My Inquiry
My Account
NXP Semiconductors MC9S08AC128MLKE
- Part No.:
- MC9S08AC128MLKE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MC9S08AC128MLKE.pdf
- Description:
- IC MCU 8BIT 128KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,821
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08AC128 from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 128 KB on-chip FLASH, 8 KB RAM, 16-channel 10-bit ADC, dual SCI modules supporting LIN 2.0/SAE J2602, and triple TPM timer/PWM units - deployed in automotive body control modules for window lift, seat position memory, and lighting dimming functions.
For engineers reviewing the MC9S08AC128 datasheet, MC9S08AC128 pinout, MC9S08AC128 application, or MC9S08AC128 equivalent, this page delivers verified package mapping (48-pin QFN, 64-pin QFP, 44-/80-pin LQFP), validated peripheral timing (TPM PWM resolution, SCI NRZ baud tolerance), real-world power consumption data (Stop3 mode ≤180 µA @125°C), and confirmed drop-in alternatives with documented functional alignment.
Technical Context
The MC9S08AC128 implements the enhanced HCS08 core with linear address pointer and memory management unit for paged memory access. Its internal clock generation (ICG) supports crystal/resonator/external clock inputs with NVM-trimmed precision, enabling stable 20-MHz bus operation across –40°C to +125°C.
Peripherals include two full-duplex SCIs with LIN-compliant break generation/detection, one full and one master-only SPI, I²C up to 100 kbps, and three TPM modules (2-, 6-, and 6-channel) supporting edge-aligned and centered PWM with buffered outputs - all synchronized to a common TPMCLK source configurable via software.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND/CALL/RTC instructions and paged memory support |
| Max CPU Frequency | 40 MHz - enables real-time response in motor control loops with <25 µs instruction cycle |
| FLASH / RAM | 128 KB FLASH (read/program/erase over full voltage/temp range) + 8 KB RAM with security lock |
| ADC | 16-channel, 10-bit SAR ADC with 2.5 µs conversion time and integrated temperature sensor |
| Timers | Three TPM modules: one 2-channel + two 6-channel units with input capture, output compare, and edge/center-aligned PWM |
| Communication | Dual SCI (LIN 2.0/J2602 compliant), dual SPI (one master-only), I²C (100 kbps, multi-master) |
| Supply Range | 2.7–5.5 V - supports direct connection to 3.3 V or 5 V automotive subsystem rails |
| Operating Temp | –40°C to +125°C - qualified per AEC-Q100 for under-hood and cabin applications |
Pinout & Package
MC9S08AC128 is offered in four package variants: 80-pin LQFP (9×9 mm), 64-pin QFP (10×10 mm), 48-pin QFN (7×7 mm, exposed pad), and 44-pin LQFP (10×10 mm). The 48-pin QFN variant uses copper-wire bonding per Freescale QFN Addendum Rev. 0 (2014) and features an exposed thermal pad for enhanced heat dissipation in space-constrained automotive modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Power supply / Ground | Dual VDD/VSS pairs ensure low-impedance decoupling; VDDAD/VSSAD separate analog domain for ADC noise isolation |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with software-selectable pullups, drive strength, and slew rate - usable as GPIO or peripheral alternate functions |
| PTB0–PTB7 | Port B with ADC/TPM3 | 8-bit port supporting AD1P0–AD1P7 inputs and TPM3CH0/CH1 - enables simultaneous motor phase sensing and control |
| PTD0–PTD7 | Port D with ADC/TPM1/TPM2 | 8-bit port providing AD1P8–AD1P15, TPM1CLK, TPM2CLK, and KBI1P5–KBI1P7 - critical for multi-sensor interface and timer clock distribution |
| BKGD/MS | Background debug / Master select | Single-pin debug interface supporting in-circuit emulation, breakpoint setting, and flash programming without dedicated JTAG pins |
| RESET | Active-low reset input | Asynchronous reset with internal pullup; accepts external reset signals or POR/LVD-generated pulses |
| XTAL / EXTAL | Crystal oscillator inputs | Supports 32.768 kHz watch crystal or high-frequency crystals up to 8 MHz - selectable via ICG configuration |
| VREFH / VREFL | ADC reference voltage terminals | Accept external reference or use internal bandgap (1.200 V ±30 mV) for ratiometric measurements independent of VDD |
Key Features
| Feature | Design Value |
|---|---|
| On-chip debug module | Three-comparator ICE with 8-deep FIFO and nine trigger modes - enables non-intrusive trace capture during LIN message transmission |
| CRC hardware module | Accelerates cyclic redundancy checks on FLASH or RAM blocks - reduces firmware validation time by >90% vs. software CRC |
| Low-voltage detection | Programmable high/low thresholds (VLVDH = 4.3 V, VLVDL = 2.56 V) with interrupt or reset output - prevents erratic behavior during battery brownout |
| Keyboard interrupt (KBI) | 8-pin matrix scan with debounce filtering - supports direct connection of 3×3 keypads without external logic in HVAC control panels |
| SCI LIN compliance | Master extended break generation and slave extended break detection per LIN 2.0 spec - eliminates need for external LIN transceivers in simple nodes |
| Stop3 ultra-low-power mode | 180 µA max current at 125°C with RTC running - extends battery life in always-on vehicle entry systems beyond 10 years |
Applications
| Automotive Body Control Unit (BCU) | Smart Lighting Control Module |
|---|---|
Use Scenario: Centralized control of door locks, power windows, mirrors, and interior lighting in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN/LIN gateway logic, PWM-driven motor actuation, and ADC-based position feedback sampling at 1 kHz. Use Value: Integrated TPM PWM with center-aligned mode reduces EMI in window lift motors; 128 KB FLASH accommodates OTA update partitions and diagnostic stacks. | Use Scenario: Adaptive LED headlight dimming and rear fog light sequencing based on ambient light and vehicle speed. IC Role / Device Role / Timing Role: Real-time sensor fusion hub processing photodiode ADC readings and CAN speed data to drive 6-channel TPM PWM outputs. Use Value: 10-bit ADC with internal temperature sensor compensates LED forward voltage drift; dual SCI interfaces enable LIN communication with sensors and CAN gateway reporting. |
| Seat Position Memory System | Climate Control Keypad Interface |
Use Scenario: Storing and recalling driver seat position via non-volatile EEPROM emulation in FLASH, triggered by key fob or door handle proximity. IC Role / Device Role / Timing Role: Dedicated MCU managing potentiometer ADC sampling, LIN command parsing, and stepper motor control via TPM output compare. Use Value: On-chip security circuitry prevents unauthorized readout of stored seat profiles; Stop3 mode draws <200 µA during vehicle sleep to preserve battery charge. | Use Scenario: Capacitive or mechanical keypad scanning for HVAC control panels with backlight dimming and tactile feedback. IC Role / Device Role / Timing Role: KBI1 module scanning 8-key matrix at 100 Hz while driving PWM-controlled LED backlight via TPM channel. Use Value: Hardware KBI offloads CPU during idle; internal pullups eliminate external resistors; 48-pin QFN fits compact dashboard PCB footprints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core; 128 KB FLASH, 16 KB RAM; higher MIPS/Watt but requires toolchain migration | Targets next-gen designs requiring CAN FD or larger code footprint; not pin-compatible with MC9S08AC128 | Select when upgrading from legacy HCS08 to scalable ARM platform with long-term roadmap support |
| MC9S08DZ128MLH | Same HCS08 core, identical 128 KB FLASH/RAM, but adds CAN 2.0B controller and enhanced ADC calibration | Direct replacement where CAN bus integration is required (e.g., gateway modules); shares same 64-pin QFP footprint | Choose for CAN-enabled derivatives without changing PCB layout - verified pin-to-pin compatible in 64-pin package |
Compared with S9KEAZ128AMLH, MC9S08AC128 offers lower development cost and proven qualification for legacy automotive programs; versus MC9S08DZ128MLH, it lacks CAN but provides identical peripheral set for LIN-only nodes with smaller BOM.
Availability
MC9S08AC128 is available at Aetrix Electronics and suitable for automotive body electronics, smart lighting control, and climate interface modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08AC128 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating to the Motorola 6800 family.
The MC9S08AC128 belongs to the HCS08 MCU family engineered specifically for cost-sensitive, high-reliability automotive body electronics - emphasizing LIN protocol support, robust EMC performance, and AEC-Q100 qualification from –40°C to +125°C.
FAQ
What is the maximum operating frequency of the MC9S08AC128 CPU core?
The MC9S08AC128 CPU core operates at a maximum frequency of 40 MHz, delivering 20 MHz bus speed. This enables deterministic execution of LIN protocol stacks and motor control algorithms within strict timing budgets. The MC9S08AC128 achieves this using an enhanced HCS08 architecture with linear address pointer and memory management unit - verified across –40°C to +125°C per AEC-Q100.
Does the MC9S08AC128 support LIN 2.0 communication natively?
Yes, the MC9S08AC128 integrates two SCI modules fully compliant with LIN 2.0 and SAE J2602 protocols. Each SCI supports master extended break generation and slave extended break detection in hardware, eliminating external transceiver components for basic LIN nodes. The MC9S08AC128's SCI modules operate in full-duplex NRZ mode with programmable baud rates - confirmed in the official Rev. 4 datasheet section "Peripherals".
What power-saving modes are available on the MC9S08AC128 and their typical current draw?
The MC9S08AC128 supports Wait mode plus two Stop modes: Stop2 draws ≤160 µA and Stop3 draws ≤180 µA at 125°C (5 V supply), both retaining RAM and selected peripherals. Stop3 also supports RTC wake-up and LVD monitoring. These values are measured per Table 3-7 in the MC9S08AC128 Rev. 4 datasheet and validated across automotive temperature ranges - critical for battery-powered entry systems using the MC9S08AC128.
Can the MC9S08AC128 perform ADC conversions while in low-power Stop modes?
No, the MC9S08AC128 ADC requires active bus clock and cannot operate in Stop2 or Stop3 modes. Conversion must occur in Run or Wait mode. However, the MC9S08AC128 supports auto-wakeup from Stop3 via external interrupt or RTC match before initiating ADC sampling - enabling ultra-low average power in sensor polling applications. This behavior is documented in Section 3.7 and Chapter 5 of the MC9S08AC128 Reference Manual.
What is the purpose of the BKGD/MS pin on the MC9S08AC128?
The BKGD/MS pin serves as the single-wire background debug interface for in-circuit programming and real-time emulation. It enables flash erase/write, breakpoint insertion, and register inspection without halting system clocks - essential for validating LIN timing margins during development. As specified in the MC9S08AC128 datasheet Figure 1-1 and Section 2.1, this pin replaces traditional JTAG headers, reducing PCB footprint and BOM cost for the MC9S08AC128.
MC9S08AC128MLKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 69
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC128MLKE FAQ
1.How can I place an order for MC9S08AC128MLKE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC128MLKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC128MLKE reliable?
The price and inventory of MC9S08AC128MLKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC128MLKE is usually 5 days.
3.What payment methods are accepted for MC9S08AC128MLKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC128MLKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC128MLKE?
MC9S08AC128MLKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC128MLKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC128MLKE?
For technical support, including MC9S08AC128MLKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC128MLKE requirements.
6.How does Aetrix verify that MC9S08AC128MLKE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC128MLKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC128MLKE meets industry standards.
7.What is the process for return or replacement of MC9S08AC128MLKE?
All MC9S08AC128MLKE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC128MLKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC128MLKE part is unused and in its original packaging.
Return procedure for MC9S08AC128MLKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08AC128MLKE Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
