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NXP Semiconductors MC9S08AC60MFGE
- Part No.:
- MC9S08AC60MFGE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 44-LQFP
- Datasheet:
-
MC9S08AC60MFGE.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 44LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,448
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Product details
Overview
MC9S08AC60MFGE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core operating at up to 20-MHz bus frequency. It integrates dual SCI modules supporting LIN 2.0 and SAE J2602, a 16-channel 10-bit ADC, and triple TPM timer/PWM modules - deployed in automotive body control modules and industrial sensor interfaces.
For engineers reviewing the MC9S08AC60MFGE datasheet, MC9S08AC60MFGE pinout, MC9S08AC60MFGE application, or MC9S08AC60MFGE equivalent, key selection criteria include its QFN-48 copper-wire package, on-chip background debug system with ICE FIFO, COP watchdog with independent 1 kHz clock source, and hardware CRC module for memory integrity verification.
Technical Context
The MC9S08AC60MFGE implements the S08CPUV2 core with HC08 instruction set extension including BGND, and supports five power modes: Run, Active Background, Wait, Stop2, and Stop3. Its internal clock generator (ICG) uses NVM-trimmed RC oscillators with crystal/resonator/external clock options.
Peripheral integration includes two SCI modules with master/slave extended break handling, one I²C module (up to 100 kbps), one SPI interface, and three TPM modules offering input capture, output compare, edge-aligned and centered PWM - all configurable via dedicated control registers and supported in Stop2/Stop3 modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction; enables in-circuit debugging without external emulator. |
| Max Clock Frequency | 40 MHz CPU / 20 MHz bus; determines real-time interrupt latency and instruction throughput. |
| Memory | 60 KB FLASH (with block protection & vector redirection) + 2 KB RAM; supports field firmware updates and data logging. |
| ADC | 16-channel, 10-bit SAR ADC with automatic compare; enables threshold-triggered event response without CPU intervention. |
| Timers | Three TPM modules: two 2-channel + one 6-channel; provide 16-bit resolution for motor control PWM and input capture timing. |
| Communication | Dual SCI (LIN 2.0/J2602 compliant), I²C (100 kbps), SPI; supports distributed automotive network nodes. |
| Package | 48-pin QFN (98ASA00466D); copper-wire bonded, exposed pad for thermal dissipation in compact PCB layouts. |
Pinout & Package
MC9S08AC60MFGE is housed in a 48-pin QFN package (case outline 98ASA00466D), featuring an exposed thermal pad and copper-wire interconnect for improved reliability over legacy gold-wire variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Separate digital supply pins; require local decoupling for noise-sensitive MCU operation. |
| VDDAD, VSSAD | Analog power and ground | Isolated analog domain; mandatory separation from digital VDD/VSS to preserve ADC accuracy. |
| XTAL / EXTAL | Clock oscillator inputs | Supports crystal/resonator up to 8 MHz or external clock source; drives internal ICG for system timing. |
| RESET | Active-low reset input | Internal pullup reduces BOM count; accepts power-on reset, COP timeout, or LVD events as assertion sources. |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface; enables flash programming and real-time debugging via standard BDM pod. |
| VREFH / VREFL | ADC reference voltage terminals | Accept external or internal reference; define full-scale range for 10-bit conversion linearity. |
| PTA0–PTA7, PTB0–PTB7, etc. | Multi-function GPIO ports | 54 total I/O pins with software-selectable pullups, slew rate, and drive strength - configurable per-pin for mixed-signal routing. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip CRC module (S08CRCV1) | Hardware-accelerated 16-bit CRC generation using ITU-T polynomial; validates FLASH integrity during boot or OTA update. |
| SCI with LIN 2.0 support | Dual SCI modules each implement master break generation and slave break detection per LIN specification - no external transceiver required for basic node control. |
| TPM-centered PWM (CPWM) | All TPM channels support buffered, centered PWM mode - essential for low-noise motor driver gate control and reduced EMI in automotive actuators. |
| Low-voltage detect (LVD) | Configurable trip points (2.5 V / 2.8 V / 3.0 V) with reset or interrupt output; prevents erratic operation during brown-out conditions. |
| Security features | FLASH block protection, NVOPT-based security lock, and illegal opcode detection - protects firmware IP and prevents unauthorized access. |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing LIN-slave communication, ADC-based potentiometer feedback, and multi-channel PWM for actuator drivers. Use Value: Integrated LIN-compliant SCI eliminates need for external transceivers; 60 KB FLASH accommodates multiple vehicle variant configurations. | Use Scenario: Remote environmental monitoring using temperature, humidity, and analog gas sensors in factory settings. IC Role / Device Role / Timing Role: Data acquisition hub with 10-bit ADC sampling, CRC-verified FLASH storage, and UART-to-RS485 gateway via SCI. Use Value: Hardware CRC ensures data log integrity across power cycles; Stop2 mode extends battery life in wireless sensor deployments. |
| Motor Drive Interface Module | Smart Power Distribution Panel |
Use Scenario: Brushed DC motor speed regulation in HVAC blowers and seat adjusters. IC Role / Device Role / Timing Role: PWM generator and current-sense ADC processor with fault detection via IRQ and COP watchdog. Use Value: Six-channel TPM provides independent PWM outputs for dual-motor control; hardware compare triggers immediate shutdown on overcurrent. | Use Scenario: Load switching and diagnostics in 24 V industrial control cabinets with fused outputs. IC Role / Device Role / Timing Role: System supervisor managing relay drivers, voltage monitoring, and communication with PLC via I²C or SCI. Use Value: 54 GPIO pins enable direct connection to status LEDs, current sense amps, and isolation drivers; LVD interrupt alerts before undervoltage lockout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AW60CFUE | Same HCS08 core, 60 KB FLASH, but 64-pin LQFP package and enhanced analog features (dual ADC, higher VREF stability). | Preferred where board layout allows larger footprint and higher-precision analog measurement is required. | Select when needing additional ADC channels or tighter reference tolerance; not pin-compatible with MC9S08AC60MFGE. |
| S9KEAZN64ACLH | Kinetis E-series ARM Cortex-M0+ core, 64 KB FLASH, 8 KB RAM, same 48-pin QFN package (but different pinout), integrated CAN FD controller. | Targets next-generation designs requiring CAN connectivity, higher compute throughput, or toolchain migration path. | Choose for CAN-based networks or future-proofing; requires PCB redesign due to non-pin-compatible pin mapping. |
Compared with MC9S08AW60CFUE and S9KEAZN64ACLH, the MC9S08AC60MFGE offers optimal cost-performance balance for LIN-based automotive peripherals in space-constrained QFN layouts, while retaining mature toolchain support and proven field reliability.
Availability
MC9S08AC60MFGE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, and motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MC9S08AC60MFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's embedded MCU heritage.
The MC9S08AC60MFGE belongs to the HCS08 family - designed specifically for cost-sensitive, real-time automotive and industrial control applications requiring robust debug capability, analog integration, and functional safety readiness.
FAQ
What is the package type and thermal pad configuration of the MC9S08AC60MFGE?
The MC9S08AC60MFGE uses a 48-pin QFN package (case outline 98ASA00466D) with copper-wire bonding and an exposed thermal pad. This configuration improves thermal performance over legacy gold-wire packages and requires soldering the pad to a thermal plane on the PCB for reliable operation at full 40-MHz CPU speed.
Does the MC9S08AC60MFGE support LIN 2.0 communication natively?
Yes, the MC9S08AC60MFGE supports LIN 2.0 natively through its dual SCI modules, which include master extended break generation and slave extended break detection per SAE J2602. No external LIN transceiver is needed for basic node functionality, though physical layer compliance requires external driver circuitry.
How does the on-chip CRC module in the MC9S08AC60MFGE operate?
The MC9S08AC60MFGE includes a dedicated S08CRCV1 hardware module that computes 16-bit CRC using the ITU-T (CCITT) polynomial. It operates independently of the CPU, supports memory block verification, and integrates directly with FLASH programming routines to ensure data integrity during firmware updates or boot-time validation.
What power-saving modes are available on the MC9S08AC60MFGE and how do they affect peripheral operation?
The MC9S08AC60MFGE supports Wait, Stop2, and Stop3 modes. In Stop2, the ICG remains active allowing wake-up from SCI or TPM; in Stop3, only the 1 kHz COP clock runs. ADC, TPM, and SCI retain limited functionality in Stop2 but are disabled in Stop3 - enabling ultra-low-power sensor polling or LIN sleep/wake protocols.
Can the MC9S08AC60MFGE be programmed and debugged in-circuit without external hardware?
Yes, the MC9S08AC60MFGE features an on-chip background debug module (BDM) accessible via the BKGD/MS pin. Using a standard BDM pod or compatible debugger, engineers can perform flash programming, real-time variable inspection, and single-step execution - all without removing the MC9S08AC60MFGE from the target board.
MC9S08AC60MFGE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 44-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC60MFGE FAQ
1.How can I place an order for MC9S08AC60MFGE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC60MFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC60MFGE reliable?
The price and inventory of MC9S08AC60MFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC60MFGE is usually 5 days.
3.What payment methods are accepted for MC9S08AC60MFGE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC60MFGE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC60MFGE?
MC9S08AC60MFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC60MFGE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC60MFGE?
For technical support, including MC9S08AC60MFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC60MFGE requirements.
6.How does Aetrix verify that MC9S08AC60MFGE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC60MFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC60MFGE meets industry standards.
7.What is the process for return or replacement of MC9S08AC60MFGE?
All MC9S08AC60MFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC60MFGE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC60MFGE part is unused and in its original packaging.
Return procedure for MC9S08AC60MFGE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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