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NXP Semiconductors MC9S08AC32CFGER

Part No.:
MC9S08AC32CFGER
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
44-LQFP
Datasheet:
AetrixMC9S08AC32CFGER.pdf
Description:
IC MCU 8BIT 32KB FLASH 44LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,290

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Product details

Overview

MC9S08AC32CFGER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core operating at up to 20-MHz bus frequency. It integrates dual SCI modules supporting LIN 2.0, two SPI, one I²C, 16-channel 10-bit ADC, and six-channel TPM for motor control in automotive body electronics.

For engineers reviewing the MC9S08AC32CFGER datasheet, MC9S08AC32CFGER pinout, MC9S08AC32CFGER application, or MC9S08AC32CFGER equivalent, key selection criteria include QFN-48 package compatibility, on-chip debug support via BKGD/MS pin, COP watchdog with independent 1 kHz clock source, and CRC hardware acceleration for firmware integrity verification.

Technical Context

The MC9S08AC32CFGER implements the S08CPUV2 core with HC08 instruction set extension including BGND, and supports active background debugging via single-wire BKGD interface. Its internal clock generator (ICG) provides precision NVM-trimmed internal reference with crystal/resonator/external clock options.

Peripherals include two SCI modules with master/slave extended break handling for LIN compliance, a 16-bit TPM module configurable for edge-aligned or centered PWM, and a dedicated hardware CRC engine supporting ITU-T polynomial (0x1021) for memory checksums and bootloader validation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV2 - 40-MHz capable core with 20-MHz bus clock for deterministic real-time execution
FLASH Memory32 KB on-chip FLASH with block protection, security options, and 512-byte sector erase for firmware updates
RAM2 KB on-chip RAM - sufficient for stack, variables, and small buffers in automotive sensor nodes
ADC16-channel 10-bit SAR ADC with automatic compare, temperature sensor input, and hardware trigger support
TimersTwo 2-channel + one 6-channel 16-bit TPM - enables simultaneous motor phase control and system timing
I/O PinsUp to 48 general-purpose I/O pins in QFN-48 package with software-selectable pullups, slew rate, and drive strength
Debug InterfaceSingle-wire Background Debug Mode (BDM) with breakpoint capability and 8-deep FIFO trace buffer

Pinout & Package

MC9S08AC32CFGER is housed in a 48-pin QFN package (98ASA00466D) with 0.5 mm pitch and exposed thermal pad. The package supports copper wire bonding per Freescale QFN migration addendum Rev. 0 (July 2014).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem isolation
XTAL / EXTALClock input/outputSupports external crystal (1–8 MHz) or resonator; enables precise timing for LIN baud rate generation
BKGD/MSDebug and mode selectSingle-wire BDM interface - enables in-circuit programming and real-time debugging without JTAG overhead
RESETMaster reset inputActive-low reset with internal pullup - eliminates external resistor in cost-sensitive automotive modules
VREFH / VREFLADC reference inputsAllows external precision reference or internal VDDAD connection for ratiometric sensor measurements
PTA0–PTA7Port A general-purpose I/OConfigurable as GPIO or peripheral function (SCI0, SPI0, TPM0); supports interrupt-on-change for wake-up
PTB0–PTB7Port B general-purpose I/OIncludes IRQ input and KBI-capable pins for keypad scanning or switch monitoring in body control units
PTC0–PTC7Port C general-purpose I/OSCI1, I²C, TPM1 signals mapped here - enables dual serial interfaces for gateway applications
PTD0–PTD7Port D general-purpose I/OTPM2 channels and ADC inputs assigned - supports multi-phase motor control with analog feedback
PTE0–PTE7Port E general-purpose I/OIncludes ADC channel inputs and optional CRC data input - enables hardware-accelerated firmware signature checking

Key Features

FeatureDesign Value
LIN 2.0-compliant SCIDual SCI modules with master extended break generation and slave extended break detection - meets SAE J2602 timing requirements for automotive network nodes
Hardware CRC EngineDedicated 16-bit CRC module using ITU-T polynomial (0x1021) - validates FLASH contents or message payloads in <1 µs per 16-bit word
Low-Voltage Detect (LVD)Programmable LVD threshold (2.5 V / 2.7 V / 3.0 V) with interrupt or reset output - prevents erratic operation during battery brownout in vehicle systems
Stop2/Stop3 Power ModesSub-µA current draw in Stop2 with RTC and LVD active - extends battery life in always-on automotive modules like door modules or seat controllers
On-Chip SecurityFLASH security byte and NVOPT lock bits prevent unauthorized read-out of firmware - satisfies OEM requirements for IP protection in ECUs

Applications

Automotive Door ModuleBody Control Unit (BCU)

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing LIN slave communication with door nodes and managing local PWM-driven motor drivers.

Use Value: Integrated 6-channel TPM enables concurrent control of up to three bidirectional motors; dual SCI supports both LIN trunk and local UART diagnostics.

Use Scenario: Main controller for vehicle lighting, wipers, horn, and HVAC actuators in entry-level platforms.

IC Role / Device Role / Timing Role: System coordinator interfacing with CAN gateway via external transceiver while managing local I/O and analog sensors.

Use Value: 16-channel ADC monitors potentiometer-based HVAC controls and thermistor inputs; hardware CRC ensures bootloader integrity during OTA updates.

Seat Position ControllerSmart Junction Box

Use Scenario: Motorized adjustment of driver/passenger seat position, lumbar support, and headrest height.

IC Role / Device Role / Timing Role: Dedicated motion controller with analog feedback loop closure via ADC and PWM output modulation.

Use Value: Center-aligned PWM on TPM channels reduces audible motor noise; temperature sensor input enables thermal derating of motor drivers.

Use Scenario: Distributed power distribution unit managing fused outputs for lighting, sensors, and actuators across vehicle zones.

IC Role / Device Role / Timing Role: Local intelligence node performing load monitoring, short-circuit detection, and LIN-based status reporting.

Use Value: Software-selectable I/O drive strength allows direct driving of low-side switches; LVD interrupt triggers graceful shutdown during battery voltage sag.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08AC32F1MLCSame HCS08 core, identical 32 KB FLASH/RAM, but in 44-pin LQFP package - no exposed thermal padLQFP variant requires different PCB layout and offers lower thermal performance than QFN-48Select when board space permits larger footprint and thermal management is less critical
MC9S08AW32CFGESame QFN-48 package and pinout, but with enhanced analog features: 12-bit ADC, additional comparator, and higher VDD tolerance (5.5 V)Targeted at higher-precision sensor conditioning and wider supply range applicationsSelect when upgrading analog accuracy or operating beyond 5.25 V nominal supply is required

Compared with MC9S08AC32CFGER, S9S08AC32F1MLC trades thermal efficiency for assembly simplicity, while MC9S08AW32CFGE extends analog capability at the cost of increased BOM cost and potential over-specification for basic LIN node roles.

Availability

MC9S08AC32CFGER is available at Aetrix Electronics and suitable for automotive body electronics, LIN network nodes, and embedded motor control applications requiring stable component supply and long-term industrial availability.

Supply support for MC9S08AC32CFGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The HCS08 family, including MC9S08AC32CFGER, was designed specifically for cost-sensitive, high-reliability automotive body electronics where LIN compliance, on-chip debug, and robust power management are essential.

FAQ

What is the package type and thermal pad configuration of the MC9S08AC32CFGER?

The MC9S08AC32CFGER uses a 48-pin QFN package (98ASA00466D) with an exposed thermal pad on the bottom surface. This copper pad must be soldered to a large PCB copper pour for effective heat dissipation and electrical grounding, per Freescale EB806 application note. The package supports copper wire bonding and is RoHS-compliant.

Does the MC9S08AC32CFGER support LIN 2.0 communication natively?

Yes, the MC9S08AC32CFGER supports LIN 2.0 natively through its dual SCI modules, which implement master extended break generation and slave extended break detection per SAE J2602. Each SCI can operate independently, enabling one port for LIN cluster communication and another for diagnostics or secondary network bridging.

What debug capabilities does the MC9S08AC32CFGER provide during development?

The MC9S08AC32CFGER includes an on-chip background debug module (BDM) accessible via the BKGD/MS pin. It supports single-wire in-circuit debugging, one hardware breakpoint, two additional breakpoints in the debug module, and an 8-deep FIFO for change-of-flow address logging - all without requiring external JTAG hardware.

How does the MC9S08AC32CFGER handle power supply variations in automotive environments?

The MC9S08AC32CFGER incorporates a programmable Low-Voltage Detect (LVD) system with selectable thresholds (2.5 V, 2.7 V, 3.0 V), capable of generating either an interrupt or reset. Combined with COP watchdog running from an independent 1 kHz internal clock, it ensures fail-safe behavior during battery voltage sags or transients common in 12 V vehicle electrical systems.

Is the MC9S08AC32CFGER pin-compatible with other members of the AC-series microcontrollers?

No - the MC9S08AC32CFGER in QFN-48 is not fully pin-compatible with AC60 or AC48 variants due to differences in peripheral mapping and I/O count. While it shares the same package outline and pin count with MC9S08AC60CFGER, specific signal assignments (e.g., ADC channel availability, TPM channel routing) differ and require schematic review before substitution.

MC9S08AC32CFGER Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
44-LQFP
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08AC32CFGER FAQ

1.How can I place an order for MC9S08AC32CFGER through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08AC32CFGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08AC32CFGER reliable?

The price and inventory of MC9S08AC32CFGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC32CFGER is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC32CFGER transactions.

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4.How is shipping managed for MC9S08AC32CFGER?

MC9S08AC32CFGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08AC32CFGER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08AC32CFGER?

For technical support, including MC9S08AC32CFGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC32CFGER requirements.

6.How does Aetrix verify that MC9S08AC32CFGER is sourced from the original manufacturer or authorized distributors?

All MC9S08AC32CFGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC32CFGER meets industry standards.

7.What is the process for return or replacement of MC9S08AC32CFGER?

All MC9S08AC32CFGER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC32CFGER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08AC32CFGER part is unused and in its original packaging.

Return procedure for MC9S08AC32CFGER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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