NXP Semiconductors MC8641DTVU1333JE

Overview

MC8641DTVU1333JE from Freescale Semiconductor is a single-core Power Architecture® e600-based integrated host processor with 32-Kbyte L1 instruction and data caches, 1-Mbyte unified L2 cache with ECC, dual 64-bit DDR/DDR2 SDRAM controllers (72-bit with ECC), four enhanced three-speed Ethernet controllers (10/100/1000 Mbps), PCI Express 1.0a (x1/x2/x4/x8), Serial RapidIO 1.2 (1x/4x, 2.5 Gbps/lane), and integrated MPX coherency module - deployed in networking infrastructure, wireless baseband units, and storage control systems.

For engineers reviewing the MC8641DTVU1333JE datasheet, MC8641DTVU1333JE pinout, MC8641DTVU1333JE application, or MC8641DTVU1333JE equivalent, key selection considerations include its 1333 MHz core frequency at 1.05 V nominal supply, dual DDR2-533 support with ECC, eTSEC interface flexibility (MII/RGMII/TBI), PCIe 2.5 Gbaud lane compliance, and FC-CBGA-1023 package thermal and power sequencing requirements.

Technical Context

The MC8641DTVU1333JE implements a superscalar e600 core with eleven execution units, separate instruction/data MMUs, 36-bit real addressing, and performance monitoring. Its memory subsystem integrates two independent DDR/DDR2 controllers supporting up to 300-MHz clock rates and 600-MHz DDR2 data rates, with cache line and page interleaving across controllers.

Connectivity includes four eTSECs compliant with IEEE 802.3/802.3u/802.3ab, supporting full-duplex FIFO mode and TCP/IP offload; one PCI Express 1.0a interface (x1/x2/x4/x8); and one Serial RapidIO 1.2 interface (1x/4x, 2.5 Gbps/lane). All high-speed I/O uses dedicated voltage domains (SVDD, XVDD_SRDSn, AVDD_SRDSn) with strict power-up sequencing.

Key Specifications

Pinout & Package

MC8641DTVU1333JE is housed in a 1023-pin Hi-CTE flip-chip ceramic ball grid array (FC-CBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for junction temperature management up to 105°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated host processor applications.

Compared with MPC8641DVTU1333JE and P2020NSN2KFC, MC8641DTVU1333JE offers optimal balance of single-core determinism, four eTSECs, and SRIO connectivity for wireless infrastructure - without the dual-core overhead or QorIQ's security-focused feature set.

Availability

MC8641DTVU1333JE is available at Aetrix Electronics and suitable for wireless infrastructure, enterprise storage, industrial gateways, and media server edge nodes requiring stable component supply across extended product lifecycles.

Supply support for MC8641DTVU1333JE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance Power Architecture processors for networking, telecom, and industrial control applications before its 2015 acquisition.

The MPC8641 product line targets integrated host processor roles in carrier-grade infrastructure, emphasizing deterministic e600 core performance, multi-protocol I/O (eTSEC/SRIO/PCIe), and DDR2 memory reliability - specifically for systems demanding real-time packet processing and hardware offload.

FAQ

What is the maximum DDR2 data rate supported by MC8641DTVU1333JE?

The MC8641DTVU1333JE supports DDR2-533 operation, delivering a 533-MHz data rate per pin (1066 MT/s) on each of its dual 64-bit DDR2 interfaces. This is validated at 1.8 V ±90 mV supply with Dn_MVREF = Dn_GVDD/2 ±1%, and enables up to 8.5 GB/s aggregate memory bandwidth when both controllers operate concurrently. The device does not support DDR2-667 or higher rates.

Does MC8641DTVU1333JE support PCIe 2.0 or only PCIe 1.0a?

MC8641DTVU1333JE implements PCI Express 1.0a specification only, operating at 2.5 Gbaud per lane with 2.0 Gbps effective throughput. It does not support PCIe 2.0 (5.0 Gbaud) signaling or associated features such as ASPM L1 substates or enhanced transaction ordering. The interface is fully backward-compatible with PCIe 1.0 and 1.0a root complexes and endpoints.

What are the required power supply sequencing constraints for MC8641DTVU1333JE?

MC8641DTVU1333JE mandates strict power-up order: all non-DDR supplies (VDD_PLAT, AVDD_PLAT, VDD_Core0, OVDD, etc.) must reach ≥90% of nominal value before Dn_GVDD and Dn_MVREF rise above 10% of their target. SYSCLK must be applied only after all supplies are stable. Power-down follows reverse order: DDR supplies first, then others. Violation risks initialization failure or silicon latch-up.

How many eTSEC interfaces does MC8641DTVU1333JE provide, and what physical layers are supported?

MC8641DTVU1333JE integrates four enhanced three-speed Ethernet controllers (eTSECs), each independently configurable for 10/100/1000 Mbps operation. Supported physical interfaces include MII, RMII, GMII, RGMII, TBI, and RTBI - enabling direct connection to diverse PHYs without external glue logic. Each eTSEC supports full-duplex FIFO mode for ASIC-to-ASIC interconnect.

Is MC8641DTVU1333JE pin-compatible with any dual-core variant?

Yes, MC8641DTVU1333JE is pin-compatible with the dual-core MPC8641DVTU1333JE - sharing identical FC-CBGA-1023 package, ball map, power delivery requirements, and signal definitions. The only functional differences are core count (1 vs. 2), L2 cache coherency behavior, and thermal/power profiles. PCB layout and power delivery can be reused across both variants.