NXP Semiconductors MC9S08AC8MFJE
- Part No.:
- MC9S08AC8MFJE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08AC8MFJE.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08AC8MFJE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB Flash, 512 B RAM, 40-MHz CPU, and integrated peripherals including dual SCI, SPI, I²C, three 16-bit TPM timers, 8-channel 10-bit ADC, and KBI - designed for cost-sensitive industrial control and consumer appliance applications.
For engineers reviewing the MC9S08AC8MFJE datasheet, MC9S08AC8MFJE pinout, MC9S08AC8MFJE application, or MC9S08AC8MFJE equivalent, this page delivers verified package mapping (32-pin QFN), confirmed peripheral register compatibility, validated low-voltage detection behavior, and real-world timing constraints for Stop2/Stop3 modes and ADC sampling accuracy.
Technical Context
The MC9S08AC8MFJE implements the S08CPUV2 core with HC08 instruction set extension (BGND), background debug system with two comparators and nine trigger modes, and a FIFO-based debug module supporting tag/force breakpoints. Its internal clock generator (S08ICGV4) supports FEI, FEE, FBE, and SCM modes with NVM-trimmed internal reference and external crystal/resonator options.
Peripherals are memory-mapped and share bus arbitration via the S08TPMV3 timer modules (two 2-channel + one 4-channel), S08ADC10V1 with automatic compare, and S08SCIV4 with optional 13-bit break. All I/O ports support software-selectable pullups, slew rate, and drive strength - critical for noise-immune industrial sensor interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV2 with BGND instruction and 40-MHz max frequency - enables deterministic real-time control loops at sub-250 ns instruction cycle. |
| Memory | 8 KB on-chip FLASH with block protection and security; 512 B RAM - sufficient for firmware with bootloader, sensor fusion, and communication stacks. |
| ADC | 8-channel, 10-bit SAR ADC with auto-compare - supports threshold-triggered event capture without CPU intervention. |
| Timers | Three 16-bit TPM modules (2×2-channel, 1×4-channel) with input capture, output compare, and edge-aligned PWM - enables motor phase control and encoder counting in single chip. |
| Communication | Dual SCI (UART), SPI, and I²C (100 kbps standard mode) - provides flexible host interface, sensor bus, and flash programming capability. |
| Power Modes | Wait, Stop2, Stop3 - Stop3 draws ≤1.0 µA typical, enabling battery-powered operation for >1 year with periodic wake-up. |
| Supply Range | 2.7–5.5 V - compatible with single-cell Li-ion, 3.3 V logic rails, and legacy 5 V systems without level shifters. |
Pinout & Package
MC9S08AC8MFJE is housed in a 32-pin QFN package (98ASA00473D) with 5 mm × 5 mm footprint, 0.5 mm pitch, and exposed thermal pad - optimized for compact industrial PCBs requiring thermal efficiency and EMI resilience.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual VDD/VSS pair ensures stable core and I/O rail decoupling; VSSAD separate analog ground reduces ADC noise. |
| XTAL / EXTAL | Clock oscillator terminals | Supports 32 kHz crystal for RTC or 1–8 MHz crystals/resonators; internal trimming allows ±2% accuracy without external components. |
| RESET | Active-low reset input | Internal pullup eliminates external resistor; accepts 100 ns minimum pulse width for reliable power-on and brownout recovery. |
| BKGD/MS | Background debug and mode select | Single-pin BDM interface enables in-circuit debugging without dedicated JTAG pins - reduces BOM and layout complexity. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with programmable pullups, slew rate, and drive strength - configurable as UART TX/RX, SPI MOSI/MISO, or ADC inputs. |
| PTB0–PTB7 | Port B general-purpose I/O | Includes IRQ input and KBI pins; supports keyboard matrix scanning with hardware debouncing and interrupt-on-change. |
| VREFH / VREFL | ADC reference voltage terminals | Accept external 0–VDD reference or internal bandgap (1.22 V); enables ratiometric sensor measurements independent of supply drift. |
Key Features
| Feature | Design Value |
|---|---|
| Background Debug Module (BDM) | On-chip debug with two hardware breakpoints and eight-deep FIFO trace - eliminates need for external emulator during firmware validation. |
| Computer Operating Properly (COP) | Independent watchdog with selectable clock source (bus or internal RC) - prevents runaway code in safety-critical appliance control. |
| Low-Voltage Detect (LVD) | Configurable trip points (2.5 V, 2.7 V, 3.0 V, 3.3 V) with reset or interrupt output - enables graceful shutdown before EEPROM corruption. |
| Keyboard Interrupt (KBI) | 7-pin matrix scan with auto-debounce and interrupt generation - supports up to 21-key membrane keypad with zero CPU overhead. |
| FLASH Security | Block-level protection and mass erase disable - prevents unauthorized firmware extraction in white-goods MCU deployments. |
Applications
| Home Appliance Control | Industrial Sensor Node |
|---|---|
Use Scenario: Microcontroller in washing machine main control board managing motor drive, water valve sequencing, temperature sensing, and user interface. IC Role / Device Role / Timing Role: Central control unit executing real-time PID loops, interpreting ADC readings from NTC thermistors, and driving triac-based motor phases via PWM outputs. Use Value: Integrated TPM timers enable precise 50/60 Hz synchronous motor commutation; on-chip FLASH security protects proprietary wash algorithms from cloning. | Use Scenario: Standalone environmental monitor deployed in factory HVAC ducts measuring temperature, humidity, and CO₂ via analog and I²C sensors. IC Role / Device Role / Timing Role: Data acquisition hub performing periodic ADC sampling, sensor fusion, and low-power wireless transmission via UART-to-LoRa bridge. Use Value: Stop3 mode draws <1.0 µA, extending 2×AA battery life beyond 18 months; dual SCI supports simultaneous debug logging and radio command interface. |
| Smart Power Outlet | LED Lighting Controller |
Use Scenario: Wi-Fi-enabled smart plug monitoring load current, detecting overcurrent events, and enforcing timed switching schedules. IC Role / Device Role / Timing Role: System supervisor coordinating current-sense ADC conversion, relay driver timing, and communication stack handshaking with ESP32 co-processor. Use Value: Hardware auto-compare on ADC channel triggers immediate relay cutoff on overcurrent - response time <10 µs, faster than software polling. | Use Scenario: Dimmable LED driver in commercial downlight fixture implementing DALI-compatible digital control and thermal foldback. IC Role / Device Role / Timing Role: DALI slave controller receiving addressable commands, converting to PWM duty cycles, and monitoring heatsink temperature via onboard ADC. Use Value: I²C interface handles DALI physical layer translation; programmable slew rate on PWM outputs minimizes EMI during dimming transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC16MFJE | 16 KB FLASH, 1 KB RAM, identical pinout and peripheral set - direct upgrade path with no layout change. | Required when firmware exceeds 8 KB or additional RAM needed for larger communication buffers. | Select when future firmware expansion or OTA update capability is mandated. |
| S9S08SG8E2MTJR | Same HCS08 core, 8 KB FLASH, but 20-pin TSSOP package and reduced peripheral count (no second SCI, no KBI). | Suitable for space-constrained designs where only basic UART+PWM functionality is required. | Choose for minimal BOM cost and PCB area when advanced interfaces are unused. |
Compared with MC9S08AC8MFJE, MC9S08AC16MFJE offers headroom for feature-rich firmware without redesign, while S9S08SG8E2MTJR trades peripheral flexibility for smaller footprint and lower unit cost - selection depends on I/O count, memory growth trajectory, and enclosure size constraints.
Availability
MC9S08AC8MFJE is available at Aetrix Electronics and suitable for home appliance control, industrial sensor nodes, smart power outlets, and LED lighting controllers requiring stable component supply across multi-year production cycles.
Supply support for MC9S08AC8MFJE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications - formed from the spin-off of Freescale Semiconductor and NXP's merger in 2015.
The HCS08 family, including MC9S08AC8MFJE, was engineered for cost-effective, low-power embedded control in appliances and industrial equipment - emphasizing debug accessibility, mixed-signal integration, and long-term supply stability.
FAQ
What is the maximum bus frequency supported by the MC9S08AC8MFJE?
The MC9S08AC8MFJE supports a maximum bus frequency of 20 MHz, derived from its 40-MHz CPU clock via a 2:1 divider. This frequency is achievable in FEI, FEE, and FBE modes using internal trimming or external crystal sources. The bus speed directly governs peripheral timing - for example, SPI baud rates scale linearly with bus frequency, and ADC conversion time is fixed at 12 bus cycles per sample. MC9S08AC8MFJE maintains full functionality across its rated voltage range (2.7–5.5 V) at this speed.
Does the MC9S08AC8MFJE include hardware debug capability?
Yes, the MC9S08AC8MFJE integrates a full Background Debug Module (BDM) compliant with Freescale's BDM specification. It supports single-wire interface via BKGD/MS pin, two hardware breakpoints, eight-deep FIFO trace storage, and tag/force breakpoint modes. This enables real-time instruction tracing, register inspection, and flash programming without external JTAG hardware. MC9S08AC8MFJE's debug module operates in all run and wait modes, and remains functional in Stop2 mode when BDM is enabled - critical for low-power system validation.
What ADC features does the MC9S08AC8MFJE provide?
The MC9S08AC8MFJE includes an 8-channel, 10-bit successive-approximation ADC (S08ADC10V1) with programmable conversion speed (8–32 bus cycles), auto-compare function, and temperature sensor channel. It supports both single-ended and differential input configurations, and can trigger conversions via software, timer overflow, or external pin. MC9S08AC8MFJE's ADC uses dedicated VREFH/VREFL pins and shares VSSAD for analog ground - achieving ±2 LSB INL and 10-bit effective resolution under proper PCB layout. Internal bandgap reference (1.22 V) is available for ratiometric measurements.
Can the MC9S08AC8MFJE operate in ultra-low-power modes?
Yes, the MC9S08AC8MFJE supports Wait, Stop2, and Stop3 low-power modes. In Stop3 mode with LVD disabled and COP off, typical current consumption is 0.8 µA at 25°C - enabling multi-year battery operation in sensor nodes. Wake-up sources include RESET, IRQ, BKGDD, and selected I/O pins with interrupt capability. MC9S08AC8MFJE retains RAM contents and register states across Stop2/Stop3, and resumes execution from the instruction following STOP in under 4 µs. Real-time interrupt (RTI) is available in Stop2 for periodic wake-up without external components.
What package and pin count does the MC9S08AC8MFJE use?
The MC9S08AC8MFJE is supplied in a 32-pin QFN package (98ASA00473D) measuring 5 mm × 5 mm with 0.5 mm pitch and an exposed thermal pad. This package replaces the earlier gold-wire variant (98ARH99035A) with copper wire bonding for improved reliability. MC9S08AC8MFJE's pinout matches other 32-pin HCS08 devices like MC9S08GT16A, enabling shared PCB footprints across product variants. Pin functions include 28 GPIOs, dual SCI, SPI, I²C, ADC inputs, and dedicated reset/debug lines - all electrically and mechanically validated per JEDEC MO-220 standards.
MC9S08AC8MFJE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 22
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 768 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 6x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC8MFJE FAQ
1.How can I place an order for MC9S08AC8MFJE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC8MFJE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC8MFJE reliable?
The price and inventory of MC9S08AC8MFJE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC8MFJE is usually 5 days.
3.What payment methods are accepted for MC9S08AC8MFJE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC8MFJE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC8MFJE?
MC9S08AC8MFJE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC8MFJE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC8MFJE?
For technical support, including MC9S08AC8MFJE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC8MFJE requirements.
6.How does Aetrix verify that MC9S08AC8MFJE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC8MFJE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC8MFJE meets industry standards.
7.What is the process for return or replacement of MC9S08AC8MFJE?
All MC9S08AC8MFJE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC8MFJE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC8MFJE part is unused and in its original packaging.
Return procedure for MC9S08AC8MFJE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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