NXP Semiconductors MC9S08AC128MFUE
- Part No.:
- MC9S08AC128MFUE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-QFP
- Datasheet:
-
MC9S08AC128MFUE.pdf
- Description:
- IC MCU 8BIT 128KB FLASH 64QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08AC128MFUE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 128 KB on-chip FLASH, 8 KB RAM, and integrated peripherals including dual SCI (LIN 2.0/J2602 compliant), dual SPI, I²C, three TPM modules (2×6-channel + 1×2-channel), 16-channel 10-bit ADC with temperature sensor, and KBI. It targets automotive body control, industrial sensor nodes, and low-cost embedded control systems requiring robust debug support and extended temperature operation.
For engineers reviewing the MC9S08AC128MFUE datasheet, MC9S08AC128MFUE pinout, MC9S08AC128MFUE application, or MC9S08AC128MFUE equivalent, key selection considerations include its 80-pin LQFP package, -40°C to +125°C operating range, background debugging system with ICE module, COP watchdog with independent clock option, and CRC hardware acceleration for memory integrity verification.
Technical Context
The MC9S08AC128MFUE implements the enhanced HCS08 core with linear address pointer and memory management unit for paged memory access. Its internal clock generation (ICG) supports crystal, resonator, external clock, or internally trimmed oscillator with NVM-based frequency calibration.
Peripherals are tightly coupled to the 20-MHz internal bus: dual SCI modules support LIN master/slave wake-up and extended break handling; TPM modules offer buffered center-aligned PWM, input capture, and output compare; ADC includes automatic compare, bandgap reference (1.20 V), and internal temperature sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit architecture with BGND/CALL/RTC instructions and paged memory support |
| Max CPU Frequency | 40 MHz - enables real-time control loops with sub-25 ns instruction cycle time |
| Memory | 128 KB FLASH (read/program/erase over full voltage/temp), 8 KB RAM, security circuitry |
| ADC | 16-channel, 10-bit resolution, 2.5 µs conversion, internal bandgap reference (1.20 V), temperature sensor |
| Timers | Three TPM modules: TPM1 (6-channel), TPM2 (6-channel), TPM3 (2-channel), all supporting PWM, input capture, output compare |
| Communication | Dual SCI (LIN 2.0/J2602), dual SPI (one master-only), I²C (100 kbps, multi-master, 10-bit addressing) |
| Operating Range | -40°C to +125°C ambient, 2.7–5.5 V supply - qualified for automotive under-hood use |
Pinout & Package
MC9S08AC128MFUE is packaged in an 80-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, lead-free finish, and exposed thermal pad. Pin functions include 70 general-purpose I/Os with software-selectable pullups, drive strength, and slew rate control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BKGD/MS | Background Debug / Master Select | Single-wire debug interface; enables in-circuit emulation and breakpoint control without dedicated JTAG pins |
| RESET | Master Reset Input | Active-low asynchronous reset with power-on reset (POR) and low-voltage detection (LVD) integration |
| VDD / VSS | Power Supply / Ground | Dual power domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem (ADC, bandgap) |
| PTA0–PTA7 | Port A General-Purpose I/O | 8-bit bidirectional port with configurable pullups; supports peripheral alternate functions (e.g., TPM, SCI) |
| PTB0–PTB7 | Port B General-Purpose I/O | 8-bit port with ADC channel mapping (AD1P0–AD1P7); TPM3CH0/CH1 and analog inputs shared |
| PTD0–PTD7 | Port D General-Purpose I/O | 8-bit port with 16 ADC channels (AD1P8–AD1P15), KBI inputs (KBI1P0–KBI1P7), and TPM clock inputs |
| PTF0–PTF7 | Port F General-Purpose I/O | 8-bit port with TPM1/TPM2 channel outputs (TPM1CH0–TPM1CH5, TPM2CH0–TPM2CH1) |
| PTG0–PTG6 | Port G General-Purpose I/O | 7-bit port with KBI inputs (KBI1P0–KBI1P4), XTAL/EXTAL oscillator connections, and SCL/SDA alternate functions |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Debug Module | Three-comparator ICE with eight-deep FIFO, tag/force breakpoints, and single hardware breakpoint plus two software-configurable breakpoints |
| CRC Hardware Accelerator | Fast cyclic redundancy check engine for flash/RAM integrity validation - reduces firmware verification overhead by >90% vs. software CRC |
| Low-Voltage Detection | Configurable high/low threshold (VLVDH = 4.3 V, VLVDL = 2.54 V) with interrupt or reset output - prevents erratic operation during brownout |
| Power-Saving Modes | Wait + Stop2 + Stop3 modes; Stop3 draws only 1.2 µA typical at 5 V (–40°C to +85°C) with RTI and LVD adders disabled |
| Security Circuitry | FLASH/RAM protection lock preventing unauthorized read-out via background debug interface - essential for IP-sensitive firmware |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing PWM-driven motor drivers, and sampling analog sensors (temperature, position). Use Value: Dual LIN-capable SCI modules enable direct communication with multiple LIN slaves; 128 KB FLASH accommodates complex state machines and diagnostics; -40°C to +125°C rating ensures reliability under hood. |
Use Scenario: Wireless-capable environmental monitoring node measuring temperature, humidity, and vibration in factory settings. IC Role / Device Role / Timing Role: Sensor fusion hub interfacing with analog/digital sensors, running CRC-verified firmware, and preparing data for RF transmission via SPI-connected transceiver. Use Value: Integrated 10-bit ADC with internal temperature sensor eliminates external components; CRC module validates sensor data integrity; Stop3 mode extends battery life in intermittent-readout applications. |
| Smart Appliance Control | Medical Diagnostic Equipment |
Use Scenario: Motor and display control in washing machines, dishwashers, and HVAC systems with user interface feedback. IC Role / Device Role / Timing Role: Real-time actuator controller using TPM-generated PWM for BLDC motor commutation and ADC for current sensing and thermistor monitoring. Use Value: Six-channel TPM modules support simultaneous motor phase control and auxiliary timing; software-selectable drive strength ensures compatibility with diverse load types (relays, LEDs, MOSFET gates). |
Use Scenario: Portable blood glucose meter or handheld ECG device requiring precise analog measurement and secure firmware storage. IC Role / Device Role / Timing Role: Precision analog front-end controller acquiring calibrated ADC samples, performing on-chip signal conditioning, and enforcing secure boot via FLASH protection. Use Value: Factory-trimmed 1.20 V bandgap reference ensures <±1% ADC accuracy across temperature; security circuitry prevents tampering with calibration constants stored in FLASH. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core; 128 KB FLASH, 16 KB RAM; higher performance but larger code footprint and different toolchain | Requires migration from HCS08 assembly/C to ARM GCC; better suited for applications needing >40 MHz deterministic throughput or USB connectivity | Select when upgrading legacy designs toward scalable ARM architecture with longer roadmap support |
| MC9S08DZ128MLH | Same HCS08 core, identical pinout and peripheral set; differs in package (64-pin QFP vs. 80-pin LQFP) and reduced I/O count (54 vs. 70 GPIO) | Limited peripheral routing flexibility due to fewer pins; unsuitable where all 70 GPIO or full ADC channel count is required | Choose only if board layout constraints mandate smaller package and I/O reduction is acceptable |
Compared with S9KEAZ128AMLH and MC9S08DZ128MLH, the MC9S08AC128MFUE delivers optimal balance of proven HCS08 toolchain compatibility, maximum I/O density in 80-pin LQFP, and automotive-grade analog integration - making it the preferred choice for cost-sensitive, high-reliability 8-bit control where ARM migration is not justified.
Availability
MC9S08AC128MFUE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08AC128MFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, connected solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MC9S08AC128MFUE belongs to the HCS08 MCU family, designed specifically for cost-sensitive, high-reliability embedded control applications demanding robust debug capability, extended temperature operation, and integrated analog/peripheral functionality without architectural complexity.
FAQ
What is the maximum operating frequency of the MC9S08AC128MFUE CPU core?
The MC9S08AC128MFUE features an enhanced HCS08 CPU core rated for up to 40 MHz operation. This corresponds to a 25 ns instruction cycle time at maximum speed, enabling deterministic real-time response for motor control, sensor sampling, and communication protocols. The internal bus operates at 20 MHz, and actual achievable frequency depends on supply voltage and temperature per the datasheet's AC characteristics table.
Does the MC9S08AC128MFUE support LIN 2.0 communication natively?
Yes, the MC9S08AC128MFUE integrates two Serial Communication Interface (SCI) modules explicitly compliant with LIN 2.0 and SAE J2602 protocols. Each SCI supports master extended break generation and slave extended break detection, along with wakeup-on-active-edge functionality - eliminating need for external LIN transceivers in basic implementations when paired with appropriate physical layer drivers.
What debug interfaces does the MC9S08AC128MFUE provide?
The MC9S08AC128MFUE uses a single-wire Background Debug (BKGD) interface compatible with standard BDM tools. It includes an on-chip debug module with three comparators, nine trigger modes, and an eight-deep FIFO for change-of-flow addresses. The design supports one hardware breakpoint plus two additional breakpoints configured in the debug module - enabling efficient in-circuit debugging without JTAG overhead.
How does the MC9S08AC128MFUE handle low-voltage conditions?
The MC9S08AC128MFUE incorporates a programmable Low-Voltage Detection (LVD) system with separate high- and low-range thresholds (VLVDH = 4.3 V, VLVDL = 2.54 V typical). It can generate either an interrupt or a reset when VDD falls below the selected threshold, preventing unreliable operation during brownout. Hysteresis of 100 mV (5 V) or 60 mV (3 V) ensures noise immunity and clean recovery.
Is the MC9S08AC128MFUE pin-compatible with other HCS08 family members?
The MC9S08AC128MFUE in 80-pin LQFP is not fully pin-compatible with lower-pin-count HCS08 variants (e.g., 64-pin QFP or 48-pin QFN packages), as Table 2-4 in the datasheet confirms pin function loss in smaller packages. While core peripherals and register maps are consistent across the AC128 series, physical pin assignments differ - requiring PCB redesign when migrating between package options.
MC9S08AC128MFUE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-QFP
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM
- Number of I/O:
- 54
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC128MFUE FAQ
1.How can I place an order for MC9S08AC128MFUE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC128MFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC128MFUE reliable?
The price and inventory of MC9S08AC128MFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC128MFUE is usually 5 days.
3.What payment methods are accepted for MC9S08AC128MFUE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC128MFUE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC128MFUE?
MC9S08AC128MFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC128MFUE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC128MFUE?
For technical support, including MC9S08AC128MFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC128MFUE requirements.
6.How does Aetrix verify that MC9S08AC128MFUE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC128MFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC128MFUE meets industry standards.
7.What is the process for return or replacement of MC9S08AC128MFUE?
All MC9S08AC128MFUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC128MFUE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC128MFUE part is unused and in its original packaging.
Return procedure for MC9S08AC128MFUE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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