NXP Semiconductors MC9S08AC60CFGE

Overview

MC9S08AC60CFGE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 60 KB on-chip FLASH, 2 KB RAM, and integrated peripherals including dual SCI (LIN 2.0 compliant), SPI, I²C, 16-channel 10-bit ADC, and three 16-bit TPM timer modules. It operates at up to 20-MHz bus frequency and supports active background debugging for in-circuit development in automotive body control and industrial sensor interface applications.

For engineers reviewing the MC9S08AC60CFGE datasheet, MC9S08AC60CFGE pinout, MC9S08AC60CFGE application, or MC9S08AC60CFGE equivalent, key selection considerations include its 48-pin QFN package with exposed thermal pad, copper-wire bonding per Freescale QFN migration addendum (98ASA00466D), COP watchdog with independent 1 kHz clock source, and hardware CRC module for memory integrity verification.

Technical Context

The MC9S08AC60CFGE implements the S08CPUV2 core with HC08 instruction set extension (BGND), supporting single-cycle 8-bit ALU operations and interrupt latency as low as 5 cycles. Its internal clock generator (ICG) provides precision NVM-trimmed internal reference with selectable dividers for system clock derivation.

Peripherals are memory-mapped and share the 20-MHz bus; the dual SCI modules support master/slave extended break generation/detection per LIN 2.0 and SAE J2602, while the I²C module operates up to 100 kbps with 10-bit address extension and configurable bus loading tolerance.

Key Specifications

Pinout & Package

MC9S08AC60CFGE is housed in a 48-pin QFN package (case outline 98ASA00466D), 7 mm × 7 mm, 0.5 mm pitch, with exposed thermal pad for enhanced power dissipation in compact automotive modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08AC60CFGE, S9KEAZN64ACLH offers ARM-based upgrade path but requires LIN protocol stack implementation, while MC9S08DZ60CLH retains full HCS08 compatibility and adds CAN-making it suitable for mixed-bus automotive gateways where LIN and CAN coexist.

Availability

MC9S08AC60CFGE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart HVAC actuators, and medical front-end devices requiring stable component supply across extended production lifecycles.

Supply support for MC9S08AC60CFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in embedded processing solutions, specializing in automotive, industrial, and networking microcontrollers with robust qualification and long-term support.

The MC9S08AC60CFGE belongs to the HCS08 family-designed specifically for cost-sensitive, real-time control applications demanding high reliability, low power, and integrated LIN/SCI peripherals in compact packages.

FAQ

What is the package type and thermal pad configuration for MC9S08AC60CFGE?

The MC9S08AC60CFGE uses a 48-pin QFN package (case outline 98ASA00466D) with an exposed thermal pad measuring 5 mm × 5 mm. This copper-wire bonded package replaces earlier gold-wire variants per Freescale's QFN migration addendum. The thermal pad must be soldered to a PCB copper pour for optimal heat dissipation and electrical grounding in automotive environments.

Does MC9S08AC60CFGE support LIN 2.0 physical layer compliance out of the box?

Yes, MC9S08AC60CFGE supports LIN 2.0 physical layer compliance natively through its dual SCI modules. Each SCI provides master extended break generation and slave extended break detection per SAE J2602, eliminating need for external LIN transceivers in basic implementations. The MCU's internal clock generator ensures accurate break timing without external crystal dependency.

How much user-accessible FLASH and RAM does MC9S08AC60CFGE provide?

MC9S08AC60CFGE provides 60 KB of on-chip FLASH memory and 2 KB of on-chip RAM. All FLASH is user-programmable with block protection and security options enabled via FOPT and FPROT registers. The 2 KB RAM is fully accessible for variables, stack, and peripheral buffers, with no reserved regions-enabling deterministic real-time execution in safety-critical routines.

Can MC9S08AC60CFGE operate in ultra-low-power modes while retaining peripheral state?

Yes, MC9S08AC60CFGE supports Stop2 and Stop3 modes that reduce current consumption to less than 1 µA while retaining full RAM content and selected peripheral register states. In Stop3 mode, the COP watchdog remains active using its independent 1 kHz internal clock, enabling reliable wake-up from external interrupts or RTC events without external components.

What debugging interface does MC9S08AC60CFGE use, and what tools are compatible?

MC9S08AC60CFGE uses the Background Debug Mode (BDM) interface via the BKGD/MS pin, supporting single-wire in-circuit debugging. It is compatible with P&E Micro's USB-ML-12 and Cyclone Pro debug probes, as well as Freescale's DEMO9S08AC60 evaluation board. No JTAG header is required-reducing PCB footprint and BOM cost in space-constrained designs.