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NXP Semiconductors MC9S08AC96CLKE
- Part No.:
- MC9S08AC96CLKE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MC9S08AC96CLKE.pdf
- Description:
- IC MCU 8BIT 96KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,370
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Product details
Overview
MC9S08AC96CLKE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 96 KB flash, 6 KB RAM, 48-pin QFN package, 40-MHz CPU, and integrated ADC, SCI, SPI, I²C, TPM, and KBI peripherals. It targets automotive body control modules requiring robust LIN 2.0 communication and low-power operation.
For engineers reviewing the MC9S08AC96CLKE datasheet, MC9S08AC96CLKE pinout, MC9S08AC96CLKE application, or MC9S08AC96CLKE equivalent, key selection criteria include its 48-pin QFN thermal performance (θJA = 28°C/W on 2s2p board), 2.7–5.5 V operating range, -40°C to +125°C automotive grade rating, and support for background debugging via BKGD/MS pin.
Technical Context
The MC9S08AC96CLKE implements the enhanced HCS08 CPU core with 20-MHz bus frequency, memory management unit (MMU) for paged memory access, and linear address pointer enabling direct full-map data addressing. Its internal clock generation (ICG) module supports crystal, resonator, external clock, or internally trimmed oscillator sources with NVM-based precision calibration.
System protection includes computer operating properly (COP) watchdog with independent clock option, CRC module for fast memory integrity checks, low-voltage detection with interrupt/reset, illegal opcode detection, and master reset with power-on reset (POR). Power management supports Wait, Stop2, and Stop3 modes with sub-μA current draw in deep sleep.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND/CALL/RTC instructions and MMU for paged memory |
| Flash / RAM | 96 KB flash (read/program/erase over full voltage/temp); 6 KB RAM with security lock |
| Max Clock | 40-MHz CPU frequency; 20-MHz internal bus frequency |
| ADC | 16-channel, 10-bit SAR ADC with 2.5 μs conversion, temperature sensor, and bandgap reference |
| Peripherals | 2× SCI (LIN 2.0/J2602 compliant), 2× SPI, 1× I²C, 3× TPM (2+6+6 channels), 8-pin KBI |
| Supply Range | 2.7 V to 5.5 V; operates across -40°C to +125°C ambient |
| Low-Power Modes | Wait + Stop2 + Stop3; Stop3 draws ≤180 μA (max) at 5 V, -40°C to +125°C |
Pinout & Package
MC9S08AC96CLKE uses a 48-pin QFN package (98ASA00466D) with exposed thermal pad, copper-wire bonding, and 7 × 7 mm footprint. Pinout matches MC9S08AC128 48-pin QFN variant per Freescale documentation, supporting identical peripheral mapping and signal routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0–PTA7 | Port A general-purpose I/O | Software-configurable pullups, drive strength, and slew rate; multiplexed with ADC inputs |
| PTB0–PTB7 | Port B general-purpose I/O | Includes TPM3CH0/CH1 and 8 ADC channels (AD1P0–AD1P7) |
| PTC0/PTC1 | I²C interface | SCL1/SDA1 pins with open-drain capability and programmable slave address |
| PTD0–PTD7 | Port D general-purpose I/O | 16 ADC channels (AD1P8–AD1P15); TPM1CLK/TPM2CLK inputs; KBI1P5–KBI1P7 |
| PTE0/PTE1 | SCI1 interface | TxD1/RxD1 with LIN-compliant wake-up on active edge and extended break generation/detection |
| BKGD/MS | Background debug interface | Single-wire debug channel supporting breakpoint setting and on-chip ICE with FIFO trace |
| VDD/VSS | Power supply pins | Dual VDD (digital) and VDDAD (analog) with separate VSSAD ground for noise isolation |
| VREFH/VREFL | ADC reference | External or internal (bandgap) 1.2 V reference; enables ratiometric or absolute measurement modes |
Key Features
| Feature | Design Value |
|---|---|
| Automotive-grade qualification | AEC-Q100 qualified for -40°C to +125°C operation with ESD immunity (±2 kV HBM, ±200 V MM) |
| LIN 2.0 protocol support | SCI modules implement SAE J2602 compliance including master break generation and slave break detection |
| Secure memory access | On-chip security circuitry prevents unauthorized read/write access to flash and RAM contents |
| Thermal-aware packaging | 48-pin QFN with exposed pad (98ASA00466D) achieves θJA = 28°C/W on 4-layer PCB for sustained 125°C operation |
| Robust system monitoring | COP watchdog with independent clock source, CRC module for memory integrity, and dual-threshold LVD with hysteresis |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized control of lighting, windows, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN-slave firmware, managing 16-channel ADC for sensor inputs (e.g., door position, ambient light), and driving PWM outputs for motor control. Use Value: 96 KB flash accommodates complex state machines and diagnostics; 48-pin QFN enables compact layout with thermal reliability at under-hood temperatures. | Use Scenario: Localized control of power windows, central locking, and anti-pinch detection in vehicle doors. IC Role / Device Role / Timing Role: LIN slave node interfacing with BCM via SCI, using TPM PWM for motor speed regulation and KBI for switch debounce. Use Value: Integrated 10-bit ADC with temperature sensor enables real-time thermal derating; Stop3 mode draws <180 μA for battery-conscious always-on monitoring. |
| Seat Position Controller | Roof Module (Sunroof/Convertibles) |
Use Scenario: Motorized adjustment of seat fore/aft, recline, and lumbar support with position feedback. IC Role / Device Role / Timing Role: Real-time motion control using TPM edge-aligned PWM and input capture for Hall-effect encoder signals. Use Value: Six-channel TPM modules provide simultaneous PWM generation and quadrature decoding without external logic; 6 KB RAM buffers position history and fault logs. | Use Scenario: Safety-critical sunroof or convertible top actuation with pinch detection and obstacle sensing. IC Role / Device Role / Timing Role: Dual-SCI interface for LIN communication with BCM and CAN gateway; ADC monitors current sense and limit switches. Use Value: CRC module validates flash integrity during OTA updates; COP reset ensures deterministic recovery after electrical transients in high-noise roof environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC128CLKE | 128 KB flash, 8 KB RAM, same 48-pin QFN package and peripheral set | Higher code density requirement; larger BOM cost premium | Select when firmware exceeds 96 KB or future scalability is required without PCB change |
| S9S08SG48E1MLC | NXP S08 family successor; 48 KB flash, 4 KB RAM, same pinout but reduced peripheral count (no second SCI) | Cost-sensitive entry-level modules where LIN is handled by single SCI only | Choose for new designs prioritizing long-term availability and simplified toolchain over legacy code compatibility |
Compared with MC9S08AC128CLKE, the MC9S08AC96CLKE offers optimized flash/RAM balance for mid-tier automotive modules, while S9S08SG48E1MLC provides a modern, lower-cost alternative with reduced feature set but identical mechanical fit-enabling migration paths without layout revision.
Availability
MC9S08AC96CLKE is available at Aetrix Electronics and suitable for automotive body electronics, door control units, and seat position systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08AC96CLKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.
The MC9S08AC96CLKE belongs to the HCS08 family designed specifically for cost-sensitive, high-reliability automotive body electronics-emphasizing LIN protocol compliance, extended temperature operation, and robust on-chip diagnostics.
FAQ
What is the maximum operating temperature range for the MC9S08AC96CLKE?
The MC9S08AC96CLKE is rated for continuous operation from -40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This specification is validated across all electrical parameters including flash endurance, ADC accuracy, and peripheral timing, making MC9S08AC96CLKE suitable for under-hood and cabin-mounted automotive control units where thermal stress is critical.
Does the MC9S08AC96CLKE support LIN 2.0 communication natively?
Yes, the MC9S08AC96CLKE supports LIN 2.0 natively through its two SCI modules, which implement SAE J2602 protocol features including master extended break generation, slave extended break detection, and wakeup on active edge. Both SCI interfaces are fully functional in the 48-pin QFN package, enabling dual-LIN node designs or redundancy without external transceivers.
What debug interface does the MC9S08AC96CLKE use, and is external hardware required?
The MC9S08AC96CLKE uses a single-wire Background Debug (BKGD/MS) interface compliant with Freescale's BDM standard. No external debug hardware is required beyond a basic level-shifter circuit; it supports in-circuit debugging, breakpoint setting, and on-chip ICE trace via the BKGD pin. The MC9S08AC96CLKE retains full debug capability in its 48-pin QFN package without sacrificing I/O count.
How much current does the MC9S08AC96CLKE consume in its lowest power mode?
In Stop3 mode with oscillator disabled and LVD inactive, the MC9S08AC96CLKE draws ≤180 μA (maximum) at 5 V and -40°C to +125°C. With RTI enabled, the adder is only 500 nA; with LVD enabled, the adder is ≤180 μA. This ultra-low quiescent current enables always-on monitoring in battery-powered automotive modules without compromising runtime.
Is the MC9S08AC96CLKE pin-compatible with other members of the HCS08 AC-series?
Yes, the MC9S08AC96CLKE shares identical 48-pin QFN pinout (98ASA00466D) and signal mapping with MC9S08AC128CLKE and MC9S08AC60CLKE, enabling drop-in replacement within the same package variant. All share identical peripheral placement, power pin locations, and debug interface pin-allowing firmware reuse and minimizing redesign effort when scaling flash capacity.
MC9S08AC96CLKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 69
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08AC96CLKE FAQ
1.How can I place an order for MC9S08AC96CLKE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08AC96CLKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08AC96CLKE reliable?
The price and inventory of MC9S08AC96CLKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AC96CLKE is usually 5 days.
3.What payment methods are accepted for MC9S08AC96CLKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AC96CLKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08AC96CLKE?
MC9S08AC96CLKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08AC96CLKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08AC96CLKE?
For technical support, including MC9S08AC96CLKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AC96CLKE requirements.
6.How does Aetrix verify that MC9S08AC96CLKE is sourced from the original manufacturer or authorized distributors?
All MC9S08AC96CLKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AC96CLKE meets industry standards.
7.What is the process for return or replacement of MC9S08AC96CLKE?
All MC9S08AC96CLKE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AC96CLKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08AC96CLKE part is unused and in its original packaging.
Return procedure for MC9S08AC96CLKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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