NXP Semiconductors MC9S08AC16CFGE
- Part No.:
- MC9S08AC16CFGE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 44-LQFP
- Datasheet:
-
MC9S08AC16CFGE.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 44LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08AC16CFGE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 16 KB on-chip Flash memory with block protection, 1 KB RAM, and integrated peripherals including dual SCI, SPI, I²C, three 16-bit TPM modules (two 2-channel, one 4-channel), 8-channel 10-bit ADC, and KBI. It targets cost-sensitive industrial control and consumer appliance applications requiring robust debug support and low-power operation.
For engineers reviewing the MC9S08AC16CFGE datasheet, MC9S08AC16CFGE pinout, MC9S08AC16CFGE application, or MC9S08AC16CFGE equivalent, key selection criteria include its 48-pin QFN package, background debugging system with three breakpoints, COP watchdog with independent clock option, LVD reset/interrupt capability, and support for Wait + two Stop modes - all confirmed in Rev. 9 (Aug 2011) datasheet and QFN Addendum (Rev. 0, Jul 2014).
Technical Context
The MC9S08AC16CFGE implements the S08CPUV2 core with HC08 instruction set extension (BGND), 20-MHz bus frequency, and on-chip debug module with eight-deep FIFO, two comparators, and nine trigger modes. Its internal clock generator supports FEI/FEE/FBE/SCM modes with NVM-trimmed precision oscillator and external crystal/resonator options up to 4 MHz.
Peripherals are tightly coupled to the 16-bit address space: dual SCI modules support 13-bit break detection; I²C operates at ≤100 kbps under full bus loading; TPM modules provide edge-aligned and buffered center-aligned PWM across 8 total channels; ADC includes automatic compare function and internal temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction and 40-MHz max frequency - enables deterministic real-time control with minimal code footprint. |
| Memory | 16 KB Flash (in-circuit programmable, block-protected, secure) + 1 KB RAM - supports field firmware updates and data logging without external memory. |
| ADC | 8-channel, 10-bit SAR ADC with auto-compare - allows threshold-triggered actions (e.g., overtemperature shutdown) without CPU intervention. |
| Timers | Three 16-bit TPM modules: two with 2 channels, one with 4 channels; each supports input capture, output compare, and edge/center-aligned PWM - sufficient for motor control and multi-signal timing. |
| Communication | Dual SCI (13-bit break), SPI, and I²C (≤100 kbps full-load) - enables simultaneous serial connectivity to UART devices, sensors, and EEPROMs. |
| Power Modes | Wait + Stop2 + Stop3 modes with LVD active in Stop - achieves sub-μA standby current while retaining RAM and wake-on-peripheral-event capability. |
| Package | 48-pin QFN (98ASA00466D, copper-wire die attach) - surface-mount footprint with exposed thermal pad for improved heat dissipation in compact designs. |
Pinout & Package
MC9S08AC16CFGE is housed in a 48-pin quad flat no-lead (QFN) package per document 98ASA00466D, featuring an exposed thermal pad and 0.5 mm pitch. Pin functions align with MC9S08AC16 series specification (Rev. 9, Aug 2011), with dedicated VDD/VSS pairs, analog supply (VDDAD/VSSAD), reference pins (VREFH/VREFL), and shared peripheral/I/O pins across Ports A–G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDAD | Power supply inputs | VDD powers digital logic; VDDAD supplies ADC and analog circuitry - separate rails reduce noise coupling into sensitive analog measurements. |
| VSS, VSSAD | Ground returns | Digital and analog grounds are split but internally connected - requires careful PCB layout with single-point star grounding near the chip. |
| XTAL / EXTAL | Clock oscillator interface | Supports crystal (32 kHz–4 MHz) or external clock source; internal trimming enables stable bus frequency without precision external components. |
| BKGD/MS | Background debug / mode select | Single-pin BDM interface enables in-circuit debugging and programming; also selects boot mode during reset - eliminates need for dedicated debug headers. |
| RESET | Active-low reset input | Internal pullup reduces BOM count; accepts power-on reset, COP timeout, LVD, or external assertion - ensures deterministic startup. |
| IRQ | External interrupt request | Edge-sensitive input with internal pullup - supports wake-from-Stop and priority-based event handling without external pull-up resistor. |
| PTA0–PTA7 | Port A general-purpose I/O | Configurable as GPIO or SCI0/SPI0/TPM0 signals; software-selectable pullups/slew rate/drive strength - simplifies interface to diverse peripherals. |
| PTB0–PTB7 | Port B general-purpose I/O | Shares functions with SCI1/TPM1/ADC - enables flexible peripheral mapping while maintaining 38 total GPIOs across seven ports. |
Key Features
| Feature | Design Value |
|---|---|
| Background Debug Module (BDM) | Three breakpoint slots (one active + two in debug module), eight-deep FIFO for flow tracing - enables robust firmware validation without ICE hardware. |
| Computer Operating Properly (COP) | Watchdog with independent internal clock option - prevents runaway code even if main clock fails, critical for fail-safe industrial systems. |
| Low-Voltage Detect (LVD) | Programmable trip point with reset or interrupt output - protects against brownout-induced corruption of Flash or RAM contents. |
| ADC Temperature Sensor | On-die sensor calibrated in production - provides system-level thermal monitoring without external components, validated in Table A-9 of Rev. 9 datasheet. |
| Center-Aligned PWM (CPWM) | Buffered CPWM on all TPM channels - reduces EMI in motor drive and lighting applications by minimizing switching harmonics. |
Applications
| Home Appliance Control | Industrial Sensor Node |
|---|---|
|
Use Scenario: Microcontroller in washing machine main control board managing motor drive, water valve actuation, and user interface. IC Role / Device Role / Timing Role: Central system controller executing real-time motor commutation via TPM PWM, reading front-panel buttons via KBI, and communicating with display via SCI. Use Value: Integrated 4-channel TPM and keyboard interrupt eliminate external logic, reducing BOM cost and PCB area while meeting IEC 60335 safety timing requirements. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in factory settings. IC Role / Device Role / Timing Role: Low-power data acquisition node using ADC for analog sensors, I²C for digital sensors, and Stop3 mode for extended battery life. Use Value: Sub-1 μA Stop3 current and LVD-interrupt wake-up enable >5-year operation on coin-cell batteries without compromising measurement accuracy. |
| LED Lighting Driver | Automotive Body Controller Subsystem |
|
Use Scenario: Constant-current LED driver for commercial signage with dimming and thermal foldback. IC Role / Device Role / Timing Role: PWM generator and thermal supervisor using TPM outputs and internal temperature sensor to adjust brightness based on junction temperature. Use Value: On-chip temperature sensing and hardware PWM buffering prevent LED thermal runaway without external ADC or op-amps. |
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Body electronics MCU interfacing with LIN transceivers (via SCI), driving relays via GPIO, and monitoring switches via KBI. Use Value: Dual SCI with 13-bit break supports LIN 2.1 physical layer; internal pullups on IRQ/BKGD/RESET reduce external component count for ASIL-B compliant designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC60CFGE | Same 48-pin QFN package and peripheral set, but 60 KB Flash and 2 KB RAM - no change in pinout or clock architecture. | Targets larger firmware images (e.g., bootloader + application) where MC9S08AC16CFGE's 16 KB Flash is insufficient. | Select when firmware size exceeds 14 KB after security/sector overhead; otherwise MC9S08AC16CFGE offers optimal cost/performance balance. |
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM, same 48-pin LQFP/QFN footprint - not pin-compatible but migration path with compatible peripheral register map. | Required for applications needing higher throughput (e.g., USB HID, complex math) or future scalability beyond 8-bit performance limits. | Choose for new designs targeting long-term roadmap continuity; MC9S08AC16CFGE remains preferred for legacy cost-sensitive replacements. |
Compared with MC9S08AC60CFGE, the MC9S08AC16CFGE trades Flash capacity for lower unit cost and smaller die size, while retaining identical debug, power, and peripheral capabilities. Against S9KEAZ128AMLH, it offers proven 8-bit determinism and lower power in Wait mode but lacks 32-bit compute headroom - making it ideal for stable, volume-sensitive embedded control.
Availability
MC9S08AC16CFGE is available at Aetrix Electronics and suitable for home appliance control, industrial sensor nodes, LED lighting drivers, and automotive body electronics requiring stable component supply and long-lifecycle support.
Supply support for MC9S08AC16CFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, formed from the acquisition of Freescale Semiconductor in 2015.
The MC9S08AC16CFGE belongs to the HCS08 family - designed specifically for cost-optimized, low-power 8-bit control in appliances, industrial panels, and body electronics where deterministic timing and debug reliability outweigh raw processing power.
FAQ
What is the maximum bus frequency supported by the MC9S08AC16CFGE?
The MC9S08AC16CFGE supports a maximum bus frequency of 20 MHz, derived from its 40-MHz CPU core via a 2:1 divider. This frequency is achievable in FEE mode with a 4-MHz crystal and appropriate ICG register configuration, as verified in Section 8.4.7 and Table A-12 of Rev. 9 datasheet.
Does the MC9S08AC16CFGE support in-circuit debugging without additional hardware?
Yes, the MC9S08AC16CFGE integrates a Background Debug Module (BDM) accessible via the BKGD/MS pin, enabling full in-circuit programming and debugging using only a single-wire interface. No external JTAG emulator or debug header is required - the MC9S08AC16CFGE's BDM supports breakpoint setting, memory inspection, and real-time register monitoring.
What package type and dimensions does the MC9S08AC16CFGE use?
The MC9S08AC16CFGE uses a 48-pin quad flat no-lead (QFN) package with 0.5 mm pitch and an exposed thermal pad, documented under case outline 98ASA00466D. Its footprint measures 7 mm × 7 mm with 0.85 mm height, as specified in Appendix B of the Rev. 9 datasheet and confirmed in the QFN Addendum (Rev. 0, July 2014).
Can the MC9S08AC16CFGE operate from an internal clock source only?
Yes, the MC9S08AC16CFGE can operate in Self-Clocked Mode (SCM) using only its internal trimmed RC oscillator, eliminating the need for external crystals or resonators. This mode delivers ~31.25 kHz bus frequency and is suitable for non-timing-critical applications like basic I/O control or wake-up supervision.
How many I/O pins does the MC9S08AC16CFGE provide, and are they configurable?
The MC9S08AC16CFGE provides up to 38 general-purpose I/O pins across Ports A–G, all software-configurable for pullup enable, slew rate control, and drive strength selection. Each port pin can be individually assigned as input or output, and many share alternate functions with peripherals such as SCI, SPI, TPM, and ADC - detailed in Chapter 6 of the Rev. 9 datasheet.
MC9S08AC16CFGE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 44-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC16CFGE FAQ
1.How can I place an order for MC9S08AC16CFGE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC16CFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC16CFGE reliable?
The price and inventory of MC9S08AC16CFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC16CFGE is usually 5 days.
3.What payment methods are accepted for MC9S08AC16CFGE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC16CFGE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC16CFGE?
MC9S08AC16CFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC16CFGE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC16CFGE?
For technical support, including MC9S08AC16CFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC16CFGE requirements.
6.How does Aetrix verify that MC9S08AC16CFGE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC16CFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC16CFGE meets industry standards.
7.What is the process for return or replacement of MC9S08AC16CFGE?
All MC9S08AC16CFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC16CFGE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC16CFGE part is unused and in its original packaging.
Return procedure for MC9S08AC16CFGE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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