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NXP Semiconductors MC9S08AC32CPUER
- Part No.:
- MC9S08AC32CPUER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08AC32CPUER.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,477
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Product details
Overview
MC9S08AC32CPUER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core operating at up to 20-MHz bus frequency. It integrates dual SCI modules supporting LIN 2.0, two SPI, one I²C, 16-channel 10-bit ADC, and six-channel TPM for motor control in automotive body electronics.
For engineers reviewing the MC9S08AC32CPUER datasheet, MC9S08AC32CPUER pinout, MC9S08AC32CPUER application, or MC9S08AC32CPUER equivalent, key selection criteria include its QFN-48 copper-wire package, background debug system with ICE support, COP watchdog with independent 1 kHz clock source, low-voltage detect with interrupt/reset, and hardware CRC module for memory integrity verification.
Technical Context
The MC9S08AC32CPUER implements the S08CPUV2 core with HC08 instruction set extension including BGND, enabling in-circuit debugging via BKGD/MS pin. Its internal clock generator (ICG) supports precision NVM-trimmed internal reference, crystal/resonator, or external clock inputs.
Peripherals are synchronized to the internal bus clock and include two SCI modules with LIN-compliant break generation/detection, a 16-bit CRC engine compliant with ITU-T (CCITT) polynomials, and a flexible TPM module configurable for edge-aligned or centered PWM across up to six channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction; enables single-step debugging and breakpoint control |
| Max Bus Frequency | 20 MHz - determines maximum peripheral timing resolution and interrupt latency |
| FLASH Memory | 32 KB - supports secure code storage with block protection and vector redirection |
| RAM Size | 2 KB - sufficient for real-time task stacks, buffers, and variable retention in Wait/Stop modes |
| ADC Resolution | 10-bit - provides 1024 quantization levels for sensor signal digitization in body control units |
| I²C Speed | Up to 100 kbps - meets standard-mode I²C timing for communication with EEPROMs and sensors |
| Package | 48-pin QFN (98ASA00466D) - copper-wire bonded, thermally enhanced exposed pad for automotive thermal management |
Pinout & Package
MC9S08AC32CPUER is housed in a 48-pin QFN package (case outline 98ASA00466D), featuring an exposed thermal pad and copper-wire interconnect for improved reliability in automotive temperature cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Supports 2.7–5.5 V operation; separate analog domain (VDDAD/VSSAD) minimizes noise coupling into ADC |
| XTAL / EXTAL | Crytal oscillator input/output | Enables precise 1–20 MHz clock source; internal load capacitors reduce BOM count |
| BKGD/MS | Background debug and mode select | Single-pin debug interface; enables BDM entry without dedicated JTAG pins |
| RESET | Active-low reset input | Internal pullup eliminates external resistor; accepts power-on reset and COP/LVD-induced resets |
| SCI0_TX / SCI0_RX | Serial communications interface channel 0 | Full-duplex UART with LIN 2.0 break detection/generation for vehicle network nodes |
| TPM1_CH0–CH5 | Timer/PWM output channels | Configurable as input capture, output compare, or edge/center-aligned PWM for fan control or LED dimming |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ICE Debug Module | Two comparators + nine trigger modes + eight-deep FIFO enable non-intrusive trace capture during runtime |
| Hardware CRC Engine | 16-bit shift register implementation compliant with ITU-T X.25/HDLC polynomials for fast FLASH integrity checks |
| LIN 2.0 SCI Support | Dual SCI modules with master break generation and slave break detection meet SAE J2602 physical layer requirements |
| Low-Voltage Detect (LVD) | Programmable trip points (2.5 V, 2.7 V, 2.9 V, 3.1 V) with selectable reset or interrupt response for brown-out recovery |
| Stop2/Stop3 Power Modes | Sub-1 µA current draw with RTC wake-up and selected peripherals active - extends battery life in always-on modules |
Applications
| Body Control Module (BCM) | Smart Junction Box |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in 12 V automotive platforms. IC Role / Device Role / Timing Role: Main MCU executing LIN-slave firmware, managing GPIO states, and processing ADC readings from ambient light and temperature sensors. Use Value: Integrated LIN-capable SCI eliminates external transceiver for sub-node communication; 32 KB FLASH accommodates OTA update partitions. | Use Scenario: Power distribution and monitoring unit routing switched 12 V supplies to multiple vehicle subsystems. IC Role / Device Role / Timing Role: System supervisor monitoring fuse status via ADC, controlling MOSFET drivers via TPM PWM, and reporting faults over LIN. Use Value: Hardware CRC ensures bootloader integrity during field updates; LVD interrupt enables graceful shutdown before undervoltage lockout. |
| Seat Position Controller | Roof Module (Sunroof/Blind Control) |
Use Scenario: Motorized seat adjustment with position feedback, memory presets, and collision detection. IC Role / Device Role / Timing Role: Real-time motion controller using TPM input capture for quadrature encoder decoding and PWM for bidirectional DC motor drive. Use Value: 20 MHz bus frequency enables ≤50 µs timer resolution for precise speed control; 16-channel ADC reads potentiometers and current-sense shunts. | Use Scenario: Integrated sunroof and roller blind actuation with obstacle detection and soft-stop behavior. IC Role / Device Role / Timing Role: Safety-critical motion manager using KBI for emergency stop inputs and TPM edge-aligned PWM for smooth motor ramping. Use Value: Internal pullups on IRQ and BKGD pins reduce external components; Stop3 mode maintains RTC and KBI wake capability at <1 µA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08AC32F1MLC | Same HCS08 core, identical 32 KB FLASH/RAM, but in 48-pin LQFP (98ASB00120D); no exposed thermal pad | LQFP preferred for manual assembly or prototyping; lower thermal performance than QFN in sealed enclosures | Select MC9S08AC32CPUER for production automotive modules requiring thermal efficiency; choose S9S08AC32F1MLC for lab validation or low-volume builds. |
| MC9S08DZ32CPUE | Enhanced derivative with CAN 2.0B controller, 40 KB FLASH, and higher temp grade (−40°C to 125°C) | Required where CAN bus integration is mandatory (e.g., gateway functions); not drop-in compatible due to pinout and peripheral differences | Choose MC9S08AC32CPUER when LIN-only communication suffices and cost-sensitive BOM targets are critical; upgrade to MC9S08DZ32CPUE only if CAN is required. |
Compared with S9S08AC32F1MLC and MC9S08DZ32CPUE, the MC9S08AC32CPUER offers optimal thermal performance in QFN-48 for space-constrained automotive modules, retains full HCS08 software compatibility, and delivers LIN-focused peripheral integration without CAN overhead-making it ideal for cost-sensitive, thermally demanding body electronics.
Availability
MC9S08AC32CPUER is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, seat position controllers, and roof modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08AC32CPUER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in microcontrollers, secure connectivity, and power management solutions.
The MC9S08AC32CPUER belongs to the legacy HCS08 family designed specifically for cost-optimized, functionally safe automotive body electronics - emphasizing LIN communication, robust debug capability, and thermal resilience in compact packages.
FAQ
What is the operating voltage range for the MC9S08AC32CPUER?
The MC9S08AC32CPUER operates across a supply voltage range of 2.7 V to 5.5 V, supporting both 3.3 V and 5 V automotive subsystems. Its internal voltage regulator and LVD circuitry ensure reliable operation during battery transients, and the separate analog power domain (VDDAD/VSSAD) isolates ADC performance from digital noise.
Does the MC9S08AC32CPUER support LIN 2.0 communication natively?
Yes, the MC9S08AC32CPUER supports LIN 2.0 natively through its dual SCI modules, which include hardware-assisted master break generation and slave break detection per SAE J2602. This eliminates the need for external LIN transceivers in slave-node applications such as door modules or seat controllers.
What debug interface does the MC9S08AC32CPUER use?
The MC9S08AC32CPUER uses a single-wire Background Debug Mode (BDM) interface via the BKGD/MS pin. It includes an on-chip in-circuit emulator (ICE) with two comparators, nine trigger modes, and an eight-deep FIFO - enabling non-intrusive program flow tracing without requiring JTAG headers or additional pins.
Is the MC9S08AC32CPUER pin-compatible with other members of the AC-series?
No - the MC9S08AC32CPUER in 48-pin QFN (98ASA00466D) is not pin-compatible with AC-series variants in LQFP or QFP packages. Pin assignments differ across packages even for identical part numbers with different suffixes; always verify against the specific mechanical drawing for MC9S08AC32CPUER.
What is the thermal pad configuration for the MC9S08AC32CPUER package?
MC9S08AC32CPUER uses a copper-wire-bonded 48-pin QFN package (98ASA00466D) with an exposed thermal pad. The pad must be soldered to a PCB thermal plane for effective heat dissipation - especially critical in automotive under-hood or dashboard modules operating at extended temperatures up to 105°C.
MC9S08AC32CPUER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC32CPUER FAQ
1.How can I place an order for MC9S08AC32CPUER through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC32CPUER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC32CPUER reliable?
The price and inventory of MC9S08AC32CPUER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC32CPUER is usually 5 days.
3.What payment methods are accepted for MC9S08AC32CPUER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC32CPUER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC32CPUER?
MC9S08AC32CPUER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC32CPUER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC32CPUER?
For technical support, including MC9S08AC32CPUER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC32CPUER requirements.
6.How does Aetrix verify that MC9S08AC32CPUER is sourced from the original manufacturer or authorized distributors?
All MC9S08AC32CPUER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC32CPUER meets industry standards.
7.What is the process for return or replacement of MC9S08AC32CPUER?
All MC9S08AC32CPUER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC32CPUER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC32CPUER part is unused and in its original packaging.
Return procedure for MC9S08AC32CPUER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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