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NXP Semiconductors MC9S08AC16CFGER

Part No.:
MC9S08AC16CFGER
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
44-LQFP
Datasheet:
AetrixMC9S08AC16CFGER.pdf
Description:
IC MCU 8BIT 16KB FLASH 44LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,508

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Product details

Overview

MC9S08AC16CFGER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 1 KB RAM, 48-pin QFN package, 20 MHz bus frequency, and integrated peripherals including dual SCI, SPI, I²C, 8-channel 10-bit ADC, and three 16-bit TPM modules. It targets industrial control panels requiring deterministic real-time response, low-power operation, and on-chip debug support.

For engineers reviewing the MC9S08AC16CFGER datasheet, MC9S08AC16CFGER pinout, MC9S08AC16CFGER application, or MC9S08AC16CFGER equivalent, key selection criteria include Flash security options, COP watchdog independence, QFN thermal performance, and compatibility with legacy HCS08 toolchains and BDM debug interfaces.

Technical Context

The MC9S08AC16CFGER implements the S08CPUV2 core with HC08 instruction set extension (BGND), supporting background debugging via BKGD/MS pin and a dedicated on-chip debug module with two comparators, nine trigger modes, and eight-deep FIFO for flow tracing. Its internal clock generator (S08ICGV4) supports multiple modes - FEI, FEE, FBE - with NVM-trimmed internal reference and external crystal/resonator input.

Peripherals are memory-mapped and synchronized to the 20 MHz bus clock: dual SCI modules support 13-bit break detection; I²C operates up to 100 kbps under full bus loading; TPM modules provide edge-aligned and buffered center-aligned PWM with input capture and output compare on all channels; ADC includes automatic compare and temperature sensor interface.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV2 - 40-MHz capable core executing HC08 ISA with BGND instruction for BDM entry.
Bus Frequency20 MHz - determines maximum peripheral timing resolution and instruction throughput in Run mode.
Flash Memory16 KB on-chip FLASH with block protection and security lock - enables field firmware updates and IP protection.
RAM1 KB on-chip RAM - sufficient for stack, variables, and small buffers in real-time control tasks.
ADC8-channel, 10-bit SAR ADC with auto-compare - supports closed-loop analog sensing without CPU polling.
TimersThree 16-bit TPM modules (two 2-channel, one 4-channel) - provides flexible PWM generation and precise time capture for motor control or signal conditioning.
I/O PinsUp to 38 GPIO with software-selectable pullups, slew rate, and drive strength - reduces external components and improves noise immunity in industrial environments.

Pinout & Package

MC9S08AC16CFGER is housed in a 48-pin QFN (quad flat no-lead) package with exposed thermal pad (98ASA00466D), optimized for compact industrial PCBs and improved thermal dissipation over LQFP alternatives.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDADPower supply inputsVDD (digital core) and VDDAD (analog domain) require separate 2.7–5.5 V supplies with local decoupling for noise isolation.
VSS, VSSADGND returnsDigital and analog ground planes must be connected at single point near chip to minimize coupling.
BKGD/MSBackground debug / mode selectSingle-wire BDM interface for programming and real-time debugging; pulled up internally to reduce BOM count.
RESETActive-low reset inputInternal pullup eliminates need for external resistor; accepts power-on reset and COP/LVD-generated resets.
XTAL / EXTALClock oscillator terminalsSupports crystal (32 kHz–8 MHz), ceramic resonator, or external clock source; internal trimming enables stable bus clock without precision external parts.
PTA0–PTA7Port A general-purpose I/OConfigurable as digital I/O or alternate functions (SCI0, SPI0, TPM0); software-controlled pullups/slew/drive enhance EMI resilience.
ADC0–ADC7Analog input channelsShared with Port A and Port E pins; VREFH/VREFL pins allow ratiometric measurement with external reference or internal bandgap.

Key Features

FeatureDesign Value
On-chip debug moduleTwo hardware breakpoints + tag/force triggers + 8-entry FIFO enable non-intrusive runtime analysis without code instrumentation.
COP watchdogIndependent internal clock source option ensures fail-safe reset even if main clock fails - critical for safety-critical industrial logic.
Low-voltage detect (LVD)Programmable threshold (2.5 V / 2.8 V / 3.0 V / 3.3 V) with interrupt or reset output prevents erratic behavior during brownout conditions.
Peripheral clock gatingIndividual enable/disable per module (SCI, SPI, I²C, TPM) reduces dynamic power in Wait/Stop modes without disabling entire bus.
FLASH securityNon-volatile lock bits prevent unauthorized read-out of firmware - essential for protecting proprietary control algorithms.

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Brushless DC motor commutation in HVAC blowers using Hall-effect feedback and PWM-driven gate drivers.

IC Role / Device Role / Timing Role: Real-time execution of commutation logic, ADC sampling of current/voltage, and generation of synchronized 3-phase PWM signals via TPM modules.

Use Value: Integrated TPM center-aligned PWM and ADC auto-compare eliminate external timer/compare ICs, reducing component count and jitter in timing-critical switching cycles.

Use Scenario: Battery-powered environmental sensor hub collecting temperature, humidity, and CO₂ via analog and I²C interfaces, then transmitting data via SCI UART to gateway.

IC Role / Device Role / Timing Role: Low-power system controller managing sensor polling intervals, ADC conversions, and serial transmission bursts while minimizing active duty cycle.

Use Value: Stop2/Stop3 modes with wake-up on SCI receive or KBI event extend battery life beyond 2 years; internal LVD prevents data corruption during voltage sag.

Home Appliance UI PanelAutomated Test Fixture

Use Scenario: Keypad-driven user interface for washing machine control board with LED indicators, buzzer, and relay drivers.

IC Role / Device Role / Timing Role: Keyboard interrupt handler (KBI) scanning 7-key matrix, driving GPIO-controlled outputs, and managing state transitions via internal timers.

Use Value: Dedicated KBI module offloads CPU from polling; software-selectable pullups eliminate external resistors; internal RESET pullup simplifies reset circuitry.

Use Scenario: Production-line functional tester verifying analog sensor calibration, digital I/O response, and communication protocol compliance across 100+ units/hour.

IC Role / Device Role / Timing Role: Self-test coordinator executing scripted sequences: ADC linearity check, SPI loopback, SCI echo test, and FLASH integrity verification.

Use Value: On-chip BDM interface enables automated flash programming and debug access without JTAG adapter; built-in COP and LVD ensure test stability under variable lab power conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08AC32CFGER32 KB Flash, same package/peripherals - doubles program space for larger control algorithms or bootloader + application separation.Required when firmware exceeds 16 KB or secure OTA update capability is needed.Select when future firmware growth or dual-bank update architecture is mandated.
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, enhanced ADC (16-bit), but different toolchain and debug interface (SWD vs BDM).Migration path for higher performance or mixed-signal precision; not drop-in compatible.Choose for new designs needing >20 MIPS, richer peripheral set, or long-term roadmap alignment with NXP's Kinetis portfolio.

Compared with MC9S08AC16CFGER, MC9S08AC32CFGER offers scalable Flash without architectural change, while S9KEAZ128AMLH delivers significantly higher compute throughput and resolution at the cost of toolchain migration and layout redesign.

Availability

MC9S08AC16CFGER is available at Aetrix Electronics and suitable for industrial motor controllers, smart sensor nodes, home appliance UI panels, and automated test fixtures requiring stable component supply and long-lifecycle support.

Supply support for MC9S08AC16CFGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The HCS08 family - including MC9S08AC16CFGER - was designed for cost-sensitive, real-time embedded control applications demanding high reliability, low power, and robust debug capabilities in harsh environments.

FAQ

What is the maximum bus frequency supported by the MC9S08AC16CFGER?

The MC9S08AC16CFGER supports a maximum bus frequency of 20 MHz, derived from its internal clock generator (ICG) operating in FEI, FEE, or FBE modes. This frequency governs peripheral timing, instruction execution speed, and ADC conversion rate. The core CPU can operate at up to 40 MHz, but the bus clock remains limited to 20 MHz for synchronization across on-chip modules. All timing specifications in the MC9S08AC16CFGER datasheet are validated at this 20 MHz bus rate.

Does the MC9S08AC16CFGER support in-circuit debugging without additional hardware?

Yes, the MC9S08AC16CFGER includes a fully integrated background debug module (BDM) accessible via the single BKGD/MS pin. No external debugger pod is required - standard BDM interfaces (e.g., P&E Multilink, OSJTAG) connect directly to this pin and VDD/VSS for flash programming, breakpoint setting, and real-time register inspection. The MC9S08AC16CFGER debug module supports two hardware breakpoints, trigger-based event capture, and an 8-deep FIFO for flow tracing, enabling comprehensive diagnostics without code modification.

What package type and thermal characteristics does the MC9S08AC16CFGER use?

The MC9S08AC16CFGER uses a 48-pin QFN package (case outline 98ASA00466D) with an exposed thermal pad. This package measures 7 mm × 7 mm × 0.85 mm and features copper wire bonding for improved reliability over earlier gold-wire variants. The exposed pad must be soldered to a thermal plane on the PCB to achieve θJA ≈ 42°C/W. Thermal performance is superior to equivalent 48-pin LQFP packages, making the MC9S08AC16CFGER suitable for enclosed industrial enclosures where airflow is limited.

Can the MC9S08AC16CFGER operate from a 3.3 V supply while maintaining full peripheral functionality?

Yes, the MC9S08AC16CFGER operates across a 2.7 V to 5.5 V supply range, and all peripherals - including ADC, SCI, SPI, I²C, and TPM - are fully functional at 3.3 V. The ADC reference can be configured for 3.3 V ratiometric operation using VREFH/VREFL pins, and internal voltage regulators ensure stable core and analog domain operation. At 3.3 V and 20 MHz bus frequency, the MC9S08AC16CFGER meets all AC/DC electrical specifications defined in its datasheet, including propagation delays and setup/hold times.

How is Flash memory protected against unauthorized access in the MC9S08AC16CFGER?

Flash protection in the MC9S08AC16CFGER is implemented via non-volatile security bits (FOPT register) that disable read-out of Flash contents and prevent mass erase when set. Once secured, only a complete chip erase - which clears all Flash and RAM - restores accessibility, and this operation requires the BDM interface with valid security key. The MC9S08AC16CFGER also supports block-level protection (FPROT register) to lock specific Flash regions independently, allowing bootloader code to remain readable while application code stays protected.

MC9S08AC16CFGER Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
44-LQFP
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08AC16CFGER FAQ

1.How can I place an order for MC9S08AC16CFGER through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08AC16CFGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08AC16CFGER reliable?

The price and inventory of MC9S08AC16CFGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC16CFGER is usually 5 days.

3.What payment methods are accepted for MC9S08AC16CFGER?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC16CFGER transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08AC16CFGER?

MC9S08AC16CFGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08AC16CFGER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08AC16CFGER?

For technical support, including MC9S08AC16CFGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC16CFGER requirements.

6.How does Aetrix verify that MC9S08AC16CFGER is sourced from the original manufacturer or authorized distributors?

All MC9S08AC16CFGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC16CFGER meets industry standards.

7.What is the process for return or replacement of MC9S08AC16CFGER?

All MC9S08AC16CFGER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC16CFGER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08AC16CFGER part is unused and in its original packaging.

Return procedure for MC9S08AC16CFGER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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