII/TBI physical layers.

Technical Context

The MC8641DHX1000NE implements a single e600 core with eleven independent execution units, separate instruction and data MMUs, and hardware multiprocessing support. Its MPX coherency module enables scalable platform bus interconnect, while ATMUs provide eight local address windows and configurable inbound/outbound translations for PCI Express and Serial RapidIO.

Memory subsystem includes two independent 64-bit DDR/DDR2 controllers supporting up to 300-MHz clocking and 16 Gbytes per channel, with cache-line and page interleaving. The four eTSECs integrate TCP/IP offload, VLAN handling, RMON statistics, and MII management interfaces - all compliant with IEEE 802.3/802.3u/802.3z standards.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitecturePower Architecture e600 single-core, 32-bit superscalar with 11 execution units and 3 register files
Core Frequency1000 MHz - determines maximum instruction throughput and real-time processing latency
L1 Cache32-Kbyte instruction + 32-Kbyte data - reduces average memory access time for critical code and data
L2 Cache1-Mbyte unified with ECC - improves bandwidth efficiency and system reliability for multi-threaded workloads
Memory InterfaceDual 64-bit DDR/DDR2 controllers (72-bit with ECC) at up to 533 MT/s - supports up to 32 Gbytes total DRAM with error correction
eTSEC Count & SpeedFour 10/100/1000 Mbps Ethernet controllers - enables quad-port routing, switching, or network appliance designs
High-Speed I/OPCI Express 1.0a x1/x2/x4/x8 + Serial RapidIO 1.2 1x/4x - provides flexible backplane or chip-to-chip interconnect options

Pinout & Package

MC8641DHX1000NE is housed in a 1023-pin Hi-CTE flip-chip ceramic ball grid array (FC-CBGA) package with 35 × 35 mm body size and 1.0 mm ball pitch. Thermal design requires solder sphere reflow profile compliance per J-STD-020 and underfill for mechanical reliability.

Pin/TerminalCircuit RoleDesign Meaning
VDD_Core0Core power supply0.95 V ± 50 mV nominal - must be sequenced before DDR supplies and tracked within 100 mV of AVDD_Core0
D1_GVDD / D2_GVDDDDR2 I/O supply1.8 V ± 90 mV - powers DDR2 SDRAM interface pins; referenced to Dn_MVREF = Dn_GVDD/2 ± 1%
LVDD / TVDDeTSEC I/O supply2.5 V or 3.3 V - selects electrical interface mode (RMII/MII vs GMII/RGMII/TBI); impacts receiver threshold and drive strength
OVDDGeneral-purpose I/O supply3.3 V ± 165 mV - powers DUART, Local Bus, I2C, JTAG, and interrupt logic; defines CMOS input thresholds
HRESETHard reset inputActive-low synchronous reset - must be asserted ≥100 µs after power stabilization and PLL relock completion
SYSCLKSystem clock inputDriven externally - enables clock domain synchronization; must be stable before HRESET deassertion

Key Features

FeatureDesign Value
Integrated L2 cache with ECC1-Mbyte unified cache detects and corrects single-bit errors - eliminates external error-correction logic and improves system MTBF
Four eTSECs with TCP/IP offloadHardware-accelerated checksum, header parsing, and VLAN tagging - reduces CPU load by ~30% in packet-forwarding applications
Dual DDR2-533 memory controllersIndependent 64-bit channels with interleaving - delivers >6.4 GB/s aggregate bandwidth for high-throughput data plane processing
PCI Express 1.0a x8 support2.5 Gbaud serial link - enables direct attachment to network interface cards or FPGA accelerators without bridge chips
Serial RapidIO 1.2 4x interface2.5 Gbps per lane - supports deterministic low-latency interconnect for distributed control systems and baseband processing

Applications

Wireless Base Station Control PlaneEnterprise Network Appliance

Use Scenario: Host processor for LTE macrocell BTS control plane managing radio resource allocation, OAM, and backhaul protocol stacks.

IC Role / Device Role / Timing Role: Central command and control unit executing Linux BSP, running SNMP agents, and coordinating eTSEC-based S1/X2 interface traffic.

Use Value: Dual DDR2-533 channels sustain concurrent IPsec, SCTP, and GTP-U processing; eTSEC FIFO mode enables zero-copy packet buffering for sub-50 µs latency.

Use Scenario: Unified threat management (UTM) appliance performing firewall, IPS, and SSL inspection on 1–4 Gbps WAN links.

IC Role / Device Role / Timing Role: Main application processor executing multi-threaded security services while offloading crypto and packet classification to dedicated engines.

Use Value: Four eTSECs support full-duplex 1 Gbps ports with VLAN isolation; L2 cache ECC prevents silent corruption during long-duration deep-packet inspection.

Industrial Storage ControllerAvionics Data Concentrator Unit

Use Scenario: RAID controller for ruggedized NAS systems requiring hot-swap SATA/SAS expansion and real-time RAID 5/6 parity calculation.

IC Role / Device Role / Timing Role: Embedded host processor interfacing with PCIe-to-SATA bridges and managing DDR2-backed write-cache buffers.

Use Value: PCI Express x4 interface provides dedicated 2 GB/s bandwidth to storage fabric; programmable DDR drive strength ensures signal integrity over 10 cm PCB traces.

Use Scenario: ARINC 664 Part 7 (AFDX) end-system node aggregating sensor data from flight control, navigation, and health monitoring subsystems.

IC Role / Device Role / Timing Role: Deterministic timing host executing DO-178C-certifiable partitioned software with guaranteed eTSEC transmission deadlines.

Use Value: eTSEC timestamping and quality-of-service registers enable sub-millisecond jitter control; 1023-pin FC-CBGA meets MIL-STD-883 thermal cycling requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated host processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC8641DZX1000NEDual-core variant with identical 1000 MHz frequency, same FC-CBGA package, but higher thermal envelope (25.0 W max vs 16.5 W)Requires additional thermal management and power sequencing for second core; suitable only when symmetric multiprocessing is requiredSelect MC8641DZX1000NE only if workload demands true SMP parallelism; otherwise MC8641DHX1000NE offers lower power and simpler board layout.
P2020NXE2KFCFreescale QorIQ P2 series successor: dual e500mc cores, 1.2 GHz, integrated security engine, DDR3 support, but no Serial RapidIOLacks Serial RapidIO and has different pinout; requires PCB redesign and BSP migration; supports newer cryptographic accelerationChoose P2020NXE2KFC for new designs needing AES/SHA acceleration and DDR3; retain MC8641DHX1000NE for legacy RapidIO or DDR2-based platforms.

Compared with MPC8641DZX1000NE, MC8641DHX1000NE reduces thermal design complexity and power delivery cost by eliminating dual-core overhead, while retaining identical peripheral sets and software compatibility. Against P2020NXE2KFC, it maintains Serial RapidIO and DDR2 support critical for aerospace and telecom upgrades where backward interconnect compatibility is mandatory.

Availability

MC8641DHX1000NE is available at Aetrix Electronics and suitable for wireless infrastructure, enterprise networking, and industrial storage applications requiring stable component supply across extended product lifecycles.

Supply support for MC8641DHX1000NE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors and analog devices, acquired by NXP Semiconductors in 2015. Its Power Architecture portfolio served high-performance networking and telecom markets.

The MPC8641 family was engineered specifically for carrier-grade communications equipment, emphasizing deterministic Ethernet timing, DDR2 memory bandwidth, and RapidIO/PCIe interconnect flexibility in thermally constrained environments.

FAQ

What is the core voltage requirement for MC8641DHX1000NE?

The MC8641DHX1000NE requires a nominal core supply voltage of 0.95 V ± 50 mV, as specified in Table 2 of the hardware specifications document. This voltage must be applied before DDR I/O supplies and maintained within 100 mV of the associated AVDD_Core0 supply. Deviation beyond this tolerance risks timing violations or functional failure during 1000 MHz operation.

Does MC8641DHX1000NE support DDR2-600 memory?

No, MC8641DHX1000NE does not support DDR2-600. Its DDR2 interface is rated for up to 533 MT/s (DDR2-533), as confirmed in Section 1.1 "Key Features" and Table 6 "Power Dissipation (Single Core)" which lists 500 MHz platform frequency at 1000 MHz core speed. The 600 MHz DDR2 rate is only supported on higher-frequency variants like the 1500 MHz MPC8641D.

How many eTSEC controllers does MC8641DHX1000NE integrate?

The MC8641DHX1000NE integrates exactly four enhanced three-speed Ethernet controllers (eTSECs), each supporting 10/100/1000 Mbps operation. This is explicitly stated in Section 1.1 "Key Features" and illustrated in Figure 1. All four eTSECs support MII, RMII, GMII, RGMII, TBI, and RTBI physical interfaces with full-duplex FIFO mode capability.

What package type is used for MC8641DHX1000NE?

MC8641DHX1000NE uses a 1023-pin Hi-CTE flip-chip ceramic ball grid array (FC-CBGA) package, as documented in Section 16 "Package" and the Overview section. The package has a 35 × 35 mm body size and 1.0 mm ball pitch, requiring controlled solder reflow and underfill for reliable mounting in vibration-prone environments.

Is Serial RapidIO support available on MC8641DHX1000NE?

Yes, MC8641DHX1000NE includes a Serial RapidIO 1.2 interface supporting both 1x and 4x LP-Serial link configurations at 1.25/2.5/3.125 Gbaud per lane. This is confirmed in Section 1.1 "Key Features" and Figure 1, where the "AND 1x/4x SRIO (2.5 GB/s)" block is shown adjacent to the e600 core block - a feature retained across all MPC8641 variants including the single-core MC8641DHX1000NE.

MC8641DHX1000NE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1023-BBGA, FCBGA
Series:
MPC86xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
-
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100/1000Mbps (4)
SATA:
-
USB:
-
Voltage - I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1023-FCCBGA (33x33)
Additional Interfaces:
DUART, HSSI, I2C, RapidIO

MC8641DHX1000NE FAQ

1.How can I place an order for MC8641DHX1000NE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC8641DHX1000NE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC8641DHX1000NE reliable?

The price and inventory of MC8641DHX1000NE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC8641DHX1000NE is usually 5 days.

3.What payment methods are accepted for MC8641DHX1000NE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC8641DHX1000NE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC8641DHX1000NE?

MC8641DHX1000NE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC8641DHX1000NE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC8641DHX1000NE?

For technical support, including MC8641DHX1000NE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC8641DHX1000NE requirements.

6.How does Aetrix verify that MC8641DHX1000NE is sourced from the original manufacturer or authorized distributors?

All MC8641DHX1000NE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC8641DHX1000NE meets industry standards.

7.What is the process for return or replacement of MC8641DHX1000NE?

All MC8641DHX1000NE units undergo pre-shipment inspection (PSI). If there is an issue with MC8641DHX1000NE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC8641DHX1000NE part is unused and in its original packaging.

Return procedure for MC8641DHX1000NE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC8641DHX1000NE Tags

  • MC8641DHX1000NE
  • MC8641DHX1000NE PDF
  • MC8641DHX1000NE Datasheet
  • MC8641DHX1000NE Specifications
  • MC8641DHX1000NE Images
  • NXP Semiconductors
  • NXP Semiconductors MC8641DHX1000NE
  • Buy MC8641DHX1000NE
  • MC8641DHX1000NE Price
  • MC8641DHX1000NE Distributor
  • MC8641DHX1000NE Supplier
  • MC8641DHX1000NE Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER