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NXP Semiconductors MC9S08AC48CFDE

Part No.:
MC9S08AC48CFDE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixMC9S08AC48CFDE.pdf
Description:
IC MCU 8BIT 48KB FLASH 48QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,256

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Product details

Overview

MC9S08AC48CFDE from Freescale Semiconductor is an 8-bit HCS08 microcontroller in a 48-pin QFN package, featuring a 40-MHz CPU core, 48 KB on-chip FLASH, 1.5 KB RAM, 10-bit ADC with 16 channels, and dual SCI modules supporting LIN 2.0. It targets automotive body control modules requiring robust debug support and low-voltage operation.

For engineers reviewing the MC9S08AC48CFDE datasheet, MC9S08AC48CFDE pinout, MC9S08AC48CFDE application, or MC9S08AC48CFDE equivalent, key selection criteria include its 48-pin QFN copper-wire package (98ASA00466D), integrated IIC/SPI/TPM peripherals, background debugging system with ICE module, and COP watchdog with independent 1 kHz clock source.

Technical Context

The MC9S08AC48CFDE implements the S08CPUV2 core with HC08 instruction set extension (BGND), operating at up to 40 MHz CPU frequency and 20 MHz bus frequency. Its internal clock generator (ICG) supports precision NVM-trimmed internal reference with crystal/resonator/external clock options.

It integrates two SCI modules compliant with LIN 2.0 and SAE J2602, one IIC module (up to 100 kbps), one SPI module, and three TPM timer modules - two 2-channel and one 6-channel - supporting input capture, output compare, edge-aligned and centered PWM. The CRC module provides hardware-accelerated 16-bit checksum generation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV2 with BGND instruction; enables in-circuit debugging without halting real-time operation.
Max CPU Frequency40 MHz; determines maximum instruction throughput and real-time response capability.
FLASH Memory48 KB; sufficient for complex automotive firmware with bootloader, diagnostics, and application code.
RAM Size1.5 KB; supports multiple interrupt stacks, buffer storage, and runtime variable allocation.
ADC Resolution10-bit; delivers 1024 quantization levels for accurate sensor signal digitization (e.g., temperature, potentiometer).
I/O PinsUp to 54 general-purpose I/O; includes software-selectable pullups, slew rate, and drive strength for flexible board-level interfacing.
Package48-pin QFN (98ASA00466D); copper-wire bonded, thermally enhanced exposed pad for automotive thermal management.

Pinout & Package

MC9S08AC48CFDE is housed in a 48-pin QFN package (case outline 98ASA00466D), measuring 7 mm × 7 mm × 0.85 mm, with an exposed thermal pad for improved heat dissipation in automotive environments.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem isolation.
XTAL / EXTALClock input/outputSupports external crystal (1–8 MHz) or resonator; enables precise timing for LIN communication and ADC sampling.
BKGD/MSBackground debug / mode selectSingle-pin BDM interface for programming and real-time debugging; eliminates need for dedicated JTAG header.
RESETActive-low reset inputInternal pullup reduces external component count; compatible with external reset supervisors or manual reset buttons.
VREFH / VREFLADC reference voltageAllows ratiometric measurement using external reference or internal bandgap; improves accuracy under varying supply conditions.
AD0–AD15Analog inputs16-channel multiplexed inputs; configurable for single-ended or differential acquisition with hardware trigger support.
SCI0_TX / SCI0_RXLIN master/slave UARTDirect connection to LIN transceiver; supports automatic break generation/detection per LIN 2.0 specification.
IIC_SDA / IIC_SCLI²C bidirectional data/clockOpen-drain outputs with internal pullup enable; interfaces with EEPROM, sensors, or display controllers without external resistors.

Key Features

FeatureDesign Value
On-chip ICE Debug ModuleTwo comparators + nine trigger modes + eight-deep FIFO enable non-intrusive trace capture during LIN frame analysis or fault injection testing.
Hardware CRC Generator16-bit shift register implementation accelerates memory integrity checks during boot-up or firmware update verification.
Configurable Stop ModesStop2 and Stop3 modes retain RAM content while disabling clocks; essential for low-power wake-on-LIN-break scenarios.
Integrated COP WatchdogIndependent 1 kHz internal clock source ensures reliable timeout even if main oscillator fails - critical for ASIL-B compliance.
Peripheral Clock GatingPer-module clock enable/disable via SOPT register reduces dynamic power consumption when peripherals are idle.

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized control of lighting, window lifts, mirror adjustment, and door lock actuation in passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing LIN slave nodes, managing GPIO-driven relays/motors, and coordinating with gateway via SCI.

Use Value: 48 KB FLASH accommodates multi-variant BCM firmware; 16-channel ADC monitors potentiometer positions and battery voltage.

Use Scenario: Local control unit inside vehicle door handling window motor, anti-pinch detection, and interior light dimming.

IC Role / Device Role / Timing Role: LIN slave node with real-time PWM control of DC motor and ADC-based current sensing for stall detection.

Use Value: Edge-aligned and centered PWM modes enable precise motor speed/torque regulation; hardware-triggered ADC captures current spikes within 1 µs.

Roof Module (Sunroof/Convertibles)Seat Position Memory System

Use Scenario: Actuation and position feedback control for sunroof glass/motorized convertible top mechanisms.

IC Role / Device Role / Timing Role: LIN slave with dual TPM modules generating synchronized PWM for dual-motor coordination and quadrature decoding for position tracking.

Use Value: Six-channel TPM supports encoder input capture and complementary PWM outputs for H-bridge drivers without external logic.

Use Scenario: Storing and recalling driver seat position via non-volatile memory, triggered by key fob or door handle sensor.

IC Role / Device Role / Timing Role: Standalone controller reading potentiometers, storing settings in FLASH, and driving stepper motors via SPI-connected driver ICs.

Use Value: On-chip FLASH security options prevent unauthorized access to stored seat profiles; KBI module detects mechanical switch inputs with debouncing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08AC60CFDE60 KB FLASH, 2 KB RAM, identical peripheral set and pinout; same 48-pin QFN (98ASA00466D) package.Supports larger firmware images with extended diagnostics and OTA update capability.Select when future firmware growth or dual-bank FLASH updates are required.
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 48-pin LQFP; no pin compatibility.Higher performance for CAN/LIN hybrid gateways or advanced motor control algorithms.Select when migrating to ARM architecture for scalability beyond HCS08 limitations.

Compared with MC9S08AC60CFDE, the MC9S08AC48CFDE offers reduced FLASH/RAM but identical peripheral functionality and footprint - ideal for cost-optimized BCM variants. Versus S9KEAZ128AMLH, it provides proven HCS08 toolchain continuity and lower power in wait/stop modes, though without CAN or floating-point capability.

Availability

MC9S08AC48CFDE is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor networks, and industrial control panels requiring stable component supply across extended temperature ranges (–40°C to +105°C).

Supply support for MC9S08AC48CFDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors and analog devices for automotive, industrial, and networking markets.

The MC9S08AC48CFDE belongs to the HCS08 AC-series microcontrollers, engineered specifically for cost-sensitive, high-reliability automotive body electronics where LIN communication, low-power operation, and on-chip debug are mandatory.

FAQ

What is the package type and thermal pad configuration of the MC9S08AC48CFDE?

The MC9S08AC48CFDE uses a 48-pin QFN package (case outline 98ASA00466D) with an exposed thermal pad. This copper-wire bonded package measures 7 mm × 7 mm × 0.85 mm and requires soldering the thermal pad to a PCB copper pour for optimal thermal performance in automotive under-hood applications. The pad is internally connected to VSS.

Does the MC9S08AC48CFDE support LIN 2.0 communication natively?

Yes, the MC9S08AC48CFDE supports LIN 2.0 natively through its two SCI modules. Each SCI includes master extended break generation and slave extended break detection circuitry, meeting SAE J2602 requirements. No external LIN transceiver configuration logic is needed - only a standard LIN physical layer transceiver (e.g., TJA1020) is required.

What debug capabilities does the MC9S08AC48CFDE provide during in-circuit development?

The MC9S08AC48CFDE integrates a full background debug system (BDM) with on-chip in-circuit emulator (ICE). It supports single breakpoint setting, two additional breakpoints in the ICE module, eight-deep FIFO for change-of-flow tracing, and tag/force breakpoint modes - all accessible via the BKGD/MS pin without requiring external debug probes beyond a standard BDM interface cable.

How does the internal clock generator (ICG) of the MC9S08AC48CFDE ensure timing accuracy without an external crystal?

The MC9S08AC48CFDE's ICG module uses factory-trimmed NVM to calibrate an internal RC oscillator, achieving ±2% accuracy over –40°C to +105°C. This allows crystal-free operation for non-critical timing functions like UART baud generation or PWM base periods, reducing BOM cost while retaining option to use XTAL/EXTAL for LIN synchronization when higher precision is required.

Can the MC9S08AC48CFDE operate in low-voltage conditions typical of automotive battery droop?

Yes, the MC9S08AC48CFDE features a programmable low-voltage detect (LVD) system with reset or interrupt capability down to 2.7 V. It also supports operation at VDD = 2.7–5.5 V, enabling reliable function during cold-crank events (e.g., 6 V battery sag) and compatibility with 12 V and 24 V vehicle electrical systems without external regulators.

MC9S08AC48CFDE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-VFQFN Exposed Pad
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08AC48CFDE FAQ

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Please submit a Request for Quotation (RFQ) for MC9S08AC48CFDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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Once your MC9S08AC48CFDE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08AC48CFDE?

For technical support, including MC9S08AC48CFDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC48CFDE requirements.

6.How does Aetrix verify that MC9S08AC48CFDE is sourced from the original manufacturer or authorized distributors?

All MC9S08AC48CFDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC48CFDE meets industry standards.

7.What is the process for return or replacement of MC9S08AC48CFDE?

All MC9S08AC48CFDE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC48CFDE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08AC48CFDE part is unused and in its original packaging.

Return procedure for MC9S08AC48CFDE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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