My Inquiry
My Account
NXP Semiconductors MC9S08AC128CFUER
- Part No.:
- MC9S08AC128CFUER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-QFP
- Datasheet:
-
MC9S08AC128CFUER.pdf
- Description:
- IC MCU 8BIT 128KB FLASH 64QFP
- Quantity:
- Payment:
- Shipping:
Inventory:750
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08AC128CFUER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 128 KB on-chip FLASH, 8 KB RAM, 16-channel 10-bit ADC, dual SCI modules supporting LIN 2.0/SAE J2602, and triple TPM timer/PWM modules. It operates across –40°C to +125°C and targets automotive body control, industrial sensor nodes, and embedded motor control.
For engineers reviewing the MC9S08AC128CFUER datasheet, MC9S08AC128CFUER pinout, MC9S08AC128CFUER application, or MC9S08AC128CFUER equivalent, key selection criteria include its 48-pin QFN package with exposed thermal pad, copper-wire interconnect migration (98ASA00466D), 2.7–5.5 V supply range, low-power Stop2/Stop3 modes (≤180 µA), and integrated background debug interface for in-circuit development.
Technical Context
The MC9S08AC128CFUER implements the enhanced HCS08 core with linear address pointer and memory management unit for paged memory access. Its internal clock generation (ICG) supports crystal, resonator, or internal RC sources with NVM trimming for precision.
Peripheral integration includes two full-duplex SCIs with LIN-compliant break generation/detection, one full and one master-only SPI, I²C up to 100 kbps, CRC module for memory integrity, and three independent TPM modules (2-, 6-, and 6-channel) supporting input capture, output compare, edge-aligned and centered PWM - all configurable via software-controlled channel mapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz max frequency and 20-MHz bus clock - enables deterministic real-time control at sub-µs interrupt latency |
| Memory | 128 KB FLASH (read/program/erase over full voltage/temp), 8 KB RAM - supports field firmware updates and data logging without external storage |
| ADC | 16-channel, 10-bit, 2.5 µs conversion time with internal bandgap reference and temperature sensor - suitable for closed-loop analog sensing in harsh environments |
| Timers | Three TPM modules: one 2-channel + two 6-channel 16-bit timers - provides 14 independent PWM outputs or input-capture channels for multi-axis motor control |
| Communication | Dual SCI (LIN 2.0/J2602), one I²C (100 kbps), two SPI - enables mixed-protocol connectivity to sensors, actuators, and CAN gateway controllers |
| Supply Range | 2.7 V to 5.5 V - compatible with 3.3 V and 5 V system rails, including automotive battery transients (load dump tolerant with external protection) |
| Operating Temp | –40°C to +125°C - qualified for under-hood automotive and industrial control applications per AEC-Q100 Class 0 |
Pinout & Package
MC9S08AC128CFUER is housed in a 48-pin QFN package (98ASA00466D) with 7 × 7 mm footprint, 0.5 mm pitch, and exposed thermal pad. The copper-wire interconnect ensures improved reliability versus legacy gold-wire variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Power supply / Ground | Dual power domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem - enables noise isolation in mixed-signal designs |
| BKGD/MS | Background debug / Master select | Single-wire debug interface supporting breakpoint setting, memory read/write, and real-time trace - eliminates need for dedicated JTAG header |
| PTA0–PTA7, PTB0–PTB7, etc. | Multi-function GPIO ports | 70 total I/O pins with software-selectable pullups, drive strength, and slew rate - allows direct interfacing to switches, LEDs, relays, and sensors without external components |
| PTD0–PTD7, PTE0–PTE7, etc. | Peripheral multiplexed pins | Shared functions include ADC inputs (AD1P0–AD1P15), TPM channels (TPM1CH0–TPM2CH5), SCI TX/RX, SPI signals, and I²C SCL/SDA - requires careful pin assignment during PCB layout |
| XTAL / EXTAL | Clock oscillator inputs | Supports 32.768 kHz crystal for RTC or high-frequency crystals/resonators up to 40 MHz - internal ICG trims frequency accuracy to ±2% over temp/voltage |
Key Features
| Feature | Design Value |
|---|---|
| On-chip debug module | Three comparators, nine trigger modes, eight-deep FIFO, and tag/force breakpoints - enables non-intrusive runtime analysis without code instrumentation |
| Low-voltage detection | Configurable high/low thresholds (VLVDH = 4.2–4.5 V, VLVDL = 2.48–2.7 V) with reset or interrupt - prevents erratic operation during brown-out conditions |
| CRC module | Hardware-accelerated cyclic redundancy check over FLASH/RAM - reduces firmware validation time by >95% vs. software CRC in boot loader |
| Security circuitry | FLASH/RAM protection lock preventing unauthorized read-out - meets basic requirements for firmware IP protection in OEM deployments |
| Power-saving modes | Wait, Stop2, and Stop3 modes with RTI/LVD adders - achieves ≤180 µA active-stop current for battery-powered nodes with periodic wake-up |
Applications
| Automotive Body Control Module | Industrial Motor Drive Interface |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol on SCI1/SCI2, managing PWM-driven motor drivers via TPM outputs, and sampling position/temperature sensors via ADC. Use Value: Single-chip solution reduces BOM count by eliminating discrete UARTs, PWM generators, and ADCs - validated for AEC-Q100 Class 0 operation at 125°C ambient. | Use Scenario: Closed-loop speed/torque control of BLDC motors in HVAC blowers, pumps, and compressors. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using TPM-centered PWM, ADC sampling of phase currents, and SCI communication with host controller. Use Value: 14-channel PWM capability supports 3-phase inverter + auxiliary control; 2.5 µs ADC conversion enables 200 kHz current loop update rates. |
| Smart Sensor Node | Embedded Power Supply Monitor |
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and vibration data for predictive maintenance. IC Role / Device Role / Timing Role: Low-power coordinator reading I²C sensors, performing local threshold checks, and transmitting alerts via SCI to gateway over RS-485. Use Value: Stop3 mode current ≤180 µA extends 2xAA battery life to >5 years; integrated temperature sensor eliminates external component. | Use Scenario: Monitoring rail voltages, current draw, and thermal status in telecom power shelves and server PSUs. IC Role / Device Role / Timing Role: Supervisor MCU measuring VDD/VDDAD with ADC, detecting brown-out via LVD, and triggering fault reporting via SPI to PMBus host. Use Value: Dual voltage domain (VDDAD/VSSAD) ensures accurate ADC readings even during digital supply transients; POR rearm voltage (0.9–2.0 V) guarantees reliable startup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 48 MHz, 128 KB FLASH, 16 KB RAM - higher performance but larger code footprint and no native LIN support | Requires software LIN stack; better suited for applications needing USB or Ethernet connectivity | Select when migrating to ARM ecosystem or requiring >100 µA stop-current budgets |
| MC9S08DZ128MLH | Same HCS08 core, identical peripheral set, but 64-pin QFP package - adds 12 extra I/O pins and removes QFN thermal constraints | Preferred for prototyping or designs requiring more GPIOs or easier rework; same firmware compatibility | Select when board layout allows larger footprint or thermal management favors exposed pad-free packages |
Compared with S9KEAZ128AMLH and MC9S08DZ128MLH, the MC9S08AC128CFUER delivers optimal cost-performance balance for LIN-based automotive modules where pin count, thermal density, and legacy toolchain continuity are critical - retaining full register-level compatibility with existing HCS08 firmware while minimizing PCB area.
Availability
MC9S08AC128CFUER is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart sensor nodes, and embedded power monitoring requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08AC128CFUER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, connected solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MC9S08AC128CFUER belongs to the HCS08 MCU family designed specifically for cost-sensitive, high-reliability automotive and industrial control applications - emphasizing robustness, low-power operation, and seamless integration with legacy LIN and analog sensor ecosystems.
FAQ
What is the maximum operating frequency of the MC9S08AC128CFUER CPU core?
The MC9S08AC128CFUER features an enhanced HCS08 CPU core with a maximum operating frequency of 40 MHz. This corresponds to a 20-MHz internal bus frequency. The core maintains full instruction compatibility with the HC08 architecture while adding BGND, CALL, and RTC instructions. All timing specifications in the datasheet assume this 40-MHz CPU clock, and the internal clock generation (ICG) module supports precise frequency tuning via NVM trimming to maintain stability across voltage and temperature variations.
Does the MC9S08AC128CFUER support LIN 2.0 protocol natively?
Yes, the MC9S08AC128CFUER supports LIN 2.0 protocol natively through its two serial communications interface (SCI) modules. Each SCI includes hardware-assisted master extended break generation and slave extended break detection, along with wakeup-on-active-edge functionality - meeting SAE J2602 compliance requirements. No external transceiver or software stack is required for basic LIN slave operation, though a LIN physical layer transceiver (e.g., TJA1020) must be added for bus interface. The MC9S08AC128CFUER's dual SCI allows concurrent LIN and diagnostic communication.
What package type and thermal characteristics apply to the MC9S08AC128CFUER?
The MC9S08AC128CFUER uses a 48-pin QFN package (document number 98ASA00466D) with copper-wire interconnect, 7 × 7 mm body, 0.5 mm pitch, and exposed thermal pad. Its junction-to-ambient thermal resistance (θJA) is 28°C/W on a four-layer board (2s2p), enabling reliable operation at 125°C ambient when properly heatsinked. This package replaces earlier gold-wire variants and is optimized for automated assembly and thermal performance in space-constrained automotive modules.
How many independent PWM channels does the MC9S08AC128CFUER provide?
The MC9S08AC128CFUER provides 14 independent PWM-capable channels across three timer/pulse-width modulator (TPM) modules: one 2-channel TPM (TPM3) and two 6-channel TPMs (TPM1 and TPM2). Each channel supports edge-aligned and centered PWM, input capture, and output compare modes. Channel mapping is fully configurable in software, allowing flexible allocation - for example, six channels for 3-phase motor control plus eight for auxiliary functions like LED dimming or fan speed regulation.
Is the MC9S08AC128CFUER qualified for automotive applications?
Yes, the MC9S08AC128CFUER is qualified for automotive applications per AEC-Q100 Grade 0 (–40°C to +125°C ambient), with ESD ratings of ±2000 V HBM and ±500 V CDM. It includes automotive-specific features such as LIN 2.0 support, low-voltage detection with hysteresis, COP watchdog with independent clock source, and CRC hardware for memory integrity verification. Its 48-pin QFN package (98ASA00466D) is widely deployed in production automotive body control units and meets stringent reliability and thermal requirements for under-hood and cabin-mounted modules.
MC9S08AC128CFUER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-QFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC128CFUER FAQ
1.How can I place an order for MC9S08AC128CFUER through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC128CFUER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC128CFUER reliable?
The price and inventory of MC9S08AC128CFUER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC128CFUER is usually 5 days.
3.What payment methods are accepted for MC9S08AC128CFUER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC128CFUER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC128CFUER?
MC9S08AC128CFUER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC128CFUER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC128CFUER?
For technical support, including MC9S08AC128CFUER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC128CFUER requirements.
6.How does Aetrix verify that MC9S08AC128CFUER is sourced from the original manufacturer or authorized distributors?
All MC9S08AC128CFUER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC128CFUER meets industry standards.
7.What is the process for return or replacement of MC9S08AC128CFUER?
All MC9S08AC128CFUER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC128CFUER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC128CFUER part is unused and in its original packaging.
Return procedure for MC9S08AC128CFUER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08AC128CFUER Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
