My Inquiry
My Account
NXP Semiconductors MC9S08AC128CLKE
- Part No.:
- MC9S08AC128CLKE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MC9S08AC128CLKE.pdf
- Description:
- IC MCU 8BIT 128KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:310
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08AC128CLKE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 128 KB on-chip FLASH, 8 KB RAM, 16-channel 10-bit ADC with temperature sensor, dual SCI modules supporting LIN 2.0/SAE J2602, and triple TPM timer/PWM modules - deployed in automotive body control modules, industrial sensor nodes, and HVAC actuator controllers.
For engineers reviewing the MC9S08AC128CLKE datasheet, MC9S08AC128CLKE pinout, MC9S08AC128CLKE application, or MC9S08AC128CLKE equivalent, key selection considerations include its 48-pin QFN package with exposed thermal pad, 2.7–5.5 V operating voltage, -40°C to +125°C automotive-grade temperature range, integrated CRC and COP watchdog, and background debug interface for in-circuit development.
Technical Context
The MC9S08AC128CLKE implements the enhanced HCS08 core with linear address pointer and memory management unit for paged memory access. Its internal clock generation (ICG) module supports crystal/resonator/external clock inputs with NVM-trimmed precision, enabling stable bus frequencies up to 20 MHz.
Peripherals include two full-duplex SCIs with LIN-compliant break generation/detection, one full and one master-only SPI, I²C up to 100 kbps, and three independent TPM modules (2-channel + two 6-channel) supporting input capture, output compare, edge-aligned and center-aligned PWM - all configurable via register-level control without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND/CALL/RTC instructions and paged memory support |
| Max CPU Frequency | 40 MHz - enables real-time control loop execution at sub-25 ns instruction cycle |
| FLASH / RAM | 128 KB FLASH (read/program/erase over full VDD/temp), 8 KB RAM with security lock |
| ADC | 16-channel 10-bit SAR ADC with 2.5 µs conversion, internal bandgap reference, and on-die temperature sensor |
| Timers | Three TPM modules: one 2-channel, two 6-channel - each supports buffered CPWM, input capture, and event-triggered interrupts |
| Communication | Dual SCI (LIN 2.0/J2602 compliant), dual SPI (one master-only), I²C (100 kbps, multi-master, 10-bit addressing) |
| Operating Range | -40°C to +125°C, 2.7–5.5 V supply - qualified per AEC-Q100 Grade 1 for automotive use |
Pinout & Package
MC9S08AC128CLKE is packaged in a 48-pin QFN (98ASA00466D) with 7×7 mm body, 0.5 mm pitch, and exposed thermal pad - optimized for space-constrained automotive and industrial PCBs requiring low thermal resistance (θJA = 28°C/W on 2s2p board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Power supply / Ground | Dual power domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem (ADC, bandgap) |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with software-selectable pullups, drive strength, and slew rate control |
| PTB0–PTB7 | Port B with ADC/TPM3 | 8-bit port with AD1P0–AD1P7 analog inputs and TPM3CH0/CH1 timer channels |
| PTC0/PTC1 | I²C SCL/SDA | Open-drain I²C bus interface with programmable slave address and broadcast mode support |
| PTE0/PTE1 | SCI1 TxD1/RxD1 | Full-duplex UART interface supporting LIN master break generation and slave wakeup detection |
| PTF0–PTF7 | TPM1/TPM2 channels | 12 dedicated PWM/compare/capture pins across TPM1 (CH0–CH5) and TPM2 (CH0–CH5) |
| PTG5/PTG6 | XTAL/EXTAL | Crystal oscillator input/output pair for precise clock source; supports 32.768 kHz to 8 MHz crystals |
| BKGD/MS | Background debug | Single-wire debug interface for in-circuit programming, breakpoint setting, and ICE trace via on-chip debug module |
Key Features
| Feature | Design Value |
|---|---|
| Automotive-grade reliability | AEC-Q100 qualified (Grade 1), ESD protection ±2000 V HBM, ±500 V CDM, latch-up immunity ±100 mA |
| Low-power operation | Stop3 mode current as low as 27 µA @ 5 V; RTI adder only 500 nA - enables battery-powered sensor wake-on-event |
| System safety | Dedicated COP watchdog with independent internal clock option; CRC module for fast memory integrity checks |
| Analog integration | On-chip 1.2 V bandgap reference (±30 mV), temperature sensor, and VREFH/VREFL pins for ratiometric ADC scaling |
| Secure firmware | Flash security circuitry prevents unauthorized read-out of RAM and FLASH contents during debug or runtime |
Applications
| Automotive Body Control Unit | Industrial Motor Actuator |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirror adjusters, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing LIN-slave communication with gateway, managing PWM-driven motor drivers, and monitoring switch inputs via KBI. Use Value: Dual SCI modules enable concurrent LIN communication on two buses; 6-channel TPMs drive 3-phase motor gate drivers with synchronized dead-time insertion. |
Use Scenario: Closed-loop speed/torque control of 24 V DC brush motors in factory automation conveyors and valve actuators. IC Role / Device Role / Timing Role: Real-time controller interfacing with Hall-effect sensors, generating complementary PWM outputs, and reporting status via RS-485 (SCI + external transceiver). Use Value: 10-bit ADC measures motor current and temperature; TPM center-aligned PWM reduces EMI; CRC validates firmware updates over fieldbus. |
| Smart HVAC Thermostat | Energy Meter Sensor Node |
|
Use Scenario: Residential thermostat with ambient temperature/humidity sensing, display driving, and wireless sub-GHz RF link (via SPI-connected transceiver). IC Role / Device Role / Timing Role: Host MCU acquiring sensor data via I²C, processing setpoint algorithms, and managing low-power sleep/wake cycles using RTI and LVD. Use Value: Integrated temperature sensor eliminates external component; Stop3 mode draws <30 µA, extending coin-cell battery life beyond 5 years. |
Use Scenario: DIN-rail mounted electricity meter front-end capturing voltage/current waveforms and computing kWh via metrology algorithm. IC Role / Device Role / Timing Role: Data acquisition engine synchronizing 16-channel ADC sampling to line frequency, buffering results in RAM, and transferring via SPI to host processor. Use Value: 2.5 µs ADC conversion time supports >10 kSPS sampling; 128 KB FLASH stores calibration coefficients and firmware for Class 0.5 accuracy compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 48 MHz, same 48-pin QFN, but lacks LIN protocol hardware acceleration | Requires software-based LIN stack; higher code density but larger memory footprint for protocol handling | Preferred when migrating to ARM ecosystem or needing USB/device connectivity not available in HCS08 |
| MC9S08DZ128MLH | Same HCS08 core, identical peripheral set, but rated for -40°C to +105°C (not 125°C) and uses 64-pin QFP | Not suitable for under-hood automotive applications; requires PCB redesign due to different package and pinout | Valid drop-in replacement only if thermal margin allows and layout accommodates 64-pin QFP footprint |
Compared with MC9S08AC128CLKE, S9KEAZ128AMLH offers modern ARM architecture and toolchain continuity but sacrifices native LIN timing precision, while MC9S08DZ128MLH retains full functional equivalence at reduced temperature grade and incompatible packaging - making MC9S08AC128CLKE the sole choice for high-temp automotive LIN nodes.
Availability
MC9S08AC128CLKE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and smart energy metering requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08AC128CLKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the spin-off of Freescale Semiconductor in 2015.
The MC9S08AC128CLKE belongs to the HCS08 MCU family designed specifically for cost-sensitive, high-reliability automotive body electronics and industrial control systems requiring robust LIN communication, integrated analog peripherals, and AEC-Q100 qualification.
FAQ
What is the maximum operating temperature rating for the MC9S08AC128CLKE?
The MC9S08AC128CLKE is rated for continuous operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements for under-hood automotive applications. This rating is validated across all electrical parameters including FLASH endurance, ADC accuracy, and timer jitter - confirmed in Section 3.4 of the official datasheet Rev. 4.
Does the MC9S08AC128CLKE support LIN 2.0 protocol natively?
Yes, the MC9S08AC128CLKE includes dual SCI modules with hardware-assisted LIN 2.0 and SAE J2602 compliance, including master-mode extended break generation and slave-mode extended break detection. This eliminates need for bit-banging and ensures precise timing required for automotive LIN networks - detailed in Section 1.1 and Peripheral description of the MC9S08AC128 datasheet.
What package type and thermal characteristics apply to the MC9S08AC128CLKE?
The MC9S08AC128CLKE uses a 48-pin QFN package (document number 98ASA00466D) with 7×7 mm body and exposed thermal pad. Its junction-to-ambient thermal resistance is 28°C/W on a 4-layer PCB (2s2p), enabling reliable operation at full 40-MHz CPU speed within the 125°C ambient limit - specified in Table 3-3 of the MC9S08AC128 Rev. 4 datasheet.
How does the MC9S08AC128CLKE handle low-voltage conditions?
The MC9S08AC128CLKE integrates a programmable low-voltage detection (LVD) system with two thresholds (VLVDH ≈ 4.3 V, VLVDL ≈ 2.55 V) and hysteresis (60–100 mV). It supports reset or interrupt generation on voltage drop, plus optional LVD adder in Stop3 mode (+160 µA typical). These features are fully characterized in Table 3-6 of the Rev. 4 datasheet.
Can the MC9S08AC128CLKE execute code from RAM?
No, the MC9S08AC128CLKE executes code only from on-chip FLASH memory. Its 8 KB RAM is used exclusively for data storage, stack, and peripheral buffers. The Memory Management Unit (MMU) supports paged memory access to FLASH but does not enable XIP from RAM - confirmed in Section 1.1 "8-Bit HCS08 Central Processor Unit" of the MC9S08AC128 Rev. 4 datasheet.
MC9S08AC128CLKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 69
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC128CLKE FAQ
1.How can I place an order for MC9S08AC128CLKE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC128CLKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC128CLKE reliable?
The price and inventory of MC9S08AC128CLKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC128CLKE is usually 5 days.
3.What payment methods are accepted for MC9S08AC128CLKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC128CLKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC128CLKE?
MC9S08AC128CLKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC128CLKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC128CLKE?
For technical support, including MC9S08AC128CLKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC128CLKE requirements.
6.How does Aetrix verify that MC9S08AC128CLKE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC128CLKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC128CLKE meets industry standards.
7.What is the process for return or replacement of MC9S08AC128CLKE?
All MC9S08AC128CLKE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC128CLKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC128CLKE part is unused and in its original packaging.
Return procedure for MC9S08AC128CLKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08AC128CLKE Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
