NXP Semiconductors MC9S08AC96CFUE

Overview

MC9S08AC96CFUE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 96 KB on-chip FLASH, 6 KB RAM, and integrated peripherals including dual SCI (LIN/J2602 compliant), SPI, I²C, 16-channel 10-bit ADC, and three TPM timer/PWM modules. It operates across –40°C to +125°C and targets automotive body control, industrial sensor nodes, and low-cost embedded control where robustness and mixed-signal integration are critical.

For engineers reviewing the MC9S08AC96CFUE datasheet, MC9S08AC96CFUE pinout, MC9S08AC96CFUE application, or MC9S08AC96CFUE equivalent, key selection considerations include its 48-pin QFN package with exposed thermal pad, copper-wire bonding per QFN Addendum Rev. 0, 2.7–5.5 V supply range, internal clock generation with NVM trimming, and support for stop-mode power consumption as low as 1.0 µA at –40°C to +85°C.

Technical Context

The MC9S08AC96CFUE implements the enhanced HCS08 core with linear address pointer and memory management unit for paged memory access. Its system-level timing relies on the Internal Clock Generator (ICG) module, supporting crystal, resonator, external clock, or internally trimmed RC sources - with factory NVM trimming enabling ±2% accuracy over voltage/temperature.

Peripherals are tightly coupled to the 20-MHz internal bus: dual SCI modules support LIN 2.0 and SAE J2602 protocols with master/slave extended break handling; the 16-channel ADC includes temperature sensor and internal bandgap reference; and three TPM modules provide flexible input capture, output compare, and edge- or center-aligned PWM with buffered operation.

Key Specifications

Pinout & Package

MC9S08AC96CFUE uses a 48-pin QFN package (98ASA00466D) with 7 × 7 mm body, 0.5 mm pitch, and exposed thermal pad - migrated from gold to copper wire bonding per Freescale QFN Addendum Rev. 0 (July 2014). Pinout matches MC9S08AC128 48-pin QFN variant, with 38 functional I/O pins, 4 dedicated analog inputs (VREFH/VREFL/VDDAD/VSSAD), and debug interface via BKGD/MS.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with S9KEAZ128AMLH, MC9S08AC96CFUE offers lower gate count, deterministic 8-bit timing, and native LIN hardware - reducing development time for cost-sensitive automotive modules. Compared with MC9S08AC128CFUE, it delivers optimized memory allocation (96 KB FLASH/6 KB RAM) for mid-complexity applications without over-provisioning.

Availability

MC9S08AC96CFUE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance controllers, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08AC96CFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure markets, formed from the spin-off of Philips' semiconductor division and later acquisition of Freescale.

The MC9S08ACxx series was designed by Freescale (now NXP) for cost-sensitive, high-reliability embedded control in automotive and industrial environments - emphasizing integrated analog peripherals, robust EMC performance, and extended temperature operation.

FAQ

What is the maximum operating frequency of the MC9S08AC96CFUE CPU core?

The MC9S08AC96CFUE features an enhanced HCS08 8-bit CPU core rated for up to 40 MHz operation. This corresponds to a 25 ns instruction cycle time at maximum speed, enabling deterministic real-time response for motor control, sensor polling, and communication protocol handling. The internal bus runs at 20 MHz, and actual achievable frequency depends on VDD (2.7–5.5 V) and ambient temperature (–40°C to +125°C).

Does the MC9S08AC96CFUE support LIN 2.0 communication natively?

Yes, the MC9S08AC96CFUE supports LIN 2.0 natively through its dual SCI modules. Each SCI implements master extended break generation and slave extended break detection per SAE J2602, enabling compliance with LIN 2.0 physical and data link layers without external transceivers or software bit-banging. The MC9S08AC96CFUE datasheet confirms full LIN 2.0 protocol support in Section 1.1 and Peripheral descriptions.

What package type and thermal characteristics apply to the MC9S08AC96CFUE?

The MC9S08AC96CFUE is supplied in a 48-pin QFN package (98ASA00466D), migrated from gold to copper wire bonding per Freescale QFN Addendum Rev. 0. Its thermal resistance is θJA = 81°C/W (1s board) or 28°C/W (2s2p board), with maximum junction temperature rated at 150°C. The exposed thermal pad must be soldered to PCB copper for reliable operation at full temperature range.

How much current does the MC9S08AC96CFUE consume in its lowest power mode?

In Stop3 mode with all clocks disabled except RTI (if enabled) and LVD disabled, the MC9S08AC96CFUE consumes ≤1.2 µA at 5 V and –40°C to +85°C, and ≤1.0 µA at 3 V under same conditions. With RTI enabled, adder current is ≤500 nA; with LVD enabled, adder is ≤180 µA. These values are specified in Table 3-7 of the MC9S08AC128 datasheet, applicable to MC9S08AC96CFUE due to shared silicon family.

Is the MC9S08AC96CFUE pin-compatible with other members of the MC9S08ACxx family?

Yes, the MC9S08AC96CFUE is pin-compatible with the MC9S08AC128CFUE and MC9S08AC60CFUE in the 48-pin QFN package (98ASA00466D). All share identical pin assignments, electrical characteristics, and peripheral mapping - differing only in FLASH/RAM size and part number suffix. This allows hardware reuse across product variants during design scaling.