NXP Semiconductors MC9S08AC8CFDE
- Part No.:
- MC9S08AC8CFDE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC9S08AC8CFDE.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 48QFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,476
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Product details
Overview
MC9S08AC8CFDE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, 40-MHz CPU, and integrated peripherals including dual SCI, SPI, I²C, 10-bit ADC, and three 16-bit TPM timer modules. It targets cost-sensitive industrial control and consumer appliance applications requiring reliable on-chip debug and low-power operation.
For engineers reviewing the MC9S08AC8CFDE datasheet, MC9S08AC8CFDE pinout, MC9S08AC8CFDE application, or MC9S08AC8CFDE equivalent, this page delivers verified package mapping (32-pin QFN), confirmed peripheral register compatibility, real-world power mode behavior (Wait + Stop2/Stop3), and validated alternative options for migration or second sourcing.
Technical Context
The MC9S08AC8CFDE implements the S08CPUV2 core with HC08 instruction set extension (BGND), background debugging system (BDM), and up to 32 interrupt/reset sources. Its internal clock generator supports FEI/FEE/FBE modes with NVM-trimmed precision, enabling stable 20-MHz bus frequency from internal or external sources.
Peripherals include two independent SCI modules (13-bit break support), a single SPI module (V3), I²C bus controller (100 kbps standard-mode), and three 16-bit TPM modules - two with 2 channels and one with 4 channels - all supporting input capture, output compare, edge-aligned PWM, and buffered center-aligned PWM (CPWM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction and BDM support for in-circuit debugging |
| Max CPU Frequency | 40 MHz - enables high-speed control loop execution without external acceleration |
| Flash Memory | 8 KB on-chip FLASH with block protection and security options - sufficient for firmware + bootloader in compact embedded systems |
| RAM Size | 512 B on-chip RAM - supports real-time data buffering and stack depth for nested interrupts |
| I/O Pins | Up to 28 general-purpose I/O pins - configurable with software-selectable pullups, slew rate, and drive strength |
| ADC | 8-channel, 10-bit SAR ADC with automatic compare function - suitable for sensor monitoring and closed-loop feedback |
| Timers | Three 16-bit TPM modules (2×2-channel + 1×4-channel) - provides flexible PWM generation and precise timing for motor control or lighting |
Pinout & Package
MC9S08AC8CFDE is housed in a 32-pin QFN package (98ASA00473D) with exposed thermal pad, copper-wire interconnect, and 0.5 mm pitch. This package supports automated reflow assembly and enhanced thermal dissipation in space-constrained designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual VDD/VSS pair ensures stable core and I/O rail separation; VSSAD dedicated for analog ground improves ADC noise immunity |
| XTAL / EXTAL | Clock oscillator interface | Supports crystal (32 kHz–4 MHz), resonator, or external clock source - enables precise timing or low-cost RC-free startup |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface allows programming and real-time debugging without dedicated JTAG header |
| RESET | Master reset input | Active-low reset with internal pullup - eliminates external resistor and simplifies board layout |
| VREFH / VREFL | ADC reference inputs | Allows external precision reference or internal VDD-based reference - selectable for accuracy vs. cost trade-off |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with shared SCI0, SPI, TPM0, and KBI functions - enables flexible peripheral multiplexing |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port with shared SCI1, I²C, TPM1, and ADC functions - supports mixed digital/analog signal routing |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port with shared TPM2, IRQ, and KBI functions - provides additional interrupt-capable inputs |
Key Features
| Feature | Design Value |
|---|---|
| Background Debug Module (BDM) | Two comparators, nine trigger modes, and eight-deep FIFO enable non-intrusive runtime inspection without halting critical tasks |
| Low-Voltage Detect (LVD) | Configurable reset or interrupt on undervoltage - protects firmware integrity during brown-out conditions |
| Computer Operating Properly (COP) | Independent watchdog with optional internal clock source - ensures system recovery even if main clock fails |
| Stop2 / Stop3 Power Modes | Ultra-low current consumption (<1 µA in Stop3) with selective peripheral wake-up - extends battery life in portable devices |
| On-Chip Security | FLASH security byte prevents unauthorized readout of firmware - meets basic IP protection requirements |
Applications
| Home Appliance Control | Industrial Sensor Node |
|---|---|
Use Scenario: Microcontroller in washing machine main control board managing motor drive, water valve, temperature sensing, and user interface. IC Role / Device Role / Timing Role: Central control unit executing real-time PID loops, coordinating serial communication with display and actuator drivers, and managing power sequencing. Use Value: Integrated TPM modules generate precise motor PWM; dual SCI interfaces handle display and remote diagnostics; on-chip LVD prevents erratic behavior during line voltage dips. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via analog and digital sensors, then transmitting data over RS-485. IC Role / Device Role / Timing Role: Data acquisition and protocol translation engine performing ADC sampling, I²C sensor reads, and SCI-to-RS485 framing. Use Value: 10-bit ADC resolves sub-degree temperature changes; Stop3 mode reduces average current to <1 µA between 10-second sampling intervals. |
| Smart Lighting Controller | Automotive Body Control Module (Non-Safety) |
Use Scenario: LED driver board in commercial downlight adjusting brightness and color temperature via DALI or 0–10 V interface. IC Role / Device Role / Timing Role: PWM generator and communication gateway translating DALI commands into multi-channel dimming signals. Use Value: Four-channel TPM supports independent RGBW LED channel control; I²C manages onboard EEPROM for calibration data storage. | Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Peripheral coordinator interfacing with LIN transceivers, relays, and potentiometers while managing local power states. Use Value: Dual SCI modules support simultaneous LIN master/slave operation; KBI detects mechanical switch closures with debounced interrupt response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC16CFDE | 16 KB FLASH, 1 KB RAM, identical pinout and peripheral set | Higher firmware capacity for feature-rich implementations with bootloader or OTA update capability | Select when future firmware expansion or field-upgrade capability is required |
| S9KEAZ8AMTJ | Kinetis E-series ARM Cortex-M0+, 48 MHz, 8 KB FLASH, 1 KB RAM, different architecture and toolchain | Requires migration effort but offers higher performance, newer peripherals (USB, CAN), and long-term roadmap support | Select for new designs prioritizing longevity and scalability over legacy code reuse |
Compared with MC9S08AC8CFDE, MC9S08AC16CFDE provides double flash and RAM in identical packaging for seamless firmware scaling, while S9KEAZ8AMTJ offers modern ARM architecture at the cost of toolchain and software rework - making the former ideal for incremental upgrades and the latter for greenfield projects demanding roadmap assurance.
Availability
MC9S08AC8CFDE is available at Aetrix Electronics and suitable for industrial automation, home appliance control, and smart lighting applications requiring stable component supply across extended production lifecycles.
Supply support for MC9S08AC8CFDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and communication infrastructure markets.
The MC9S08AC8CFDE belongs to the HCS08 family - designed specifically for cost-optimized, low-power embedded control in consumer and industrial applications where deterministic real-time response and debug reliability are essential.
FAQ
What is the package type and pin count of the MC9S08AC8CFDE?
The MC9S08AC8CFDE uses a 32-pin QFN package (document number 98ASA00473D) with an exposed thermal pad and 0.5 mm pitch. This copper-wire QFN variant replaces earlier gold-wire versions and is optimized for automated assembly and thermal performance in compact PCB layouts. The MC9S08AC8CFDE pinout supports full peripheral functionality including dual SCI, SPI, I²C, ADC, and three TPM modules within this footprint.
Does the MC9S08AC8CFDE support in-circuit debugging, and how is it implemented?
Yes, the MC9S08AC8CFDE integrates a Background Debug Module (BDM) accessible via the BKGD/MS pin. It supports single breakpoint setting during active debugging plus two additional breakpoints in the on-chip debug module, along with an eight-deep FIFO for storing flow-change addresses. The MC9S08AC8CFDE requires no external debugger hardware beyond a simple BDM interface cable, enabling real-time inspection and flash programming without halting time-critical operations.
What are the power management capabilities of the MC9S08AC8CFDE?
The MC9S08AC8CFDE supports Wait mode and two Stop modes (Stop2 and Stop3). In Stop3, typical current consumption is below 1 µA, with wake-up possible via IRQ, RTC, or LVD events. The COP watchdog can operate from an independent internal clock source during Stop modes, ensuring fail-safe recovery. These features make the MC9S08AC8CFDE suitable for battery-powered applications where duty-cycled operation and ultra-low standby power are mandatory design requirements.
Can the MC9S08AC8CFDE operate without an external crystal or resonator?
Yes, the MC9S08AC8CFDE can operate using its internally generated clock with factory-trimmed NVM values, achieving stable 20-MHz bus frequency without external timing components. The internal clock generator supports FEI (FLL Engaged Internal) mode for crystal-free startup and operation, reducing BOM cost and board space. External crystals (32 kHz–4 MHz) or resonators remain supported for higher precision timing when required by the application.
What is the maximum ADC resolution and channel count supported by the MC9S08AC8CFDE?
The MC9S08AC8CFDE integrates an 8-channel, 10-bit successive-approximation ADC with automatic compare function and programmable sample time. It supports both single-ended and differential input configurations, with conversion times as low as 4 µs per sample. The MC9S08AC8CFDE ADC includes dedicated VREFH/VREFL pins for external reference selection and shares analog input pins with Port A and Port B, enabling flexible sensor interface design without external multiplexers.
MC9S08AC8CFDE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 768 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC8CFDE FAQ
1.How can I place an order for MC9S08AC8CFDE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC8CFDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC8CFDE reliable?
The price and inventory of MC9S08AC8CFDE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC8CFDE is usually 5 days.
3.What payment methods are accepted for MC9S08AC8CFDE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC8CFDE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC8CFDE?
MC9S08AC8CFDE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC8CFDE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC8CFDE?
For technical support, including MC9S08AC8CFDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC8CFDE requirements.
6.How does Aetrix verify that MC9S08AC8CFDE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC8CFDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC8CFDE meets industry standards.
7.What is the process for return or replacement of MC9S08AC8CFDE?
All MC9S08AC8CFDE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC8CFDE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC8CFDE part is unused and in its original packaging.
Return procedure for MC9S08AC8CFDE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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