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NXP Semiconductors MC9S08AC16MFGE

Part No.:
MC9S08AC16MFGE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
44-LQFP
Datasheet:
AetrixMC9S08AC16MFGE.pdf
Description:
IC MCU 8BIT 16KB FLASH 44LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,539

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Product details

Overview

MC9S08AC16MFGE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 1 KB RAM, 40-MHz CPU, 3× 16-bit TPM timers, dual SCI, SPI, I²C, 8-channel 10-bit ADC, and up to 38 GPIO - designed for industrial control, appliance motor management, and automotive body electronics.

For engineers reviewing the MC9S08AC16MFGE datasheet, MC9S08AC16MFGE pinout, MC9S08AC16MFGE application, or MC9S08AC16MFGE equivalent, key selection criteria include QFN-48 package compatibility, on-chip debug support with background mode, COP watchdog independence, low-voltage detection interrupt capability, and Flash security options for firmware protection.

Technical Context

The MC9S08AC16MFGE implements the S08CPUV2 core with HC08 instruction set extension (BGND), 20-MHz bus frequency, and integrated internal clock generator supporting FEI/FEE/FBE modes with NVM-trimmed precision. It features a three-module timer subsystem (TPM) - two 2-channel and one 4-channel - each configurable for input capture, output compare, edge-aligned or buffered center-aligned PWM.

Peripherals include dual SCI modules with 13-bit break support, SPI V3, I²C V2 (up to 100 kbps under full bus loading), and an ADC with automatic compare function and internal temperature sensor. System-level protection includes COP reset with independent clock source option, LVD interrupt/reset, illegal opcode/address detection, and Flash block protection.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV2 with BGND instruction and 40-MHz max core frequency
Memory16 KB on-chip Flash (block-protected, secure), 1 KB RAM
ADC8-channel, 10-bit SAR ADC with auto-compare and internal temp sensor
TimersThree 16-bit TPM modules: two 2-channel + one 4-channel, supporting PWM, input capture, output compare
CommunicationDual SCI, SPI V3, I²C V2 (100 kbps standard-mode, higher with reduced loading)
Package48-pin QFN (98ASA00466D), copper-wire bonded, exposed thermal pad
DebugOn-chip BDM module with 3 breakpoints, 8-deep FIFO, tag/force trigger modes

Pinout & Package

MC9S08AC16MFGE is housed in a 48-pin quad flat no-lead (QFN) package per outline 98ASA00466D, featuring an exposed thermal pad for enhanced thermal dissipation and mechanical stability. Pin assignments follow Freescale's standardized HCS08 QFN layout with dedicated VDD/VSS pairs, analog supply separation (VDDAD/VSSAD), and multiplexed peripheral functions across Ports A–G.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDADPower supply inputsVDD = digital core supply (2.7–5.5 V); VDDAD = separate analog supply for ADC reference stability
VSS, VSSADGround returnsVSS = digital ground; VSSAD = isolated analog ground to minimize noise coupling into ADC
XTAL / EXTALClock oscillator interfaceSupports crystal/resonator (32 kHz–4 MHz) or external clock source for precise timing control
BKGD/MSBackground debug / mode selectSingle-pin BDM interface for in-circuit debugging; also selects boot mode during reset
RESETActive-low reset inputInternal pullup reduces external component count; accepts power-on reset and COP/LVD-generated resets
VREFH / VREFLADC reference terminalsEnable external precision reference or internal VDD-based scaling for flexible analog measurement range
IRQExternal interrupt requestEdge-sensitive input with internal pullup; supports wake-up from Wait/Stop modes
PTA0–PTA7, PTB0–PTB7, etc.GPIO / peripheral multiplexingAll ports support software-selectable pullups, slew rate, and drive strength - critical for EMI control and signal integrity

Key Features

FeatureDesign Value
Flash Security & ProtectionConfigurable block protection and security lock preventing unauthorized read-out or reprogramming of firmware
Low-Power OperationWait + Stop2/Stop3 modes with selective peripheral retention; LVD active in Stop modes for battery monitoring
Robust Debug InterfaceOn-chip BDM with 3 breakpoints, event-triggered trace capture, and background memory access without halting execution
Flexible Clock GenerationInternal clock generator with FLL, trimmable via NVM, supporting multiple modes (FEI/FEE/FBE) for system flexibility and cost reduction
Peripheral IntegrationFull UART/SCI stack (dual), SPI, I²C, 3× TPM, KBI, and ADC - eliminates need for external interface ICs in compact designs

Applications

Home Appliance ControlAutomotive Body Electronics

Use Scenario: Washing machine main control unit managing motor speed, water level sensing, and user interface.

IC Role / Device Role / Timing Role: Primary MCU executing real-time motor control loops, ADC sampling of pressure/temperature sensors, and serial communication with display panel.

Use Value: Integrated 4-channel TPM enables precise 3-phase motor PWM generation; dual SCI supports diagnostics and CAN gateway bridging via external transceiver.

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN bus connectivity.

IC Role / Device Role / Timing Role: Local node MCU handling switch debouncing, PWM dimming, and LIN physical layer interfacing via SCI with external LIN transceiver.

Use Value: On-chip LVD detection ensures safe shutdown during battery brownout; Flash security prevents firmware tampering in service environments.

Industrial Sensor NodeSmart Power Outlet

Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and ambient light for building automation.

IC Role / Device Role / Timing Role: Low-power data acquisition MCU performing periodic ADC conversions, storing logs in Flash, and transmitting via SPI to wireless sub-GHz transceiver.

Use Value: Stop3 mode draws <1 µA; internal temperature sensor enables self-calibration; KBI supports wake-on-button press without external logic.

Use Scenario: Energy-monitoring smart outlet with relay control, current sensing, and Bluetooth LE communication.

IC Role / Device Role / Timing Role: System controller managing zero-cross detection (via GPIO edge capture), RMS current calculation (ADC), relay timing (TPM), and host interface (SCI).

Use Value: Dual SCI allows simultaneous connection to BLE module and host MCU; 16 KB Flash accommodates OTA update bootloader and application.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08AC60CFGE60 KB Flash, same QFN-48 package, identical peripheral set and pinoutHigher Flash capacity supports larger firmware, bootloader + application separation, or expanded feature setsSelect when firmware size exceeds 16 KB or future scalability is required without PCB change
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, QFP-64 package32-bit performance, floating-point support, enhanced peripherals (USB, DMA), but different toolchain and layoutSelect when migrating to 32-bit architecture for increased computational headroom or long-term roadmap alignment

Compared with MC9S08AC16MFGE, MC9S08AC60CFGE offers direct Flash scalability within identical hardware constraints, while S9KEAZ128AMLH provides architectural evolution at the cost of redesign effort - making the former ideal for incremental upgrades and the latter for next-generation platforms.

Availability

MC9S08AC16MFGE is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart home appliance applications requiring stable component supply, long-lifecycle support, and qualified automotive-grade variants.

Supply support for MC9S08AC16MFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and communication infrastructure markets.

The MC9S08AC16MFGE belongs to the legacy HCS08 microcontroller family, engineered for cost-sensitive, real-time embedded systems where deterministic 8-bit performance, low power, and high integration are essential - especially in white goods and entry-level automotive ECUs.

FAQ

What is the maximum operating frequency of the MC9S08AC16MFGE CPU core?

The MC9S08AC16MFGE CPU core operates at up to 40 MHz, while its internal bus frequency is rated at 20 MHz. This architecture enables efficient instruction execution with predictable timing behavior, critical for real-time control tasks such as motor commutation and sensor sampling. The core uses the S08CPUV2 implementation with HC08 instruction set extensions including BGND for background debugging.

Does the MC9S08AC16MFGE support in-circuit debugging without external hardware?

Yes, the MC9S08AC16MFGE integrates an on-chip background debug module (BDM) accessible via the BKGD/MS pin. This allows full in-circuit debugging - including breakpoint setting, memory inspection, and register monitoring - without requiring external emulators. The MC9S08AC16MFGE BDM supports three breakpoints (one active + two in debug module), eight-deep FIFO trace, and both tag and force trigger modes for robust development workflows.

What package type and pin count does the MC9S08AC16MFGE use?

The MC9S08AC16MFGE uses a 48-pin quad flat no-lead (QFN) package with outline number 98ASA00466D. This copper-wire-bonded variant replaces earlier gold-wire versions and includes an exposed thermal pad for improved heat dissipation. The pinout is fully compatible with other HCS08 QFN devices like MC9S08AC60CFGE, enabling footprint reuse across the AC-series family.

Can the MC9S08AC16MFGE operate from a single 3.3 V supply?

Yes, the MC9S08AC16MFGE supports operation from a single 3.3 V supply within its specified voltage range of 2.7 V to 5.5 V. Its internal regulators and clock generator are designed to maintain full functionality - including Flash programming, ADC conversion, and peripheral operation - across this range. At 3.3 V, the device delivers consistent 20-MHz bus performance and meets all electrical specifications in the Rev. 9 datasheet.

How many analog-to-digital converter channels does the MC9S08AC16MFGE provide?

The MC9S08AC16MFGE includes an 8-channel, 10-bit successive approximation register (SAR) ADC. Each channel supports programmable sample time, automatic comparison against configurable thresholds, and optional triggering by TPM or real-time interrupt. An internal temperature sensor is also integrated and accessible via dedicated ADC channel, enabling self-monitoring without external components.

MC9S08AC16MFGE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
44-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08AC16MFGE FAQ

1.How can I place an order for MC9S08AC16MFGE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08AC16MFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08AC16MFGE reliable?

The price and inventory of MC9S08AC16MFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC16MFGE is usually 5 days.

3.What payment methods are accepted for MC9S08AC16MFGE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC16MFGE transactions.

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4.How is shipping managed for MC9S08AC16MFGE?

MC9S08AC16MFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08AC16MFGE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08AC16MFGE?

For technical support, including MC9S08AC16MFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC16MFGE requirements.

6.How does Aetrix verify that MC9S08AC16MFGE is sourced from the original manufacturer or authorized distributors?

All MC9S08AC16MFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC16MFGE meets industry standards.

7.What is the process for return or replacement of MC9S08AC16MFGE?

All MC9S08AC16MFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC16MFGE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08AC16MFGE part is unused and in its original packaging.

Return procedure for MC9S08AC16MFGE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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