NXP Semiconductors MC9S08AC48CFDE
- Part No.:
- MC9S08AC48CFDE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC9S08AC48CFDE.pdf
- Description:
- IC MCU 8BIT 48KB FLASH 48QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,256
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08AC48CFDE from Freescale Semiconductor is an 8-bit HCS08 microcontroller in a 48-pin QFN package, featuring a 40-MHz CPU core, 48 KB on-chip FLASH, 1.5 KB RAM, 10-bit ADC with 16 channels, and dual SCI modules supporting LIN 2.0. It targets automotive body control modules requiring robust debug support and low-voltage operation.
For engineers reviewing the MC9S08AC48CFDE datasheet, MC9S08AC48CFDE pinout, MC9S08AC48CFDE application, or MC9S08AC48CFDE equivalent, key selection criteria include its 48-pin QFN copper-wire package (98ASA00466D), integrated IIC/SPI/TPM peripherals, background debugging system with ICE module, and COP watchdog with independent 1 kHz clock source.
Technical Context
The MC9S08AC48CFDE implements the S08CPUV2 core with HC08 instruction set extension (BGND), operating at up to 40 MHz CPU frequency and 20 MHz bus frequency. Its internal clock generator (ICG) supports precision NVM-trimmed internal reference with crystal/resonator/external clock options.
It integrates two SCI modules compliant with LIN 2.0 and SAE J2602, one IIC module (up to 100 kbps), one SPI module, and three TPM timer modules - two 2-channel and one 6-channel - supporting input capture, output compare, edge-aligned and centered PWM. The CRC module provides hardware-accelerated 16-bit checksum generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction; enables in-circuit debugging without halting real-time operation. |
| Max CPU Frequency | 40 MHz; determines maximum instruction throughput and real-time response capability. |
| FLASH Memory | 48 KB; sufficient for complex automotive firmware with bootloader, diagnostics, and application code. |
| RAM Size | 1.5 KB; supports multiple interrupt stacks, buffer storage, and runtime variable allocation. |
| ADC Resolution | 10-bit; delivers 1024 quantization levels for accurate sensor signal digitization (e.g., temperature, potentiometer). |
| I/O Pins | Up to 54 general-purpose I/O; includes software-selectable pullups, slew rate, and drive strength for flexible board-level interfacing. |
| Package | 48-pin QFN (98ASA00466D); copper-wire bonded, thermally enhanced exposed pad for automotive thermal management. |
Pinout & Package
MC9S08AC48CFDE is housed in a 48-pin QFN package (case outline 98ASA00466D), measuring 7 mm × 7 mm × 0.85 mm, with an exposed thermal pad for improved heat dissipation in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem isolation. |
| XTAL / EXTAL | Clock input/output | Supports external crystal (1–8 MHz) or resonator; enables precise timing for LIN communication and ADC sampling. |
| BKGD/MS | Background debug / mode select | Single-pin BDM interface for programming and real-time debugging; eliminates need for dedicated JTAG header. |
| RESET | Active-low reset input | Internal pullup reduces external component count; compatible with external reset supervisors or manual reset buttons. |
| VREFH / VREFL | ADC reference voltage | Allows ratiometric measurement using external reference or internal bandgap; improves accuracy under varying supply conditions. |
| AD0–AD15 | Analog inputs | 16-channel multiplexed inputs; configurable for single-ended or differential acquisition with hardware trigger support. |
| SCI0_TX / SCI0_RX | LIN master/slave UART | Direct connection to LIN transceiver; supports automatic break generation/detection per LIN 2.0 specification. |
| IIC_SDA / IIC_SCL | I²C bidirectional data/clock | Open-drain outputs with internal pullup enable; interfaces with EEPROM, sensors, or display controllers without external resistors. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ICE Debug Module | Two comparators + nine trigger modes + eight-deep FIFO enable non-intrusive trace capture during LIN frame analysis or fault injection testing. |
| Hardware CRC Generator | 16-bit shift register implementation accelerates memory integrity checks during boot-up or firmware update verification. |
| Configurable Stop Modes | Stop2 and Stop3 modes retain RAM content while disabling clocks; essential for low-power wake-on-LIN-break scenarios. |
| Integrated COP Watchdog | Independent 1 kHz internal clock source ensures reliable timeout even if main oscillator fails - critical for ASIL-B compliance. |
| Peripheral Clock Gating | Per-module clock enable/disable via SOPT register reduces dynamic power consumption when peripherals are idle. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized control of lighting, window lifts, mirror adjustment, and door lock actuation in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing LIN slave nodes, managing GPIO-driven relays/motors, and coordinating with gateway via SCI. Use Value: 48 KB FLASH accommodates multi-variant BCM firmware; 16-channel ADC monitors potentiometer positions and battery voltage. | Use Scenario: Local control unit inside vehicle door handling window motor, anti-pinch detection, and interior light dimming. IC Role / Device Role / Timing Role: LIN slave node with real-time PWM control of DC motor and ADC-based current sensing for stall detection. Use Value: Edge-aligned and centered PWM modes enable precise motor speed/torque regulation; hardware-triggered ADC captures current spikes within 1 µs. |
| Roof Module (Sunroof/Convertibles) | Seat Position Memory System |
Use Scenario: Actuation and position feedback control for sunroof glass/motorized convertible top mechanisms. IC Role / Device Role / Timing Role: LIN slave with dual TPM modules generating synchronized PWM for dual-motor coordination and quadrature decoding for position tracking. Use Value: Six-channel TPM supports encoder input capture and complementary PWM outputs for H-bridge drivers without external logic. | Use Scenario: Storing and recalling driver seat position via non-volatile memory, triggered by key fob or door handle sensor. IC Role / Device Role / Timing Role: Standalone controller reading potentiometers, storing settings in FLASH, and driving stepper motors via SPI-connected driver ICs. Use Value: On-chip FLASH security options prevent unauthorized access to stored seat profiles; KBI module detects mechanical switch inputs with debouncing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC60CFDE | 60 KB FLASH, 2 KB RAM, identical peripheral set and pinout; same 48-pin QFN (98ASA00466D) package. | Supports larger firmware images with extended diagnostics and OTA update capability. | Select when future firmware growth or dual-bank FLASH updates are required. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 48-pin LQFP; no pin compatibility. | Higher performance for CAN/LIN hybrid gateways or advanced motor control algorithms. | Select when migrating to ARM architecture for scalability beyond HCS08 limitations. |
Compared with MC9S08AC60CFDE, the MC9S08AC48CFDE offers reduced FLASH/RAM but identical peripheral functionality and footprint - ideal for cost-optimized BCM variants. Versus S9KEAZ128AMLH, it provides proven HCS08 toolchain continuity and lower power in wait/stop modes, though without CAN or floating-point capability.
Availability
MC9S08AC48CFDE is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor networks, and industrial control panels requiring stable component supply across extended temperature ranges (–40°C to +105°C).
Supply support for MC9S08AC48CFDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors and analog devices for automotive, industrial, and networking markets.
The MC9S08AC48CFDE belongs to the HCS08 AC-series microcontrollers, engineered specifically for cost-sensitive, high-reliability automotive body electronics where LIN communication, low-power operation, and on-chip debug are mandatory.
FAQ
What is the package type and thermal pad configuration of the MC9S08AC48CFDE?
The MC9S08AC48CFDE uses a 48-pin QFN package (case outline 98ASA00466D) with an exposed thermal pad. This copper-wire bonded package measures 7 mm × 7 mm × 0.85 mm and requires soldering the thermal pad to a PCB copper pour for optimal thermal performance in automotive under-hood applications. The pad is internally connected to VSS.
Does the MC9S08AC48CFDE support LIN 2.0 communication natively?
Yes, the MC9S08AC48CFDE supports LIN 2.0 natively through its two SCI modules. Each SCI includes master extended break generation and slave extended break detection circuitry, meeting SAE J2602 requirements. No external LIN transceiver configuration logic is needed - only a standard LIN physical layer transceiver (e.g., TJA1020) is required.
What debug capabilities does the MC9S08AC48CFDE provide during in-circuit development?
The MC9S08AC48CFDE integrates a full background debug system (BDM) with on-chip in-circuit emulator (ICE). It supports single breakpoint setting, two additional breakpoints in the ICE module, eight-deep FIFO for change-of-flow tracing, and tag/force breakpoint modes - all accessible via the BKGD/MS pin without requiring external debug probes beyond a standard BDM interface cable.
How does the internal clock generator (ICG) of the MC9S08AC48CFDE ensure timing accuracy without an external crystal?
The MC9S08AC48CFDE's ICG module uses factory-trimmed NVM to calibrate an internal RC oscillator, achieving ±2% accuracy over –40°C to +105°C. This allows crystal-free operation for non-critical timing functions like UART baud generation or PWM base periods, reducing BOM cost while retaining option to use XTAL/EXTAL for LIN synchronization when higher precision is required.
Can the MC9S08AC48CFDE operate in low-voltage conditions typical of automotive battery droop?
Yes, the MC9S08AC48CFDE features a programmable low-voltage detect (LVD) system with reset or interrupt capability down to 2.7 V. It also supports operation at VDD = 2.7–5.5 V, enabling reliable function during cold-crank events (e.g., 6 V battery sag) and compatibility with 12 V and 24 V vehicle electrical systems without external regulators.
MC9S08AC48CFDE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 48KB (48K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC48CFDE FAQ
1.How can I place an order for MC9S08AC48CFDE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC48CFDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC48CFDE reliable?
The price and inventory of MC9S08AC48CFDE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC48CFDE is usually 5 days.
3.What payment methods are accepted for MC9S08AC48CFDE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC48CFDE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC48CFDE?
MC9S08AC48CFDE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC48CFDE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC48CFDE?
For technical support, including MC9S08AC48CFDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC48CFDE requirements.
6.How does Aetrix verify that MC9S08AC48CFDE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC48CFDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC48CFDE meets industry standards.
7.What is the process for return or replacement of MC9S08AC48CFDE?
All MC9S08AC48CFDE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC48CFDE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC48CFDE part is unused and in its original packaging.
Return procedure for MC9S08AC48CFDE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08AC48CFDE Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

