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NXP Semiconductors MC9S08AW60CFUE

Part No.:
MC9S08AW60CFUE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-QFP
Datasheet:
AetrixMC9S08AW60CFUE.pdf
Description:
IC MCU 8BIT 60KB FLASH 64QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,218

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Product details

Overview

MC9S08AW60CFUE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core. It integrates dual SCI, SPI, I²C, two 16-bit TPM modules (totaling 8 PWM channels), a 16-channel 10-bit ADC, and keyboard interrupt support. Designed for automotive body electronics and industrial control, it operates across –40°C to 105°C with robust system protection including COP watchdog and low-voltage detection.

For engineers reviewing the MC9S08AW60CFUE datasheet, MC9S08AW60CFUE pinout, MC9S08AW60CFUE application, or MC9S08AW60CFUE equivalent, key selection considerations include its 48-pin QFN package, copper-wire bonded construction per 98ASA00466D, 20-MHz bus frequency, single-wire BDM debug interface, and support for Stop2/Stop3 power-saving modes in safety-critical embedded systems.

Technical Context

The MC9S08AW60CFUE implements the S08CPUV2 core with HC08 instruction set extension and BGND instruction, executing at up to 40 MHz CPU clock with 20 MHz internal bus frequency. Its Internal Clock Generator (S08ICGV4) supports multiple modes including FEI, FEE, FBE, and SCM, with NVM-trimmed internal reference enabling accurate clock generation without external crystal.

Peripheral integration includes two independent Serial Communications Interfaces (SCI) supporting 13-bit break detection, a 100 kbps I²C module compliant with standard-mode timing, and dual Timer/PWM (TPM) modules-one 2-channel and one 6-channel-each configurable for input capture, output compare, edge-aligned or buffered centered PWM (CPWM).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit CPU with BGND instruction and 40-MHz max operation
Memory60 KB on-chip FLASH with block protection; 2 KB RAM
ADC16-channel, 10-bit SAR ADC with automatic compare function
TimersTwo 16-bit TPM modules: one 2-channel, one 6-channel; all channels support PWM, input capture, output compare
CommunicationDual SCI, SPI, I²C (up to 100 kbps), KBI (up to 8 pins)
Package48-pin QFN, copper-wire bonded, exposed pad, 98ASA00466D outline
Temperature Range–40°C to +105°C, qualified for automotive applications

Pinout & Package

MC9S08AW60CFUE is housed in a 48-pin QFN package (98ASA00466D) with 0.5 mm pitch and thermally enhanced exposed pad. The package uses copper wire bonding per Freescale QFN migration addendum (Rev. 0, 07/2014).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDADPower supply inputsSeparate digital and analog supplies enable noise isolation for ADC operation
VSS, VSSADGND returnsDedicated analog ground improves ADC accuracy and reduces coupling
XTAL / EXTALClock oscillator terminalsSupports crystal, resonator, or external clock source for precise timing
BKGD/MSSingle-wire background debugEnables in-circuit debugging and programming via BDM interface
RESETMaster reset inputActive-low reset with internal pullup reduces external component count
VREFH / VREFLADC reference inputsAllow flexible reference selection (internal bandgap or external)
IRQExternal interrupt requestEdge-sensitive interrupt input with internal pullup for wake-up capability
PTA0–PTA7, PTB0–PTB7, PTC0–PTC7, PTD0–PTD7, PTE0–PTE7, PTF0–PTF7, PTG0–PTG5GPIO and peripheral multiplexing54 total I/O pins with software-selectable pullups, slew rate, and drive strength

Key Features

FeatureDesign Value
On-chip real-time ICETwo comparators + nine trigger modes + bus capture buffer enables precise code execution analysis
FLASH security & protectionBlock-level FLASH protection and NVOPT-based security lock prevent unauthorized access or reprogramming
Low-power operationWait mode plus Stop2/Stop3 modes with selective peripheral retention reduce active current to µA range
Robust system monitoringCOP watchdog, LVD reset/interrupt, illegal opcode/address detection ensure fail-safe behavior
Flexible clockingMultiple ICG modes (FEI/FEE/FBE/SCM) with NVM trimming allow stable operation without external crystal

Applications

Automotive Body Control ModuleIndustrial Motor Drive Interface

Use Scenario: Centralized control of door locks, window lifts, mirrors, and lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU managing CAN/LIN gateway functions, sensor polling, actuator sequencing, and diagnostics.

Use Value: 60 KB FLASH accommodates complex firmware with OTA update space; 16-channel ADC monitors voltage, temperature, and position sensors directly.

Use Scenario: Closed-loop speed and direction control of BLDC or stepper motors in HVAC blowers and pumps.

IC Role / Device Role / Timing Role: Real-time PWM generator and feedback processor interfacing with Hall sensors and gate drivers.

Use Value: Dual TPM modules provide eight synchronized PWM outputs with buffered CPWM for smooth torque control and reduced EMI.

Smart Power Distribution UnitMedical Infusion Pump Controller

Use Scenario: Solid-state relay replacement in programmable load switching panels for building automation.

IC Role / Device Role / Timing Role: Fault-tolerant supervisor coordinating overcurrent detection, thermal shutdown, and status reporting.

Use Value: COP watchdog and LVD interrupt ensure safe shutdown during brownout; 54 GPIO pins support scalable channel expansion.

Use Scenario: Precision fluid delivery control requiring motor sequencing, pressure sensing, and alarm management.

IC Role / Device Role / Timing Role: Safety-critical controller handling real-time motor control, ADC-based pressure monitoring, and user interface.

Use Value: –40°C to +105°C rating supports sterilization cycles; FLASH security prevents unauthorized firmware modification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core; 128 KB FLASH, 16 KB RAM; higher performance but different architecture and toolchainRequires migration from HCS08 assembly/C to ARM GCC; lacks native BDM but supports SWD/JTAGSelect when upgrading to 32-bit performance and future-proofing; not drop-in compatible
MC9S08DZ60CLCSame HCS08 core, 60 KB FLASH, but 64-pin LQFP package; includes CAN 2.0B controller and LIN PHYTargeted for CAN-based automotive networks; no QFN option; larger footprintSelect when CAN communication is required and board layout allows 64-pin package

Compared with MC9S08AW60CFUE, S9KEAZ128AMLH offers greater processing headroom and modern peripherals but demands full firmware rewrite, while MC9S08DZ60CLC retains full HCS08 compatibility and adds CAN-but requires PCB redesign due to package and pinout differences.

Availability

MC9S08AW60CFUE is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart power distribution, and medical infusion pump applications requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08AW60CFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.

The MC9S08AW60CFUE belongs to the legacy HCS08 microcontroller family, designed specifically for cost-sensitive, reliability-critical automotive and industrial embedded systems requiring deterministic real-time response and extended temperature operation.

FAQ

What is the package type and thermal pad configuration of the MC9S08AW60CFUE?

The MC9S08AW60CFUE uses a 48-pin QFN package (outline 98ASA00466D) with copper wire bonding and an exposed thermal pad. This configuration improves heat dissipation and electrical grounding, especially critical for ADC stability and long-term reliability in automotive environments. The pad must be soldered to a PCB thermal plane per Freescale EB806 guidelines.

Does the MC9S08AW60CFUE support in-circuit debugging, and what interface is used?

Yes, the MC9S08AW60CFUE supports real-time in-circuit debugging via a single-wire Background Debug Mode (BDM) interface using the BKGD/MS pin. It provides breakpoint capability (one active + two in debug module), on-chip bus capture, and full ICE functionality - enabling development without external emulators. No JTAG or SWD is supported; BDM is the sole debug path for this device.

What are the power-saving modes available on the MC9S08AW60CFUE, and how do they differ?

The MC9S08AW60CFUE supports Wait mode and two Stop modes: Stop2 and Stop3. In Stop2, the ICG remains active and can wake the device via IRQ or RTI; in Stop3, the ICG is disabled for lowest current draw (<1 µA typical). Both Stop modes retain RAM and selected register states. The choice depends on wake-up latency and power budget - Stop3 for ultra-low-power sleep, Stop2 when faster wake-up is needed.

Can the MC9S08AW60CFUE operate without an external crystal, and what clock accuracy can be expected?

Yes, the MC9S08AW60CFUE can operate without an external crystal using its Internal Clock Generator (ICG) in Self-Clocked Mode (SCM) or FLL-engaged modes (FEI/FEE). Factory-trimmed NVM settings yield ±2% bus frequency accuracy over temperature and voltage - sufficient for UART communication and non-critical timing, though external crystals are recommended for CAN or high-precision ADC sampling.

Is the MC9S08AW60CFUE pin-compatible with other AW-series microcontrollers like the MC9S08AW48 or MC9S08AW32?

No, the MC9S08AW60CFUE is not pin-compatible with MC9S08AW48 or MC9S08AW32 in the same 48-pin QFN package. While all three share the 98ASA00466D outline, their pin assignments differ significantly - particularly for peripheral functions (e.g., SCI0 vs SCI1 mapping, TPM channel routing, and ADC input allocation). Firmware and hardware designs are not interchangeable without verification against respective pinout diagrams.

MC9S08AW60CFUE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-QFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08AW60CFUE FAQ

1.How can I place an order for MC9S08AW60CFUE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08AW60CFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08AW60CFUE reliable?

The price and inventory of MC9S08AW60CFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08AW60CFUE is usually 5 days.

3.What payment methods are accepted for MC9S08AW60CFUE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08AW60CFUE transactions.

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4.How is shipping managed for MC9S08AW60CFUE?

MC9S08AW60CFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08AW60CFUE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08AW60CFUE?

For technical support, including MC9S08AW60CFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08AW60CFUE requirements.

6.How does Aetrix verify that MC9S08AW60CFUE is sourced from the original manufacturer or authorized distributors?

All MC9S08AW60CFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08AW60CFUE meets industry standards.

7.What is the process for return or replacement of MC9S08AW60CFUE?

All MC9S08AW60CFUE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08AW60CFUE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08AW60CFUE part is unused and in its original packaging.

Return procedure for MC9S08AW60CFUE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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