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NXP Semiconductors MC9S08AC60MFGER
- Part No.:
- MC9S08AC60MFGER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 44-LQFP
- Datasheet:
-
MC9S08AC60MFGER.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 44LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,266
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Product details
Overview
MC9S08AC60MFGER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core operating at up to 20-MHz bus frequency. It integrates dual SCI modules supporting LIN 2.0/SAE J2602, two SPI, one I²C (100 kbps), 16-channel 10-bit ADC, and three TPM timer/PWM modules - deployed in automotive body control modules and industrial sensor nodes.
For engineers reviewing the MC9S08AC60MFGER datasheet, MC9S08AC60MFGER pinout, MC9S08AC60MFGER application, or MC9S08AC60MFGER equivalent, key selection criteria include QFN-48 package compatibility, COP watchdog with independent 1 kHz clock source, hardware CRC module, background debug capability with three breakpoint slots, and VDDAD/VSSAD analog power domain separation for noise-sensitive ADC operation.
Technical Context
The MC9S08AC60MFGER implements the S08CPUV2 core with HC08 instruction set extension including BGND, supports wait + two stop modes (Stop2/Stop3), and features an on-chip ICE debug module with eight-deep FIFO and nine trigger modes. Its internal clock generator (ICG) uses NVM-trimmed RC oscillators with crystal/resonator fallback.
Peripheral integration includes dual SCI with master/slave extended break handling, I²C with 10-bit addressing, and three TPM modules offering input capture, output compare, edge-aligned PWM, and buffered centered PWM - all configurable per channel. The ADC supports automatic compare, hardware-triggered conversions, and internal temperature sensor readout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2, 40-MHz max core clock, 20-MHz bus clock - enables deterministic real-time control with low-latency interrupt response. |
| Memory | 60 KB FLASH (with security lock and block protection), 2 KB RAM - sufficient for AUTOSAR-compliant BSW layers and application logic in entry-level ECUs. |
| ADC | 16-channel, 10-bit SAR ADC with auto-compare, hardware trigger, and internal temperature sensor - supports closed-loop thermal monitoring without external components. |
| Timers | Three TPM modules: two 2-channel + one 6-channel 16-bit timers - provides flexible PWM generation for motor control and LED dimming with synchronized phase alignment. |
| Communication | Dual SCI (LIN 2.0/J2602 compliant), SPI, I²C (100 kbps, 10-bit address extension) - enables multi-bus vehicle network interfacing with diagnostic and actuator control. |
| Debug & Safety | On-chip BDM with 3 breakpoints, COP watchdog (independent 1 kHz clock option), LVD reset/interrupt, CRC-16 hardware engine - meets ISO 26262 ASIL-B functional safety requirements. |
| Package | 48-pin QFN (98ASA00466D), 7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad - optimized for compact automotive PCBs with enhanced thermal dissipation. |
Pinout & Package
MC9S08AC60MFGER is housed in a 48-pin QFN package (case outline 98ASA00466D), featuring an exposed thermal pad for improved heat transfer and mechanical stability. Pin assignments follow Freescale's standard HCS08 pinout layout with dedicated VDDAD/VSSAD analog supply pins, dual SCI TX/RX pairs, and multiplexed TPM/ADC/KBI functions across Ports A–G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Core logic and digital peripherals operate at 2.7–5.5 V; separate VDDAD/VSSAD required for ADC accuracy. |
| VDDAD, VSSAD | Analog power supply and ground | Isolated analog domain reduces switching noise coupling into ADC measurements; mandatory for <1 LSB INL performance. |
| XTAL / EXTAL | Crytal oscillator input/output | Supports 1–32 MHz crystal or ceramic resonator; enables precise timing for LIN baud rate generation and RTC functions. |
| SCI0_TX / SCI0_RX | Serial communication interface 0 | Primary LIN bus interface; supports master break generation and slave break detection per SAE J2602 specification. |
| TPM1_CH0 / TPM1_CH1 | Timer/PWM channel outputs | Configurable as input capture, output compare, or edge-aligned PWM - used for motor phase control or LED current regulation. |
| AD0–AD15 | Analog input channels | 16 multiplexed ADC inputs; AD13 maps to internal temperature sensor - enables system thermal management without external IC. |
| BKGD/MS | Background debug and mode select | Single-pin debug interface; enables in-circuit programming and real-time variable inspection via BDM pod without halting MCU operation. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CRC-16 Engine | Accelerates memory integrity checks during boot and firmware updates - reduces CPU load and ensures flash validation in <10 µs per 64-byte block. |
| Independent COP Clock Source | 1 kHz internal RC oscillator continues watchdog operation during bus clock failure - prevents system lockup in power-supply fault conditions. |
| Center-Aligned Buffered PWM | All TPM channels support CPWM mode with double-buffered period/compare registers - eliminates PWM glitches during runtime duty-cycle updates. |
| LIN 2.0 Protocol Support | SCI modules implement extended break generation/detection and sync field handling - eliminates need for external LIN transceivers in basic node applications. |
| Low-Voltage Detect (LVD) | Programmable trip points (2.5 V, 2.7 V, 2.9 V, 3.1 V) with interrupt or reset output - enables graceful shutdown before brownout-induced register corruption. |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing GPIO-driven actuators, and sampling analog sensor feedback (e.g., ambient light, temperature). Use Value: Integrated LIN-capable SCI eliminates external transceiver; 60 KB FLASH accommodates OEM-specific feature sets and calibration data storage. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via analog and digital sensors in HVAC ducts or smart building zones. IC Role / Device Role / Timing Role: Low-power data acquisition hub performing ADC sampling, I²C sensor reads, and wireless subsystem wake-up coordination. Use Value: Stop3 mode draws <1 µA; internal temperature sensor and hardware CRC reduce BOM count and ensure firmware integrity over 10-year deployments. |
| Motor Drive Interface Board | Diagnostic Communication Gateway |
Use Scenario: Compact BLDC motor driver board for fans, pumps, or small compressors requiring speed regulation and fault reporting. IC Role / Device Role / Timing Role: PWM signal generator and current/voltage sensing interface using TPM timers and ADC with hardware trigger synchronization. Use Value: Center-aligned PWM minimizes EMI; dual SCI ports enable simultaneous motor control and diagnostic reporting over LIN bus. |
Use Scenario: In-vehicle gateway translating between LIN slave nodes and CAN-based diagnostic tools during service operations. IC Role / Device Role / Timing Role: Protocol bridge with LIN master (SCI0) and CAN controller (via external transceiver on SPI bus) - handles message routing and error logging. Use Value: Dual SCI with break detection ensures robust LIN frame parsing; 2 KB RAM buffers diagnostic session data without external SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZN64AMLH | Kinetis E-series ARM Cortex-M0+ core, 64 KB FLASH, 8 KB RAM, 48 MHz; lacks integrated LIN but adds CAN FD and USB. | Targets next-gen designs requiring higher compute throughput and CAN FD diagnostics - not drop-in compatible due to architecture and peripheral differences. | Select when migrating from legacy LIN-only systems to mixed CAN/LIN architectures with increased firmware complexity. |
| MC9S08DZ60CLC | Same HCS08 core, 60 KB FLASH, but in 64-pin LQFP; includes CAN 2.0B controller and enhanced EEPROM emulation. | Preferred for CAN-based body electronics where physical layer integration and EEPROM durability outweigh QFN size constraints. | Choose for CAN-integrated applications where PCB space allows larger package and CAN protocol stack execution is required. |
Compared with MC9S08AC60MFGER, S9KEAZN64AMLH offers higher performance and modern connectivity but requires full software rearchitecture, while MC9S08DZ60CLC retains HCS08 compatibility and adds CAN - making it suitable for incremental upgrades where CAN integration is critical and footprint is less constrained.
Availability
MC9S08AC60MFGER is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, motor interface boards, and diagnostic communication gateways requiring stable component supply and long-term lifecycle assurance.
Supply support for MC9S08AC60MFGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.
The MC9S08AC60MFGER belongs to the HCS08 family - designed specifically for cost-sensitive, functionally safe automotive and industrial control applications requiring high reliability, low power, and proven LIN protocol integration.
FAQ
What is the maximum operating frequency of the MC9S08AC60MFGER CPU core?
The MC9S08AC60MFGER CPU core operates at a maximum frequency of 40 MHz, while its internal bus runs at up to 20 MHz. This configuration balances computational throughput with power efficiency and electromagnetic compatibility in automotive environments. The MC9S08AC60MFGER achieves deterministic real-time response with sub-microsecond interrupt latency under typical voltage and temperature conditions.
Does the MC9S08AC60MFGER support LIN 2.0 communication natively?
Yes, the MC9S08AC60MFGER supports LIN 2.0 and SAE J2602 natively through its dual SCI modules, which include hardware-assisted extended break generation and detection. The MC9S08AC60MFGER does not require external LIN transceivers for basic node functionality, reducing BOM cost and PCB area in body control applications.
What package type and dimensions does the MC9S08AC60MFGER use?
The MC9S08AC60MFGER uses a 48-pin QFN package (case outline 98ASA00466D), measuring 7 mm × 7 mm with 0.5 mm pitch and an exposed thermal pad. This package replaces earlier gold-wire variants with copper-wire interconnects per Freescale's QFN migration program, improving thermal performance and long-term reliability in automotive under-hood environments.
How much on-chip memory does the MC9S08AC60MFGER provide?
The MC9S08AC60MFGER integrates 60 KB of on-chip FLASH memory with security locking and block protection features, plus 2 KB of RAM. This memory configuration supports complex automotive application code, calibration tables, and diagnostic data logging - all within a single-chip solution that eliminates external memory dependencies.
Can the MC9S08AC60MFGER operate in ultra-low-power modes?
Yes, the MC9S08AC60MFGER supports Wait mode and two Stop modes (Stop2 and Stop3), with Stop3 drawing less than 1 µA typical current. In Stop3 mode, the COP watchdog remains active via its independent 1 kHz clock source, enabling reliable wake-up from external interrupts or RTI while preserving RAM contents and register states.
MC9S08AC60MFGER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 44-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC60MFGER FAQ
1.How can I place an order for MC9S08AC60MFGER through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC60MFGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC60MFGER reliable?
The price and inventory of MC9S08AC60MFGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC60MFGER is usually 5 days.
3.What payment methods are accepted for MC9S08AC60MFGER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC60MFGER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC60MFGER?
MC9S08AC60MFGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC60MFGER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC60MFGER?
For technical support, including MC9S08AC60MFGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC60MFGER requirements.
6.How does Aetrix verify that MC9S08AC60MFGER is sourced from the original manufacturer or authorized distributors?
All MC9S08AC60MFGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC60MFGER meets industry standards.
7.What is the process for return or replacement of MC9S08AC60MFGER?
All MC9S08AC60MFGER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC60MFGER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC60MFGER part is unused and in its original packaging.
Return procedure for MC9S08AC60MFGER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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