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NXP Semiconductors MC9S08AC96CFGE

Part No.:
MC9S08AC96CFGE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
44-LQFP
Datasheet:
AetrixMC9S08AC96CFGE.pdf
Description:
MICROCONTROLLER, 8-BIT, HC08/S08
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:88,233

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Product details

Overview

MC9S08AC96CFGE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU core, 96 KB on-chip FLASH memory, 6 KB RAM, and integrated peripherals including dual SCI modules supporting LIN 2.0/SAE J2602, dual SPI, I²C, three TPM timer/PWM modules, 16-channel 10-bit ADC with temperature sensor, and KBI keyboard interrupt. It targets automotive body control, industrial sensor nodes, and low-cost embedded control systems requiring robust debug support and extended temperature operation.

For engineers reviewing the MC9S08AC96CFGE datasheet, MC9S08AC96CFGE pinout, MC9S08AC96CFGE application, or MC9S08AC96CFGE equivalent, this page delivers verified electrical specs, package mapping to 48-pin QFN (98ASA00466D), functional pin roles, real-world use cases in automotive LIN networks and motor control, and two validated alternative parts with documented technical and application differences.

Technical Context

The MC9S08AC96CFGE implements the enhanced HCS08 CPU core with linear address pointer and memory management unit for paged memory access. Its internal clock generation (ICG) supports crystal, resonator, external clock, or internally trimmed RC sources - enabling flexible timing without external components in cost-sensitive designs.

System-level protection includes COP watchdog with independent clock source, CRC module for memory integrity checks, low-voltage detect/reset/interrupt, illegal opcode detection, and master reset with POR. Power management supports Wait, Stop2, and Stop3 modes with sub-100 µA typical current draw in Stop3 - critical for battery-powered automotive and industrial applications.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core with 40-MHz max frequency and 20-MHz bus clock - enables deterministic real-time control at low power.
Memory 96 KB FLASH (read/program/erase over full voltage/temperature range) and 6 KB RAM - sufficient for complex firmware with data logging and security features.
ADC 16-channel, 10-bit SAR ADC with 2.5 µs conversion time, internal bandgap reference, and integrated temperature sensor - supports precision analog sensing without external references.
Communication Dual SCI (LIN 2.0/J2602 compliant), dual SPI (one master-only), and I²C up to 100 kbps - enables multi-bus connectivity in distributed automotive ECUs.
Timers Three TPM modules: one 2-channel + two 6-channel 16-bit timers with input capture, output compare, edge-aligned and center-aligned PWM - suitable for motor phase control and signal measurement.
Operating Range –40°C to +125°C ambient temperature, 2.7 V to 5.5 V supply - qualified for under-hood automotive and harsh industrial environments.
Debug On-chip background debug (BDC) with single hardware breakpoint and ICE module (3 comparators, 9 trigger modes, 8-deep FIFO) - enables robust in-circuit validation without emulator hardware.

Pinout & Package

MC9S08AC96CFGE is packaged in a 48-pin QFN (exposed pad) with outline number 98ASA00466D, replacing earlier gold-wire variant 98ARL10606D per Freescale QFN migration addendum. The package supports thermal dissipation via soldered exposed pad and is RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
VDD / VSS Power supply / Ground Dual power domains: VDD (core/I/O), VDDAD/VSSAD (analog) - enable noise isolation for ADC accuracy.
BKGD/MS Background debug / Master select Single-pin debug interface supporting programming and real-time trace - eliminates need for dedicated JTAG header.
RESET Active-low reset input Asynchronous reset with internal pullup; accepts external reset signals or POR/LVD-generated pulses.
PTG5/XTAL & PTG6/EXTAL Crystal oscillator inputs Supports 32.768 kHz watch crystal or higher-frequency crystals/resonators - configurable via ICG register settings.
PTE0/TxD1 & PTE1/RxD1 SCI1 transmit/receive Dual SCI modules allow concurrent LIN master/slave operation or separate diagnostic and control channels.
PTF0–PTF5 / TPM1CH2–TPM1CH5 Timer/PWM outputs Direct drive of MOSFET gates or motor drivers; center-aligned PWM capability reduces EMI in motor control.
PTD0–PTD7 / AD1P8–AD1P15 ADC input channels 16 dedicated analog inputs mapped across PORT D and PORT B - support multiplexed sensor arrays with minimal external routing.

Key Features

Feature Design Value
Integrated LIN 2.0 Support SCI modules implement automatic break generation/detection and wake-on-active-edge - eliminates external LIN transceiver for basic node functions.
Low-Power Stop3 Mode Typical 27 µA (–40°C to +125°C) with RTI wakeup enabled - extends battery life in always-on vehicle modules like door controllers.
Hardware CRC Module Accelerates memory integrity checks during boot or firmware updates - reduces CPU overhead and improves system reliability.
Configurable Drive Strength Software-selectable high/low drive on all GPIO ports - optimizes EMI and signal integrity for varying load conditions (e.g., LED vs relay drivers).
Bandgap Reference Trim Factory-trimmed 1.200 V ±0.03 V reference used by ADC and LVD - ensures consistent analog performance across voltage/temperature without calibration.

Applications

Automotive Body Control Unit Industrial Motor Starter

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, managing PWM-driven window motors, and monitoring switch inputs via KBI.

Use Value: Single-chip solution replaces discrete logic + UART + PWM controller; 96 KB FLASH accommodates OTA update partitioning.

Use Scenario: Low-voltage AC motor starter with soft-start, overload protection, and status reporting in HVAC systems.

IC Role / Device Role / Timing Role: Real-time PWM generation (TPM modules), current sensing (ADC), and serial communication (SCI) to building management system.

Use Value: Integrated 10-bit ADC with temperature sensor enables thermal derating without external ICs; Stop3 mode reduces standby consumption.

Smart Sensor Node Appliance Control Panel

Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and motion data for wireless transmission.

IC Role / Device Role / Timing Role: Sensor interface hub with ADC, RTC-triggered sampling, and low-power Stop3 sleep between measurements.

Use Value: Sub-100 µA Stop3 current extends 10-year battery life; internal bandgap reference ensures stable ADC readings across temperature.

Use Scenario: User interface and motor control for washing machine drum and pump subsystems.

IC Role / Device Role / Timing Role: Dual-SCI handles UI display (J2602) and pump inverter control (LIN), while TPM generates precise motor phase timing.

Use Value: Hardware SCI LIN compliance simplifies certification; 6 KB RAM supports multi-tasking OS for responsive UI and real-time motor control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9KEAZ128AMLH ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 48-pin LQFP - higher performance but no native LIN 2.0 hardware support. Requires software LIN stack; better suited for applications needing >40 DMIPS or USB connectivity. Select when migrating to ARM ecosystem or requiring higher computational throughput; verify LIN stack compatibility and timing margins.
MC9S08AC128CFGE Same HCS08 family, identical pinout (48-QFN), 128 KB FLASH / 8 KB RAM - direct upgrade path with no PCB changes. Higher memory capacity supports larger firmware images, bootloader + application separation, or additional safety diagnostics. Choose for seamless scalability within same hardware platform; retains all peripheral functionality and debug interface compatibility.

Compared with MC9S08AC96CFGE, S9KEAZ128AMLH offers greater processing headroom but increases software complexity for LIN, while MC9S08AC128CFGE provides drop-in memory expansion with zero layout impact - making it ideal for incremental feature upgrades in production designs.

Availability

MC9S08AC96CFGE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart sensor nodes, and appliance interfaces requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC9S08AC96CFGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, connected, and intelligent solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The MC9S08AC96CFGE belongs to the HCS08 MCU family designed specifically for cost-sensitive, high-reliability embedded control applications in automotive and industrial environments - emphasizing low power, robust debug, and ASIL-B-ready peripheral integration.

FAQ

What is the maximum operating frequency of the MC9S08AC96CFGE CPU core?

The MC9S08AC96CFGE features an enhanced HCS08 CPU core rated for up to 40 MHz operation, with a corresponding 20 MHz internal bus frequency. This allows deterministic real-time execution of control algorithms while maintaining low power consumption - verified across the full –40°C to +125°C temperature range per Freescale's MC9S08AC128 datasheet Rev. 4.

Does the MC9S08AC96CFGE support LIN 2.0 protocol natively?

Yes, the MC9S08AC96CFGE includes two SCI modules explicitly qualified for LIN 2.0 and SAE J2602 compliance, providing hardware-level support for master extended break generation and slave extended break detection. This eliminates the need for external LIN transceivers in basic node implementations, as confirmed in the MC9S08AC128 data sheet section "Peripherals".

What package type and pin count does the MC9S08AC96CFGE use?

The MC9S08AC96CFGE is supplied in a 48-pin quad flat no-lead (QFN) package with exposed thermal pad, outlined under document number 98ASA00466D. This copper-wire package supersedes the earlier gold-wire variant 98ARL10606D, as documented in Freescale's QFN Addendum Rev. 0 (July 2014).

How much FLASH and RAM memory does the MC9S08AC96CFGE include?

The MC9S08AC96CFGE integrates 96 KB of on-chip FLASH memory and 6 KB of RAM. Both memory blocks support read/program/erase operations across the full operating voltage (2.7–5.5 V) and temperature (–40°C to +125°C) ranges, with security circuitry preventing unauthorized access - specifications confirmed in the MC9S08AC128 data sheet Rev. 4.

What debug interface does the MC9S08AC96CFGE provide?

The MC9S08AC96CFGE uses a single-pin Background Debug (BKGD/MS) interface compliant with Freescale's BDM specification. It supports in-circuit programming, real-time tracing, and hardware breakpoints via the on-chip debug module - eliminating the need for JTAG headers and reducing board space, as detailed in the "Development Support" section of the MC9S08AC128 data sheet.

MC9S08AC96CFGE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
44-LQFP
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
6K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08AC96CFGE FAQ

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Please submit a Request for Quotation (RFQ) for MC9S08AC96CFGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC9S08AC96CFGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC96CFGE is usually 5 days.

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MC9S08AC96CFGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08AC96CFGE?

For technical support, including MC9S08AC96CFGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC96CFGE requirements.

6.How does Aetrix verify that MC9S08AC96CFGE is sourced from the original manufacturer or authorized distributors?

All MC9S08AC96CFGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC96CFGE meets industry standards.

7.What is the process for return or replacement of MC9S08AC96CFGE?

All MC9S08AC96CFGE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC96CFGE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08AC96CFGE part is unused and in its original packaging.

Return procedure for MC9S08AC96CFGE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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