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NXP Semiconductors MC9S08AC32CFGE
- Part No.:
- MC9S08AC32CFGE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 44-LQFP
- Datasheet:
-
MC9S08AC32CFGE.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 44LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:860
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Product details
Overview
MC9S08AC32CFGE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU core, 32 KB on-chip FLASH memory, and 2 KB RAM. It integrates dual SCI modules supporting LIN 2.0 and SAE J2602, a 16-channel 10-bit ADC, and three timer/PWM modules - deployed in automotive body control modules for window lift, lighting, and door lock actuation.
For engineers reviewing the MC9S08AC32CFGE datasheet, MC9S08AC32CFGE pinout, MC9S08AC32CFGE application, or MC9S08AC32CFGE equivalent, key selection criteria include its 32-pin LQFP package with 28 GPIOs, internal clock generator with NVM-trimmed precision, COP watchdog with independent 1 kHz clock source, and hardware CRC module for firmware integrity verification.
Technical Context
The MC9S08AC32CFGE implements the HCS08 CPUV2 core with HC08 instruction set extension including BGND, operating at up to 40 MHz core frequency and 20 MHz bus frequency. Its memory subsystem includes 32 KB of user-programmable FLASH with block protection and security options, plus 2 KB of SRAM with retention in Stop2 mode.
Peripherals are tightly coupled to the bus architecture: two SCI modules support master/slave extended break for LIN communication; the 16-bit TPM modules offer input capture, output compare, and edge-aligned or centered PWM; and the S08ADC10V1 ADC supports hardware-triggered conversions with automatic compare against configurable thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 CPUV2, 40-MHz max core frequency - enables real-time deterministic response in safety-critical automotive sub-systems. |
| Memory | 32 KB FLASH + 2 KB RAM - sufficient for LIN node firmware with diagnostics, EEPROM emulation, and bootloader space. |
| ADC | 16-channel, 10-bit SAR ADC with auto-compare - supports analog sensor monitoring (e.g., potentiometer position, temperature) without CPU intervention. |
| SCI Modules | Two LIN-capable SCI interfaces - each supports SAE J2602-compliant break generation/detection for multi-node vehicle networks. |
| Timers | Three TPM modules (two 2-channel, one 6-channel) - provide flexible PWM for motor control and input capture for encoder or switch timing. |
| Package | 32-pin LQFP (7 × 7 mm, 0.8 mm pitch) - RoHS-compliant surface-mount package compatible with standard reflow profiles. |
| Power Modes | Wait, Stop2, Stop3 - Stop2 retains RAM and peripheral clocks while drawing <1 µA, enabling ultra-low-power wake-on-IRQ operation. |
Pinout & Package
MC9S08AC32CFGE is housed in a 32-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad (case outline 98ASA00473D), measuring 7 mm × 7 mm × 1.4 mm. Pin 1 is marked by a corner notch; pins are numbered counter-clockwise starting from top-left.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Dual 5.0 V supply rails - VDD powers digital logic; VSS provides reference return path for all I/O and internal circuits. |
| VDDAD, VSSAD | Analog power and ground | Isolated analog domain supply - separates noise-sensitive ADC and internal reference from digital switching transients. |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 1–8 MHz crystal or ceramic resonator - provides stable system clock source with ±0.5% accuracy over temperature. |
| RESET | Active-low reset input | Internal pullup ensures reliable power-on reset; accepts external reset assertion or brownout recovery signal. |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface - enables in-circuit debugging, flash programming, and breakpoint control via dedicated debug pod. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with software-selectable pullups, slew rate, and drive strength - used for LED drivers, switch inputs, or LIN TX/RX routing. |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port supporting keyboard interrupt (KBI) - configured for matrix keypad scanning or wake-on-key event detection. |
| SCI0_TX, SCI0_RX | LIN channel 0 serial interface | Dedicated UART pins with LIN physical layer compatibility - support 10–20 kbps baud rates with extended break framing per SAE J2602. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip CRC module (S08CRCV1) | Hardware-accelerated 16-bit CRC-ITU calculation - verifies FLASH integrity during boot or OTA update without CPU overhead. |
| Internal Clock Generator (ICG) | NVM-trimmed internal oscillator with ±2% accuracy over -40°C to +105°C - eliminates external crystal for cost-sensitive LIN slave nodes. |
| Computer Operating Properly (COP) watchdog | Configurable timeout with independent 1 kHz internal clock - ensures fail-safe reset even if main clock fails or software hangs. |
| Low-Voltage Detect (LVD) | Programmable trip points (e.g., 4.2 V, 3.8 V) with interrupt or reset option - prevents erratic operation during battery sag in 12 V automotive systems. |
| Background Debug Module (BDM) | Single-wire interface with two hardware breakpoints and 8-deep FIFO trace buffer - enables non-intrusive debugging in production firmware. |
Applications
| Automotive Door Module | LED Lighting Controller |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger car door assemblies. IC Role / Device Role / Timing Role: Primary MCU executing LIN slave protocol, managing motor drivers, reading switch inputs, and reporting status via LIN cluster. Use Value: Integrated LIN SCI, 28 GPIOs, and robust ESD tolerance meet ISO 10605 requirements for in-vehicle deployment without external level-shifting. |
Use Scenario: Dimmable ambient and functional LED lighting in instrument clusters and center consoles. IC Role / Device Role / Timing Role: PWM generator and current-sense ADC processor - regulates LED brightness via 16-bit edge-aligned PWM and monitors thermal foldback. Use Value: Hardware-centered PWM and automatic ADC compare reduce CPU load, enabling simultaneous CAN/LIN gateway tasks in shared ECU designs. |
| Body Control Unit (BCU) Subnode | Smart Actuator Interface |
Use Scenario: Secondary control node managing trunk release, fuel flap, and seat position memory in mid-tier vehicles. IC Role / Device Role / Timing Role: LIN slave MCU with secure boot and CRC-verified firmware - receives commands from main BCU and executes local actuation logic. Use Value: 32 KB FLASH with security options prevents unauthorized firmware modification; Stop2 mode enables <1 µA sleep current for always-on monitoring. |
Use Scenario: Interface between microcontroller and brushed DC motors or solenoids in HVAC dampers or sunroof mechanisms. IC Role / Device Role / Timing Role: Real-time PWM controller with input capture for hall-effect feedback - synchronizes motor commutation and fault detection. Use Value: Three TPM modules provide dedicated channels for PWM generation, direction control, and encoder pulse counting - eliminating need for external timing ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZN32ACLH | ARM Cortex-M0+ core, 48 MHz, 32 KB FLASH, same 32-pin LQFP package but different pinout and no native LIN SCI - requires software LIN stack. | Targets next-gen designs requiring higher compute headroom and CMSIS-RTOS compatibility, not drop-in replacement. | Select when migrating to ARM ecosystem with toolchain continuity and future scalability needs. |
| MC9S08AC48CFGE | Same HCS08 core, 48 KB FLASH, identical pinout and peripheral set - differs only in memory size and part marking. | Direct upgrade path for designs needing larger code space without layout or firmware changes. | Choose for incremental feature expansion (e.g., added diagnostics or bootloader size) while retaining full hardware compatibility. |
Compared with MC9S08AC32CFGE, S9KEAZN32ACLH offers higher performance but requires firmware rewrite and lacks hardware LIN support, whereas MC9S08AC48CFGE delivers seamless memory scaling with zero PCB or driver modifications.
Availability
MC9S08AC32CFGE is available at Aetrix Electronics and suitable for automotive body electronics, LIN network nodes, and industrial control panels requiring stable component supply across extended temperature ranges (-40°C to +105°C).
Supply support for MC9S08AC32CFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog solutions for automotive, industrial, and networking markets.
The MC9S08AC32CFGE belongs to the HCS08 AC-series - optimized for cost-sensitive, functionally safe automotive sub-systems requiring LIN compliance, robust EMC performance, and long-term supply stability.
FAQ
What is the maximum operating frequency of the MC9S08AC32CFGE CPU core?
The MC9S08AC32CFGE features an HCS08 CPUV2 core with a maximum core frequency of 40 MHz. Its internal bus operates at up to 20 MHz, and the core frequency is derived from the selected clock source - either an external crystal (1–8 MHz), internal ICG oscillator, or external clock input - scaled via programmable dividers. This timing enables deterministic execution of LIN protocol stacks and real-time motor control loops.
Does the MC9S08AC32CFGE support LIN 2.0 physical layer directly?
Yes, the MC9S08AC32CFGE includes two hardware SCI modules that natively support LIN 2.0 and SAE J2602 specifications. Each SCI provides dedicated registers for master extended break generation and slave extended break detection, eliminating the need for bit-banged timing or external transceivers in basic LIN slave implementations.
What package type and dimensions does the MC9S08AC32CFGE use?
The MC9S08AC32CFGE is packaged in a 32-pin Low-Profile Quad Flat Package (LQFP) with case outline number 98ASA00473D. Its footprint measures 7 mm × 7 mm with 0.8 mm pin pitch and 1.4 mm maximum height, including the exposed thermal pad on the bottom side for enhanced heat dissipation in automotive under-hood environments.
How much FLASH and RAM memory does the MC9S08AC32CFGE contain?
The MC9S08AC32CFGE integrates 32 KB of on-chip FLASH memory with block-level protection and security options, plus 2 KB of SRAM. The FLASH supports in-application programming (IAP) and includes a dedicated CRC module for integrity checking. RAM retains data in Stop2 mode, enabling fast wake-up with preserved context for low-power sensor polling tasks.
Is the MC9S08AC32CFGE pin-compatible with other members of the AC-series?
No - the MC9S08AC32CFGE uses a 32-pin LQFP package, while other AC-series devices like MC9S08AC60 and MC9S08AC48 are offered in 44-, 48-, or 64-pin packages. However, MC9S08AC48CFGE shares the identical 32-pin LQFP footprint and pinout with MC9S08AC32CFGE, differing only in FLASH size and part marking - making it a direct memory-upgrade option.
MC9S08AC32CFGE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 44-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC32CFGE FAQ
1.How can I place an order for MC9S08AC32CFGE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC32CFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC32CFGE reliable?
The price and inventory of MC9S08AC32CFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC32CFGE is usually 5 days.
3.What payment methods are accepted for MC9S08AC32CFGE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC32CFGE transactions.
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4.How is shipping managed for MC9S08AC32CFGE?
MC9S08AC32CFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC32CFGE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC32CFGE?
For technical support, including MC9S08AC32CFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC32CFGE requirements.
6.How does Aetrix verify that MC9S08AC32CFGE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC32CFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC32CFGE meets industry standards.
7.What is the process for return or replacement of MC9S08AC32CFGE?
All MC9S08AC32CFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC32CFGE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC32CFGE part is unused and in its original packaging.
Return procedure for MC9S08AC32CFGE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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