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NXP Semiconductors MC9S08AC60CPUE
- Part No.:
- MC9S08AC60CPUE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08AC60CPUE.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,528
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Product details
Overview
MC9S08AC60CPUE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU core, 60 KB on-chip FLASH memory, and 2 KB RAM. It integrates dual SCI modules supporting LIN 2.0 and SAE J2602, two SPI interfaces, I²C up to 100 kbps, 16-channel 10-bit ADC with auto-compare, and three 16-bit TPM timer/PWM modules - deployed in automotive body control modules requiring deterministic real-time response and flash security.
For engineers reviewing the MC9S08AC60CPUE datasheet, MC9S08AC60CPUE pinout, MC9S08AC60CPUE application, or MC9S08AC60CPUE equivalent, key selection criteria include its 48-pin QFN package with exposed thermal pad, COP watchdog with independent 1 kHz clock source, low-voltage detect interrupt/reset capability, and background debug system with ICE FIFO trace support.
Technical Context
The MC9S08AC60CPUE implements the HCS08 CPUV2 core with HC08 instruction set extension (BGND), operating at up to 40 MHz core frequency and 20 MHz bus frequency. Its internal clock generator (ICG) supports precision NVM-trimmed internal reference, crystal/resonator, or external clock inputs - enabling stable timing without external crystals in cost-sensitive applications.
System-level protection includes configurable COP watchdog with selectable clock source, low-voltage detection with interrupt or reset output, illegal opcode trap, and hardware CRC-16 module for memory integrity verification. Power management supports Wait mode plus Stop2 and Stop3 modes with selective peripheral retention and LVD operation enabled during stop.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 CPUV2, 40-MHz max core frequency - enables fast interrupt response and deterministic real-time execution in automotive sub-systems. |
| Memory | 60 KB on-chip FLASH with block protection and 2 KB RAM - supports secure firmware updates and runtime data buffering without external memory. |
| ADC | 16-channel, 10-bit SAR ADC with automatic compare function - allows threshold-triggered actions (e.g., overtemperature alert) without CPU intervention. |
| Communication | Dual SCI (LIN 2.0/J2602 compliant), I²C (100 kbps), SPI - provides multi-protocol connectivity for sensor networks and actuator control in vehicle domains. |
| Timers | Three 16-bit TPM modules: two 2-channel + one 6-channel - delivers flexible PWM generation, input capture, and edge-aligned/center-aligned PWM for motor and lighting control. |
| Debug | On-chip ICE with 8-deep FIFO, two comparators, nine trigger modes - enables non-intrusive flow tracing and breakpoint debugging in production firmware. |
| Supply & Protection | Operating voltage 2.7–5.5 V; COP watchdog with independent 1 kHz clock; LVD with interrupt/reset - ensures robust operation across battery voltage fluctuations in automotive environments. |
Pinout & Package
The MC9S08AC60CPUE is housed in a 48-pin QFN package (98ASA00466D) with 7 × 7 mm footprint and exposed thermal pad - optimized for compact automotive PCB layouts and thermal dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Separate digital supply pins enable noise isolation between logic and analog subsystems; VSSAD/VDDAD dedicated for ADC domain. |
| XTAL / EXTAL | Clock oscillator inputs | Supports crystal/resonator up to 32 MHz or external clock source - used for high-accuracy timing when internal ICG trim is insufficient. |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface enables in-circuit programming and real-time debugging using standard Freescale BDM tools. |
| RESET | Master reset input | Active-low input with internal pullup - eliminates need for external reset circuitry in most automotive applications. |
| VREFH / VREFL | ADC reference voltage terminals | Allow external precision reference or internal VDD-based reference - critical for accurate sensor signal conditioning in body electronics. |
| PTA0–PTA7, PTB0–PTB7, etc. | Multi-function GPIO ports | 54 total I/O pins with software-selectable pullups, slew rate, and drive strength - simplifies interface design to switches, LEDs, relays, and sensors. |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Security Options | Configurable read/program protection via FOPT/NVOPT registers - prevents unauthorized firmware extraction or reprogramming in production ECUs. |
| Hardware CRC Module | Dedicated 16-bit CRC engine supporting ITU-T polynomial - accelerates memory checksum validation during boot or OTA update without CPU overhead. |
| LIN 2.0 Compliant SCI | Dual SCI modules with master extended break generation and slave extended break detection - meets automotive LIN physical layer timing requirements. |
| Stop3 Mode Retention | RAM retention and LVD active in Stop3 - enables ultra-low-power wake-on-event (e.g., door switch) while preserving context in battery-powered modules. |
| Internal Clock Generator | NVM-trimmed internal reference with ±2% accuracy over temperature - eliminates crystal cost and board space in non-critical timing applications. |
Applications
| Automotive Door Module | Body Control Unit (BCU) |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN-slave communication with gateway, managing PWM-driven motor drivers, and sampling door switch and sensor inputs. Use Value: 60 KB FLASH accommodates multi-feature firmware; dual SCI handles LIN and diagnostic channels; 16-bit TPM enables precise window anti-pinch timing. |
Use Scenario: Integrated control of lighting, wipers, HVAC actuators, and chime functions across vehicle platforms. IC Role / Device Role / Timing Role: System controller coordinating multiple peripherals via I²C (sensors), SPI (EEPROM), and PWM outputs - synchronized by internal 20 MHz bus clock. Use Value: 54 GPIO pins support direct connection to diverse loads; LVD interrupt ensures safe shutdown during battery brownout; CRC validates configuration EEPROM integrity. |
| Smart Junction Box | Seat Position Controller |
Use Scenario: Distributed power distribution and load monitoring in modern vehicle electrical architectures. IC Role / Device Role / Timing Role: Real-time current sensing via ADC, relay driver control via GPIO, and CAN/LIN gateway bridging using SCI modules. Use Value: 10-bit ADC with hardware compare triggers immediate overcurrent response; STOP2 mode reduces quiescent current to <1 µA for always-on monitoring. |
Use Scenario: Motorized seat position adjustment with memory recall and pinch detection. IC Role / Device Role / Timing Role: Closed-loop position control using quadrature encoder input (via TPM input capture) and bidirectional DC motor PWM output. Use Value: Three TPM modules provide simultaneous encoder timing, PWM generation, and safety timeout monitoring; FLASH security protects seat calibration data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08AC60E1MLF | Same core, 60 KB FLASH, but in 64-pin LQFP package with additional I/O and enhanced ESD rating (±8 kV HBM). | Preferred where board layout allows larger package and higher I/O count is needed for expanded sensor/actuator interfaces. | Select when needing >54 GPIO or improved ESD robustness in exposed harness connectors. |
| MC9S08AW60CFUE | Same 48-pin QFN footprint and peripheral set, but adds CAN 2.0B controller and higher temp grade (−40°C to 125°C). | Required for nodes requiring CAN bus integration (e.g., gateway, lighting control) or extended temperature operation. | Choose when CAN communication or AEC-Q100 Grade 1 compliance is mandatory. |
Compared with MC9S08AC60CPUE, S9S08AC60E1MLF offers more I/O in LQFP but lacks QFN thermal performance, while MC9S08AW60CFUE adds CAN and extended temperature range at identical pinout - making it a functional upgrade path where protocol or environmental requirements evolve.
Availability
MC9S08AC60CPUE is available at Aetrix Electronics and suitable for automotive body electronics, industrial control panels, and smart appliance modules requiring stable component supply, long-term lifecycle support, and qualified automotive-grade sourcing.
Supply support for MC9S08AC60CPUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in automotive and industrial microcontrollers, known for robust MCU architectures and automotive qualification expertise.
The MC9S08AC60CPUE belongs to the HCS08 family designed specifically for cost-sensitive, real-time automotive body electronics - balancing performance, peripheral integration, and flash security in compact packages.
FAQ
What is the maximum operating frequency of the MC9S08AC60CPUE CPU core?
The MC9S08AC60CPUE features an HCS08 CPUV2 core with a maximum core frequency of 40 MHz. This enables fast instruction execution and low-latency interrupt handling essential for automotive real-time tasks. The internal bus operates at up to 20 MHz, and the core frequency is derived from the selected clock source - either internal ICG, crystal, or external clock - with programmable dividers ensuring timing flexibility across operating conditions.
Does the MC9S08AC60CPUE support LIN 2.0 communication natively?
Yes, the MC9S08AC60CPUE supports LIN 2.0 natively through its dual Serial Communication Interface (SCI) modules. Each SCI includes master extended break generation and slave extended break detection capabilities, meeting SAE J2602 timing requirements. The hardware-assisted break detection and synchronization ensure reliable node addressing and frame timing without CPU polling - a critical feature for automotive body network implementations.
What package type and pin count does the MC9S08AC60CPUE use?
The MC9S08AC60CPUE uses a 48-pin Quad Flat No-Lead (QFN) package with a 7 × 7 mm body and exposed thermal pad (package code 98ASA00466D). This copper-wire QFN variant replaces earlier gold-wire versions and is optimized for thermal performance and space-constrained automotive PCBs. Pin assignments match the documented 48-QFN outline, including dedicated VDDAD/VSSAD, BKGD/MS, and dual SCI signal routing.
How much on-chip FLASH and RAM does the MC9S08AC60CPUE provide?
The MC9S08AC60CPUE integrates 60 KB of on-chip FLASH memory with configurable block protection and security options, plus 2 KB of on-chip RAM. The FLASH supports in-application programming (IAP), burst programming, and vector redirection - enabling field firmware updates and bootloader implementation. The RAM is fully accessible during all active and wait modes, and retains content in Stop2/Stop3 modes when configured accordingly.
What debug and development support is built into the MC9S08AC60CPUE?
The MC9S08AC60CPUE includes an on-chip background debug system (BDM) with in-circuit emulation (ICE) support. It features an 8-deep FIFO for change-of-flow address storage, two hardware comparators, and nine trigger modes - enabling advanced debugging such as tag breakpoints, force breakpoints, and real-time trace without halting execution. Debug access occurs via the single-pin BKGD/MS interface compatible with standard Freescale BDM probes and IDEs like CodeWarrior.
MC9S08AC60CPUE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC60CPUE FAQ
1.How can I place an order for MC9S08AC60CPUE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC60CPUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC60CPUE reliable?
The price and inventory of MC9S08AC60CPUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC60CPUE is usually 5 days.
3.What payment methods are accepted for MC9S08AC60CPUE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC60CPUE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC60CPUE?
MC9S08AC60CPUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC60CPUE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC60CPUE?
For technical support, including MC9S08AC60CPUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC60CPUE requirements.
6.How does Aetrix verify that MC9S08AC60CPUE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC60CPUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC60CPUE meets industry standards.
7.What is the process for return or replacement of MC9S08AC60CPUE?
All MC9S08AC60CPUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC60CPUE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC60CPUE part is unused and in its original packaging.
Return procedure for MC9S08AC60CPUE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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