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NXP Semiconductors MC9S08AC60CFDE
- Part No.:
- MC9S08AC60CFDE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC9S08AC60CFDE.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,300
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Product details
Overview
MC9S08AC60CFDE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 60 KB on-chip FLASH, 2 KB RAM, and integrated peripherals including dual SCI (LIN 2.0 compliant), SPI, I²C, 16-channel 10-bit ADC, and three 16-bit TPM timer modules. It targets automotive body electronics and industrial control systems requiring robust debug support and flash security.
For engineers reviewing the MC9S08AC60CFDE datasheet, MC9S08AC60CFDE pinout, MC9S08AC60CFDE application, or MC9S08AC60CFDE equivalent, key selection criteria include its 48-pin QFN package with exposed pad, COP watchdog with independent 1 kHz clock source, hardware CRC module, and background debugging system supporting up to three breakpoints.
Technical Context
The MC9S08AC60CFDE implements the S08CPUV2 core with HC08 instruction set extension (BGND), operating at up to 40 MHz CPU frequency and 20 MHz bus frequency. Its internal clock generator (ICG) supports precision NVM-trimmed internal reference with crystal/resonator/external clock options.
System-level protection includes low-voltage detect (LVD) with reset/interrupt, illegal opcode detection, and cyclic redundancy check (CRC) hardware accelerator for memory integrity verification. Power management supports Wait, Stop2, and Stop3 modes with configurable peripheral retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction and 40-MHz max operation |
| FLASH Memory | 60 KB on-chip with block protection, security options, and 512-byte erase sectors |
| RAM | 2 KB on-chip with retention in Stop2/Stop3 modes when configured |
| ADC | 16-channel, 10-bit SAR converter with automatic compare and temperature sensor input |
| Timers | Three 16-bit TPM modules: two 2-channel + one 6-channel, supporting input capture, output compare, and edge-aligned/buffered centered PWM |
| Communication | Dual SCI (LIN 2.0/Sae J2602 compliant), SPI, and I²C (100 kbps standard, 400 kbps with reduced loading) |
| Package | 48-pin QFN (98ASA00466D), copper-wire bonded, exposed thermal pad |
Pinout & Package
MC9S08AC60CFDE uses a 48-pin QFN package (case outline 98ASA00466D) with 0.5 mm pitch and thermally enhanced exposed pad. The package supports automated optical inspection and high-density PCB layouts typical in automotive ECUs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Dual 5.0 V supply domains: VDD/VSS for digital logic; VDDAD/VSSAD for analog subsystem |
| XTAL / EXTAL | Clock oscillator inputs | Supports external crystal/resonator up to 32 MHz or external clock source |
| RESET | Active-low reset input | Internal pullup enables single-button reset without external resistor; accepts asynchronous assertion |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface for in-circuit debugging; also selects boot mode during reset |
| VREFH / VREFL | ADC reference voltage terminals | Enable external precision reference or internal VDDAD as ADC full-scale range |
| IRQ | External interrupt request | Edge-triggered interrupt input with internal pullup; supports wake-from-Stop functionality |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with software-selectable pullups, slew rate, and drive strength; multiplexed with ADC channels and timer functions |
| SCI0TX / SCI0RX | Serial communication interface 0 | Asynchronous UART pins supporting LIN master break generation and slave break detection |
Key Features
| Feature | Design Value |
|---|---|
| On-chip debug module | ICE-based BDM with 8-deep FIFO, tag/force breakpoints, and three total breakpoint slots |
| Hardware CRC accelerator | Dedicated 16-bit shift register engine supporting ITU-T (CCITT) polynomial for fast memory checksum validation |
| Flash security | Configurable protection via FOPT/NVOPT registers; prevents unauthorized read/write/erase access to FLASH and RAM |
| LIN 2.0 compliance | Dual SCI modules implement extended break generation/detection per LIN specification, enabling direct network node integration |
| Power management | Stop3 mode retains RAM and selected peripherals while drawing <1 µA; LVD remains active for brownout recovery |
Applications
| Automotive Door Module | Industrial Motor Control Interface |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU managing CAN/LIN gateway functions, analog sensor acquisition (potentiometers, temp), and PWM-driven motor drivers. Use Value: Integrated LIN-compliant SCI eliminates external transceiver cost; 60 KB FLASH accommodates firmware updates and diagnostics; hardware CRC ensures bootloader integrity. |
Use Scenario: Compact embedded controller for BLDC motor commutation feedback, current sensing, and user interface in HVAC blowers and pumps. IC Role / Device Role / Timing Role: Real-time motor timing controller using TPM PWM outputs synchronized to ADC sampling of phase currents. Use Value: 16-channel ADC with automatic compare triggers PWM duty cycle adjustments; Stop2 mode enables ultra-low-power standby between operational cycles. |
| Smart Lighting Node | Medical Diagnostic Sensor Hub |
Use Scenario: LED driver and ambient light/color sensor aggregator in commercial building lighting systems with DALI or 0–10 V interfaces. IC Role / Device Role / Timing Role: Sensor fusion processor interfacing photodiodes, RGB sensors, and thermal monitors via I²C/ADC, driving dimmable LED loads. Use Value: Dual I²C modules allow concurrent sensor polling and DALI transceiver communication; internal clock trimming ensures stable timing across temperature. |
Use Scenario: Portable diagnostic device collecting ECG, temperature, and SpO₂ signals for point-of-care analysis. IC Role / Device Role / Timing Role: Signal acquisition MCU with simultaneous multi-channel ADC sampling, real-time filtering, and USB/UART data streaming. Use Value: Hardware CRC validates stored calibration coefficients; LVD interrupt alerts on battery depletion before critical data loss occurs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZN64AMLH | Kinetis E-series ARM Cortex-M0+ core; 64 KB FLASH, 8 KB RAM; no native LIN but supports via software UART | Higher performance, richer peripheral set, but requires migration from HCS08 toolchain and larger footprint | Preferred for new designs needing scalability beyond 8-bit constraints and future-proofing |
| MC9S08AW60CFUE | Same HCS08 architecture; 60 KB FLASH but 64-pin LQFP package; adds CAN 2.0B controller and higher ADC resolution (12-bit) | Direct architectural match with CAN capability; not pin-compatible due to 64-pin vs. 48-pin QFN | Best for CAN-integrated automotive nodes where board redesign is acceptable |
Compared with MC9S08AC60CFDE, S9KEAZN64AMLH offers ARM ecosystem advantages but lacks native LIN hardware, while MC9S08AW60CFUE provides identical instruction compatibility plus CAN-both require layout changes and differ in debug infrastructure and power profile.
Availability
MC9S08AC60CFDE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor interfaces, smart lighting nodes, and portable medical sensor hubs requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08AC60CFDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in embedded processing solutions, specializing in automotive, industrial, and networking silicon.
The MC9S08AC60CFDE belongs to the HCS08 family-designed for cost-sensitive, reliability-critical applications in automotive body control and industrial automation where deterministic real-time response and flash security are essential.
FAQ
What is the package type and thermal pad configuration of the MC9S08AC60CFDE?
The MC9S08AC60CFDE uses a 48-pin QFN package (case outline 98ASA00466D) with copper wire bonding and an exposed thermal pad. This configuration improves heat dissipation in compact automotive and industrial enclosures and supports reflow soldering with standard profiles. The thermal pad must be soldered to a PCB copper pour for optimal thermal performance and electrical grounding.
Does the MC9S08AC60CFDE support LIN 2.0 protocol natively?
Yes, the MC9S08AC60CFDE supports LIN 2.0 natively through its dual SCI modules, which implement master extended break generation and slave extended break detection per SAE J2602. This eliminates the need for external LIN transceivers in basic node implementations and reduces BOM cost and board space in automotive body electronics applications.
What debug capabilities does the MC9S08AC60CFDE provide during development?
The MC9S08AC60CFDE integrates an on-chip background debug module (BDM) with ICE support, offering three breakpoint slots (one configurable as tag/force), eight-deep FIFO for flow tracing, and full register visibility. It supports single-step execution, memory inspection, and flash programming via a single-wire BKGD/MS interface compatible with standard Freescale BDM debuggers.
How does the hardware CRC module in the MC9S08AC60CFDE improve system reliability?
The MC9S08AC60CFDE includes a dedicated 16-bit CRC hardware accelerator compliant with ITU-T (CCITT) standards. It offloads checksum computation from the CPU, enabling rapid validation of FLASH contents, bootloaders, or configuration data-reducing startup time and preventing execution of corrupted code in safety-critical automotive and medical applications.
Can the MC9S08AC60CFDE operate in low-power modes while maintaining peripheral functionality?
Yes, the MC9S08AC60CFDE supports Wait, Stop2, and Stop3 modes. In Stop3 mode, it draws less than 1 µA while retaining RAM and selectively enabling peripherals like LVD and RTC. The ADC and TPM modules can be configured to wake the device on external events or internal timers, making it suitable for battery-powered sensor nodes requiring intermittent operation.
MC9S08AC60CFDE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC60CFDE FAQ
1.How can I place an order for MC9S08AC60CFDE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC60CFDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC60CFDE reliable?
The price and inventory of MC9S08AC60CFDE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC60CFDE is usually 5 days.
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MC9S08AC60CFDE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC60CFDE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC60CFDE?
For technical support, including MC9S08AC60CFDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC60CFDE requirements.
6.How does Aetrix verify that MC9S08AC60CFDE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC60CFDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC60CFDE meets industry standards.
7.What is the process for return or replacement of MC9S08AC60CFDE?
All MC9S08AC60CFDE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC60CFDE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC60CFDE part is unused and in its original packaging.
Return procedure for MC9S08AC60CFDE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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