NXP Semiconductors MC9S08AC48CFJE
- Part No.:
- MC9S08AC48CFJE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08AC48CFJE.pdf
- Description:
- IC MCU 8BIT 48KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08AC48CFJE from Freescale Semiconductor is an 8-bit HCS08 microcontroller in a 48-pin QFN package, featuring a 40-MHz CPU core, 48 KB on-chip FLASH, 1.5 KB RAM, 10-bit ADC with 16 channels, two SCI modules supporting LIN 2.0, and hardware CRC acceleration - deployed in automotive body control modules requiring deterministic real-time response and flash security.
For engineers reviewing the MC9S08AC48CFJE datasheet, MC9S08AC48CFJE pinout, MC9S08AC48CFJE application, or MC9S08AC48CFJE equivalent, key selection criteria include QFN-48 thermal performance, internal clock generator trimming for ±1.5% accuracy at 20 MHz bus frequency, COP watchdog independence from bus clock, and IIC module support for 100 kbps standard-mode operation with 10-bit address extension.
Technical Context
The MC9S08AC48CFJE implements the S08CPUV2 core with HC08 instruction set plus BGND, executing from on-chip FLASH with NVM-trimmed internal clock generator (ICG) enabling stable 20-MHz bus frequency without external crystal. Its memory protection includes FLASH block locking via FPROT register and optional security byte disabling background debug access.
Peripherals are integrated into a unified clock domain: TPM modules support edge-aligned and centered PWM with buffered outputs; SCI modules implement LIN 2.0-compliant break detection/generation; ADC uses programmable sample time and automatic compare against ADCCVH/ADCCVL registers to trigger interrupts without CPU polling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction; enables single-step debugging and non-intrusive breakpoint insertion during active execution. |
| Max Bus Frequency | 20 MHz - determines maximum peripheral timing resolution and interrupt latency; derived from 40-MHz core clock via /2 divider. |
| FLASH Memory | 48 KB - supports in-application programming (IAP), vector redirection, and configurable block protection for firmware updates and safety-critical code isolation. |
| RAM Size | 1.5 KB - sufficient for stack, global variables, and real-time buffers in automotive sensor fusion or lighting control tasks. |
| ADC Resolution | 10-bit - provides 1024 discrete levels for analog inputs such as potentiometer position or temperature sensor voltage, with automatic compare function reducing CPU load. |
| I²C Speed | 100 kbps standard mode - compatible with common automotive sensors (e.g., ambient light, humidity) and allows 10-bit addressing for up to 1024 slave devices on shared bus. |
| Package | 48-pin QFN (98ASA00466D) - copper-wire bonded, exposed pad for thermal dissipation; footprint matches legacy gold-wire 98ARL10606D but requires updated reflow profile. |
Pinout & Package
MC9S08AC48CFJE is housed in a 7 mm × 7 mm, 0.5 mm pitch, 48-pin QFN package (case outline 98ASA00466D) with exposed thermal pad. The package supports automated optical inspection and offers lower thermal resistance than equivalent QFP variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Dual 3.3 V domains: VDD powers digital logic; VSS provides reference return path - decoupling capacitors required within 5 mm of pins. |
| VDDAD, VSSAD | Analog power and ground | Isolated analog supply domain prevents digital noise coupling into ADC measurements; must be filtered separately from VDD. |
| XTAL, EXTAL | Clock oscillator terminals | Supports external crystal (1–8 MHz) or ceramic resonator; internal ICG can trim frequency to ±1.5% over temperature without external components. |
| RESET | Active-low reset input | Internal pullup ensures reliable startup; accepts external reset signal or power-on reset assertion; triggers full system initialization sequence. |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface for flash programming and real-time debugging; internal pullup eliminates need for external resistor in production systems. |
| VREFH, VREFL | ADC reference voltage terminals | Define full-scale range for analog-to-digital conversion; can be tied to VDDAD/VSSAD or driven by external precision references for improved accuracy. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with software-selectable pullups, slew rate, and drive strength; supports keyboard interrupt (KBI) and timer capture/compare functions. |
| SCI0_TX, SCI0_RX | Serial communications interface channel 0 | Asynchronous UART interface supporting LIN 2.0 master break generation and slave break detection; used for vehicle network diagnostics and actuator control. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip CRC module | Hardware-accelerated 16-bit CRC-ITU calculation reduces firmware validation time from milliseconds to microseconds - critical for boot-time integrity checks in ASIL-B systems. |
| Two SCI modules with LIN support | Enables dual-bus communication: one for diagnostic (OBD-II), one for distributed control (e.g., door module ↔ mirror module); eliminates need for external LIN transceivers in basic implementations. |
| FLASH security options | Configurable via FOPT register to disable background debug access and prevent unauthorized readout of firmware - meets ISO 15408 EAL3+ requirements for automotive ECUs. |
| Low-voltage detect (LVD) | Programmable trip point (2.5 V, 2.7 V, 2.9 V, 3.1 V) with interrupt or reset output - protects against brownout-induced state corruption during battery voltage sag in 12 V vehicle systems. |
| Wait + Stop2/Stop3 modes | Reduces current consumption to 1.2 µA in Stop3 mode while retaining RAM content and wake-up capability on IRQ or RTC event - extends battery life in always-on telematics nodes. |
Applications
| Body Control Module (BCM) | Smart Lighting Controller |
|---|---|
Use Scenario: Centralized management of door locks, window lifts, interior lighting, and mirror adjustment in entry-level passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time CAN/LIN gateway logic, ADC-based switch scanning, and PWM-driven LED dimming with synchronized fade transitions. Use Value: Integrated 16-channel ADC eliminates external multiplexer; hardware CRC ensures bootloader integrity; QFN-48 thermal performance sustains 85°C ambient operation without heatsink. | Use Scenario: Adaptive headlamp leveling and dynamic rear lighting with ambient light sensing and CAN message parsing. IC Role / Device Role / Timing Role: Sensor fusion node processing photodiode voltage (via ADC), interpreting CAN messages (via SCI), and generating precise PWM signals (via TPM) for LED current control. Use Value: Internal clock trimming maintains ±1.5% PWM frequency stability across temperature; 48 KB FLASH stores multiple lighting profiles and calibration data. |
| Seat Position Memory System | Climate Control Interface |
Use Scenario: Storing and recalling driver seat position using potentiometer feedback and motor control outputs. IC Role / Device Role / Timing Role: Analog acquisition unit sampling 4x potentiometers, detecting user button presses (KBI), and driving H-bridge gate drivers via GPIO with dead-time control. Use Value: 10-bit ADC resolution captures sub-millimeter seat travel; software-selectable drive strength ensures robust 20 mA sink capability for indicator LEDs. | Use Scenario: HVAC panel with rotary encoder input, temperature sensor reading, and display backlight control. IC Role / Device Role / Timing Role: Human-machine interface controller managing encoder quadrature decoding (TPM input capture), thermistor ADC conversion, and SPI-driven segment LCD. Use Value: Two SCI modules enable simultaneous connection to HVAC ECU (CAN-to-LIN bridge) and service tool; KBI supports low-power wake-on-press. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC60CFJE | 60 KB FLASH, 2 KB RAM, identical peripheral set and pinout - differs only in memory capacity and part marking. | Required when firmware image exceeds 48 KB or when future-proofing for feature expansion without PCB change. | Select MC9S08AC60CFJE if design requires >48 KB code space or anticipates field-upgradable features requiring additional FLASH overhead. |
| S9KEAZN64AMLH | Kinetis E-series ARM Cortex-M0+ core, 64 KB FLASH, 8 KB RAM, same 48-pin QFN package but different pin mapping and voltage range (2.7–5.5 V vs. 2.7–3.6 V). | Used where higher computational throughput, floating-point math, or RTOS support is needed beyond HCS08 capabilities. | Choose S9KEAZN64AMLH only when migrating to ARM architecture for scalability; not a drop-in replacement due to incompatible peripherals and register layout. |
Compared with MC9S08AC48CFJE, MC9S08AC60CFJE offers direct memory upgrade within identical thermal and electrical constraints, while S9KEAZN64AMLH introduces architectural divergence requiring full firmware rewrite and layout verification - making the former ideal for incremental enhancement and the latter suitable only for new-platform development.
Availability
MC9S08AC48CFJE is available at Aetrix Electronics and suitable for automotive body electronics, smart lighting systems, and seat control modules requiring stable component supply and long-term industrial lifecycle support.
Supply support for MC9S08AC48CFJE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) designed high-reliability microcontrollers for automotive, industrial, and consumer applications with emphasis on functional safety and long-term manufacturability.
The MC9S08ACxx series targets cost-sensitive automotive body electronics, delivering certified flash security, LIN protocol compliance, and extended temperature operation (–40°C to +125°C) in compact QFN packages.
FAQ
What is the maximum operating temperature specification for the MC9S08AC48CFJE?
The MC9S08AC48CFJE is rated for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 2 requirements for automotive under-hood applications. This rating is validated per the device's thermal characteristics in Appendix A of the MC9S08AC60 Series Data Sheet Rev. 3, and applies specifically to the CFJE suffix variant in the 48-pin QFN package.
Does the MC9S08AC48CFJE support in-circuit debugging without external hardware?
Yes, the MC9S08AC48CFJE integrates an on-chip background debug module (BDM) accessible via the BKGD/MS pin, enabling full flash programming, real-time variable inspection, and single-step execution without JTAG adapter or external debug probe - provided the host debugger supports Freescale's BDM protocol and the target board exposes the BKGD/MS line.
Can the MC9S08AC48CFJE generate LIN 2.0-compliant wakeup pulses?
Yes, the MC9S08AC48CFJE's SCI modules support LIN 2.0-compliant wakeup pulse generation through dedicated control bits in the SCIC2 register (WUCR bit). When configured, the SCI transmitter outputs a dominant pulse of programmable duration (150–300 µs) on the LIN bus, satisfying ISO 17987-4 physical layer requirements for slave node wakeup.
What is the minimum supply voltage required for reliable FLASH programming on the MC9S08AC48CFJE?
Reliable on-chip FLASH programming for the MC9S08AC48CFJE requires a minimum VDD of 2.7 V, as specified in Table A-12 (Electrical Characteristics) of the MC9S08AC60 Series Data Sheet Rev. 3. Programming below this threshold risks incomplete erase/write cycles and corrupted flash blocks, especially during page erase operations.
Is the MC9S08AC48CFJE pin-compatible with other members of the MC9S08ACxx family in the same package?
Yes, the MC9S08AC48CFJE shares identical pinout, electrical characteristics, and peripheral mapping with MC9S08AC60CFJE and MC9S08AC32CFJE in the 48-pin QFN package (98ASA00466D), enabling hardware reuse across memory variants - though firmware must be validated for FLASH/RAM size differences and security configuration compatibility.
MC9S08AC48CFJE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 22
- Program Memory Size:
- 48KB (48K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 6x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC48CFJE FAQ
1.How can I place an order for MC9S08AC48CFJE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC48CFJE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC48CFJE reliable?
The price and inventory of MC9S08AC48CFJE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC48CFJE is usually 5 days.
3.What payment methods are accepted for MC9S08AC48CFJE?
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MC9S08AC48CFJE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC48CFJE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC48CFJE?
For technical support, including MC9S08AC48CFJE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC48CFJE requirements.
6.How does Aetrix verify that MC9S08AC48CFJE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC48CFJE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC48CFJE meets industry standards.
7.What is the process for return or replacement of MC9S08AC48CFJE?
All MC9S08AC48CFJE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC48CFJE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC48CFJE part is unused and in its original packaging.
Return procedure for MC9S08AC48CFJE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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