NXP Semiconductors MC8641DVU1500KE

Overview

MC8641DVU1500KE from Freescale Semiconductor is a single-core Power Architecture® e600-based integrated host processor designed for networking, storage, and wireless infrastructure applications. It features a 1.5 GHz e600 core, 32-Kbyte L1 instruction and data caches, 1-Mbyte unified L2 cache with ECC, dual 64-bit DDR/DDR2 memory controllers (72-bit with ECC), and four enhanced three-speed Ethernet controllers (10/100/1000 Mbps). It operates at 1.1 V core voltage with 65°C typical junction temperature.

For engineers reviewing the MC8641DVU1500KE datasheet, MC8641DVU1500KE pinout, MC8641DVU1500KE application, or MC8641DVU1500KE equivalent, key selection considerations include its 1023-pin FC-CBGA package, PCIe 1.0a x1/x2/x4/x8 interface, Serial RapidIO 1.2 support (1.25–3.125 Gbaud), MPX coherency module, and programmable interrupt controller compliant with OpenPIC architecture.

Technical Context

The MC8641DVU1500KE implements a superscalar 32-bit PowerPC ISA core with eleven execution units, separate instruction/data MMUs, and hardware multiprocessing support. Its memory subsystem includes dual DDR/DDR2 SDRAM controllers supporting up to 300-MHz clock rates and 600-MHz DDR2 operation, with cache line and page interleaving across controllers.

Connectivity is provided via four eTSECs supporting MII, RMII, GMII, RGMII, TBI, and RTBI interfaces; a PCI Express 1.0a interface with x1/x2/x4/x8 link widths; and a Serial RapidIO interface compliant with Revision 1.2, supporting 1x/4x LP-Serial links at 2.5 Gbps per lane. The device integrates a four-channel DMA controller, dual I²C controllers, and IEEE 1149.1 JTAG boundary scan.

Key Specifications

Pinout & Package

MC8641DVU1500KE is housed in a 1023-pin Hi-CTE flip-chip ceramic ball grid array (FC-CBGA) package with 35 × 35 mm body size and 1.0 mm ball pitch. Thermal design requires solder sphere reflow profile compliance per IPC/JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated host processor applications.

Compared with MPC8641DVT1333K and P2020NXE2KFC, MC8641DVU1500KE uniquely balances high single-thread performance (1.5 GHz), quad eTSECs, and RapidIO+PCIe dual-serial flexibility-making it optimal for throughput-bound, multi-interface infrastructure nodes where deterministic latency and interface diversity are critical.

Availability

MC8641DVU1500KE is available at Aetrix Electronics and suitable for wireless infrastructure, enterprise storage, and industrial Ethernet applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for MC8641DVU1500KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC8641 family was designed as a high-performance integrated host processor targeting carrier-grade networking, wireless base station control, and storage infrastructure-emphasizing multi-protocol serial interconnect, hardware-accelerated networking, and robust cache-coherent multiprocessing.

FAQ

What is the core architecture and clock frequency of the MC8641DVU1500KE?

The MC8641DVU1500KE features a single Power Architecture e600 core operating at 1.5 GHz. It implements the PowerPC ISA with superscalar execution, eleven independent execution units, and separate instruction/data MMUs. This core delivers >3400 Dhrystone MIPS and supports 36-bit real addressing, making MC8641DVU1500KE suitable for demanding control-plane processing in telecom infrastructure where single-thread performance is critical.

Does the MC8641DVU1500KE support both DDR and DDR2 memory, and what are the maximum data rates?

Yes, MC8641DVU1500KE supports both DDR and DDR2 SDRAM via dual 64-bit controllers (72-bit with ECC). It supports DDR up to 300 MHz (600 MT/s) and DDR2 up to 300 MHz (600 MT/s), enabling up to 16 GB per controller. The memory interface uses SSTL-25 signaling for DDR and SSTL-18 for DDR2, with Dn_MVREF referenced to Dn_GVDD/2 ± 1%, ensuring signal integrity in high-speed memory subsystems.

How many Ethernet controllers does the MC8641DVU1500KE integrate, and what physical layer interfaces do they support?

The MC8641DVU1500KE integrates four enhanced three-speed Ethernet controllers (eTSECs), each supporting 10/100/1000 Mbps speeds and IEEE 802.3/3u/3x/3z/3ac/3ab standards. They support MII, RMII, GMII, RGMII, TBI, and RTBI physical interfaces. MC8641DVU1500KE also provides TCP/IP offload, VLAN handling, and RMON statistics-enabling quad-port Gigabit switching without external NICs.

What high-speed serial interconnect options are available on the MC8641DVU1500KE?

MC8641DVU1500KE provides two complementary high-speed serial interconnects: PCI Express 1.0a (supporting x1/x2/x4/x8 link widths at 2.5 Gbaud) and Serial RapidIO 1.2 (supporting 1x/4x LP-Serial links at 1.25–3.125 Gbaud). These interfaces enable flexible chip-to-chip or board-to-board connectivity-RapidIO for deterministic low-latency backplanes and PCIe for standard host expansion-both accessible concurrently in MC8641DVU1500KE designs.

What is the package type and thermal specification for the MC8641DVU1500KE?

The MC8641DVU1500KE is packaged in a 1023-pin Hi-CTE flip-chip ceramic ball grid array (FC-CBGA) with 35 × 35 mm body size and 1.0 mm ball pitch. Its junction temperature range is 0–105°C, with typical power dissipation of 20.3 W at 65°C (1.5 GHz, 1.1 V core). Thermal design requires adherence to IPC/JEDEC J-STD-020 reflow profiles and proper heatsink mounting to maintain MC8641DVU1500KE within safe operating limits.