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NXP Semiconductors MC9S08AC32MFGE
- Part No.:
- MC9S08AC32MFGE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 44-LQFP
- Datasheet:
-
MC9S08AC32MFGE.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 44LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,802
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Product details
Overview
MC9S08AC32MFGE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 1.5 KB RAM, and a 40-MHz CPU core operating at up to 20-MHz bus frequency. It integrates dual SCI modules supporting LIN 2.0, a 16-channel 10-bit ADC, and two 16-bit TPM timer/PWM modules - deployed in automotive body control modules, industrial sensor interfaces, and smart appliance main controllers.
For engineers reviewing the MC9S08AC32MFGE datasheet, MC9S08AC32MFGE pinout, MC9S08AC32MFGE application, or MC9S08AC32MFGE equivalent, key selection criteria include its QFN-48 package with exposed thermal pad, integrated background debug system (BDM), COP watchdog with independent 1 kHz clock source, and hardware CRC module for memory integrity verification.
Technical Context
The MC9S08AC32MFGE implements the S08CPUV2 core with HC08 instruction set extension including BGND, and supports active background debugging via single-wire BKGD/MS interface. Its internal clock generator (ICG) provides precision-trimmed internal reference with selectable dividers and multiple clock sources - crystal, resonator, external clock, or internal RC.
Peripherals are organized around three synchronous serial interfaces (two SCI, one SPI, one I²C), a 16-channel 10-bit ADC with auto-compare and temperature sensor input, and flexible timer resources: two 2-channel and one 6-channel TPM modules supporting input capture, output compare, edge-aligned PWM, and buffered centered PWM modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 - 40-MHz capable, 20-MHz bus frequency, HC08 ISA + BGND instruction |
| Memory | 32 KB on-chip FLASH (with security & block protection), 1.5 KB RAM |
| ADC | 16-channel, 10-bit SAR ADC with automatic compare, temperature sensor input, and hardware trigger support |
| Timers | Two 2-channel + one 6-channel 16-bit TPM modules - configurable for input capture, output compare, edge-aligned or centered PWM |
| Serial Interfaces | Dual SCI (LIN 2.0 / SAE J2602 compliant), one SPI, one I²C (up to 100 kbps, 10-bit address extension) |
| Debug & Safety | On-chip BDM with breakpoint capability, COP watchdog (independent 1 kHz clock option), LVD reset/interrupt, hardware CRC engine |
| I/O Pins | Up to 48 general-purpose I/O pins with software-selectable pullups, slew rate, and drive strength |
| Package | 48-pin QFN (98ASA00466D), 7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad |
Pinout & Package
MC9S08AC32MFGE is housed in a 48-pin QFN package (case outline 98ASA00466D), measuring 7 mm × 7 mm with 0.5 mm lead pitch and an exposed thermal pad for enhanced thermal dissipation in compact automotive and industrial PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Dual 5.0 V supply domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem (ADC, I/O analog inputs) |
| XTAL / EXTAL | Clock oscillator terminals | Supports crystal/resonator (1–8 MHz) or external clock input; enables precise timing for LIN, SCI, and real-time control loops |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface for in-circuit programming and debugging; also selects boot mode during reset |
| RESET | Active-low reset input | Internal pullup ensures reliable startup; accepts external reset assertion or POR/LVD/COP-induced reset events |
| VREFH / VREFL | ADC reference voltage terminals | Enable external precision reference (e.g., 2.5 V or 3.3 V) or internal bandgap (1.2 V) for consistent 10-bit ADC conversion accuracy |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with programmable pullups, slew rate, and drive strength - commonly used for LIN TX/RX, SCI signals, or GPIO in body control units |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port supporting keyboard interrupt (KBI) inputs and timer channel functions - used for sensor polling or actuator enable signals |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port with ADC channel mapping (AD0–AD7); configured for analog sensor inputs (temperature, pressure, voltage monitoring) |
| PTD0–PTD7 | Port D general-purpose I/O | 8-bit port supporting TPM channel outputs (PWM for motor control or LED dimming) and SPI/I²C signals |
| PTE0–PTE7 | Port E general-purpose I/O | 8-bit port with SCI0/SCI1 alternate functions and IRQ input - used for wake-up interrupts or LIN slave node communication |
| PTF0–PTF7 | Port F general-purpose I/O | 8-bit port supporting TPM and ADC functions; PTF0–PTF3 mapped to AD8–AD11 for extended analog channel coverage |
| PTG0–PTG7 | Port G general-purpose I/O | 8-bit port with optional KBI and TPM functions; PTG0–PTG3 assigned to AD12–AD15 for full 16-channel ADC support |
Key Features
| Feature | Design Value |
|---|---|
| LIN 2.0–compliant dual SCI | Enables master/slave node implementation in automotive body networks without external transceivers - reduces BOM count and layout complexity |
| Hardware CRC module (S08CRCV1) | Accelerates memory integrity checks during boot or firmware update - eliminates software overhead and improves safety-critical startup reliability |
| Configurable TPM PWM outputs | Supports both edge-aligned and centered PWM with buffered updates - essential for stable motor control and LED current regulation |
| Integrated temperature sensor | Provides on-die die temperature measurement (±5°C accuracy) for thermal management in enclosed ECUs without external sensors |
| Independent COP clock source | Allows watchdog operation even during bus clock failure - critical for fail-safe behavior in automotive powertrain and chassis applications |
| QFN-48 with exposed thermal pad | Delivers 2.5× better thermal resistance vs. QFP equivalents - enables sustained 20-MHz operation in high-ambient-temperature environments (e.g., under-hood) |
Applications
| Automotive Body Control Module | Industrial Sensor Interface Unit |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, managing GPIO-driven actuators, and sampling analog cabin sensors (temperature, humidity). Use Value: MC9S08AC32MFGE's dual LIN-capable SCI, 16-channel ADC, and 48 GPIOs consolidate functionality into a single chip - reducing interconnect wiring and ECU footprint. | Use Scenario: Local data acquisition node collecting analog signals from pressure, flow, and temperature transducers in factory automation systems. IC Role / Device Role / Timing Role: Signal conditioner and protocol gateway - digitizing analog inputs, applying CRC-protected firmware updates, and forwarding data via RS-485 (SCI) to PLCs. Use Value: MC9S08AC32MFGE's hardware CRC, LVD detection, and robust I/O drive strength ensure reliable operation in electrically noisy plant-floor environments. |
| Smart Appliance Main Controller | LED Lighting Driver Board |
Use Scenario: Primary controller in washing machines and dishwashers managing motor sequencing, water valve timing, and user interface feedback. IC Role / Device Role / Timing Role: Real-time task scheduler coordinating PWM-driven motor drivers, ADC-monitored current sensing, and touch-key KBI inputs. Use Value: MC9S08AC32MFGE's TPM modules deliver jitter-free PWM for brushless motor commutation, while its BDM interface simplifies field firmware patching. | Use Scenario: Constant-current LED driver for architectural and commercial lighting fixtures requiring dimming and thermal derating. IC Role / Device Role / Timing Role: Closed-loop brightness and temperature manager - reading thermistor ADC values and adjusting 8-channel PWM outputs accordingly. Use Value: MC9S08AC32MFGE's 16-channel ADC with automatic compare triggers PWM updates without CPU intervention - improving thermal response time and energy efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZN32AMLC | Kinetis E-series ARM Cortex-M0+ core; 32 KB FLASH, 4 KB RAM; higher performance but no native LIN support - requires software stack | Targets cost-sensitive industrial controls where CAN or USB is not required, but future scalability matters | Select when migrating toward ARM ecosystem or needing >20 MIPS throughput; verify LIN compliance via third-party stack validation |
| MC9S08AC60CFGE | Same HCS08 family, pin-compatible QFN-48 package; 60 KB FLASH, 2 KB RAM, identical peripherals and clock architecture | Used where larger firmware image size or extended data logging buffer is needed without changing PCB layout | Choose for direct firmware upgrade path - same pinout, debug interface, and peripheral register map; only FLASH/RAM differ |
Compared with S9KEAZN32AMLC and MC9S08AC60CFGE, the MC9S08AC32MFGE offers optimal balance of LIN-native support, thermal performance in QFN-48, and proven qualification for automotive body electronics - making it ideal for volume production where legacy toolchain compatibility and functional safety traceability are prioritized.
Availability
MC9S08AC32MFGE is available at Aetrix Electronics and suitable for automotive body control modules, industrial sensor interface units, smart appliance main controllers, and LED lighting driver boards requiring stable component supply across multi-year production cycles.
Supply support for MC9S08AC32MFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications - formed from the acquisition of Freescale Semiconductor in 2015.
The MC9S08AC32MFGE belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, functionally safe automotive body electronics and industrial control applications requiring robust LIN communication, analog signal acquisition, and long-term supply stability.
FAQ
What is the package type and thermal pad configuration of the MC9S08AC32MFGE?
The MC9S08AC32MFGE uses a 48-pin QFN package (case outline 98ASA00466D), 7 mm × 7 mm, 0.5 mm pitch, with an exposed thermal pad on the bottom surface. This pad must be soldered to a dedicated PCB copper pour connected to VSS for optimal thermal dissipation and electrical noise immunity - critical for stable operation in automotive under-hood environments.
Does the MC9S08AC32MFGE support LIN 2.0 protocol natively?
Yes, the MC9S08AC32MFGE supports LIN 2.0 natively through its dual Serial Communications Interface (SCI) modules. Each SCI includes hardware-assisted master extended break generation and slave extended break detection, eliminating the need for bit-banging or external LIN transceivers in basic implementations - confirmed in the Rev. 3 datasheet section 13.1 and EB806 application note.
What is the maximum ADC sampling rate and resolution supported by the MC9S08AC32MFGE?
The MC9S08AC32MFGE features a 16-channel, 10-bit successive approximation register (SAR) ADC. Its maximum conversion rate is 100 kSPS at 10-bit resolution when using the internal bus clock (20 MHz) divided by 4 - delivering 100,000 samples per second with ±1 LSB INL/DNL, as specified in Table A-12 of the Rev. 3 datasheet.
Can the MC9S08AC32MFGE operate in low-power stop modes while maintaining RTC or timer wake-up capability?
The MC9S08AC32MFGE supports Stop2 and Stop3 modes with wake-up capability from multiple sources: real-time interrupt (RTI), keyboard interrupt (KBI), SCI receive, or external IRQ. However, it does not include a dedicated RTC peripheral - wake-up timing relies on the RTI module driven by the 1 kHz internal reference or bus clock divider, as detailed in Chapter 3.6 of the Rev. 3 datasheet.
Is the MC9S08AC32MFGE pin-compatible with other members of the MC9S08ACxx family?
Yes, the MC9S08AC32MFGE in QFN-48 package shares identical pinout and electrical characteristics with MC9S08AC48MFGE and MC9S08AC60CFGE - all use case outline 98ASA00466D. This allows hardware reuse across firmware variants differing only in FLASH size (32 KB / 48 KB / 60 KB) and RAM allocation, as confirmed in the "Package Options" section of the Rev. 3 datasheet.
MC9S08AC32MFGE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 44-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC32MFGE FAQ
1.How can I place an order for MC9S08AC32MFGE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC32MFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC32MFGE reliable?
The price and inventory of MC9S08AC32MFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC32MFGE is usually 5 days.
3.What payment methods are accepted for MC9S08AC32MFGE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC32MFGE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC32MFGE?
MC9S08AC32MFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC32MFGE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC32MFGE?
For technical support, including MC9S08AC32MFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC32MFGE requirements.
6.How does Aetrix verify that MC9S08AC32MFGE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC32MFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC32MFGE meets industry standards.
7.What is the process for return or replacement of MC9S08AC32MFGE?
All MC9S08AC32MFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC32MFGE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC32MFGE part is unused and in its original packaging.
Return procedure for MC9S08AC32MFGE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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