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NXP Semiconductors MC9S08DN16ACLC

Part No.:
MC9S08DN16ACLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08DN16ACLC.pdf
Description:
IC MCU 8BIT 16KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,668

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Product details

Overview

MC9S08DN16ACLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for cost-sensitive embedded control applications requiring integrated analog peripherals and low-power operation. It features a 20-MHz bus frequency, 16 KB on-chip Flash memory, 2 KB RAM, and 2 KB in-circuit programmable EEPROM. Its role includes real-time sensor interfacing, motor control timing, and LIN-compliant communication in automotive body electronics.

For engineers reviewing the MC9S08DN16ACLC datasheet, MC9S08DN16ACLC pinout, MC9S08DN16ACLC application, or MC9S08DN16ACLC equivalent, key selection criteria include its 12-bit ADC with temperature sensor, dual analog comparators, single-wire background debug interface, and support for Stop2/Stop3 low-power modes with RTC wake-up capability.

Technical Context

The MC9S08DN16ACLC implements the S08CPUV3 core with HC08 instruction set extension including BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal support from 31.25 kHz to 16 MHz.

Peripherals include a 16-channel 12-bit ADC with 2.5 µs conversion time and automatic compare, two analog comparators with bandgap reference option, one LIN 2.0–compliant SCI, SPI, I²C, two TPM modules (6+2 channels), and an 8-bit real-time counter with 1 kHz low-power oscillator.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV3 with 40-MHz core clock (20-MHz bus)
Flash Memory16 KB program/erase over full voltage/temperature range; supports in-application programming
RAM2 KB static RAM for data and stack storage
EEPROM2 KB in-circuit programmable; 4-byte dual-page or 8-byte single-page erase sectors
ADC16-channel, 12-bit resolution, 2.5 µs conversion time; includes internal temperature sensor and bandgap reference channel
Low-Power ModesStop2 and Stop3 modes with RTC wake-up; reduced-power wait mode; real-time interrupt active in all modes
Debug InterfaceSingle-wire background debug (BDM) with on-chip ICE and real-time bus capture

Pinout & Package

MC9S08DN16ACLC is packaged in a 48-pin LQFP (7×7 mm) with 53 general-purpose I/O pins and 1 input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation
XTAL, EXTALCrystal/resonator connectionSupports 31.25 kHz–16 MHz Pierce oscillator; enables precise timing for RTC and LIN baud rates
BKGD/MSBackground debug / mode selectSingle-wire BDM interface; also selects boot mode during reset
RESETActive-low reset inputAsynchronous reset with internal pull-up; supports external watchdog or power-on reset circuitry
VREFH, VREFLAnalog reference inputsDefine ADC full-scale range; accept external reference or connect to internal bandgap (1.2 V)
AD0–AD15Analog input channels16 dedicated ADC inputs; multiplexed with GPIO; support temperature sensor and internal reference sampling
SCI1_TX, SCI1_RXLIN 2.0 serial interfaceFull-duplex NRZ UART with master break generation and slave break detection for automotive network nodes

Key Features

FeatureDesign Value
On-chip EEPROM with sector erase abortEnables robust parameter storage and firmware update rollback without full memory block erasure
Real-time counter with 1 kHz internal oscillatorProvides autonomous wake-up from Stop modes without external crystal, reducing BOM count and power
Two analog comparators with edge-selectable interruptsSupports zero-crossing detection, window monitoring, and battery threshold alerts with minimal CPU intervention
Flash block protection and securityPrevents unauthorized read-out or reprogramming of firmware; supports secure bootloader implementation
Program/erase while executing FlashAllows concurrent code execution and non-volatile data logging-critical for data acquisition systems

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, interior lighting, and mirror adjustment in entry-level vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing LIN slave nodes, reading switch inputs, driving relays and LEDs, and maintaining real-time clock for event logging.

Use Value: Integrated LIN-compliant SCI, 12-bit ADC for potentiometer feedback, and Stop3 mode reduce system cost and sleep current to <1 µA.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and ambient light in remote locations.

IC Role / Device Role / Timing Role: Data acquisition controller with on-board temperature sensor, analog comparator thresholds, and RTC-triggered wake-up every 10 minutes.

Use Value: 2 KB EEPROM stores calibration coefficients; 2.5 µs ADC conversion enables rapid sampling; 1 kHz RTC oscillator eliminates need for external timing crystal.

Home Appliance Motor ControlMedical Diagnostic Handheld

Use Scenario: Speed-regulated DC fan or pump control in HVAC systems and kitchen appliances.

IC Role / Device Role / Timing Role: PWM generator and current-sense signal conditioner using TPM modules and analog comparators for overcurrent protection.

Use Value: Six-channel TPM supports complementary PWM outputs; dual comparators enable fast hardware fault response (<1 µs latency) independent of software.

Use Scenario: Portable blood glucose meter with strip insertion detection, LED-driven optical sensing, and battery voltage monitoring.

IC Role / Device Role / Timing Role: System controller handling strip auto-detection via ACMP, ADC measurement of photodiode current, and low-battery warning using internal bandgap reference.

Use Value: Internal 1.2 V bandgap reference ensures stable ADC accuracy across temperature; EEPROM retains user calibration data between battery changes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DN16F1CLKSame core and peripheral set; differs in Flash endurance (100k vs. 10k cycles) and temperature grade (–40°C to 105°C vs. –40°C to 85°C)Targeted at extended-temperature automotive under-hood use; requires higher-grade packaging and qualificationSelect when operating above 85°C or requiring >10k EEPROM write cycles
MC9RS08LA8Smaller footprint (16-pin SOIC); 8 KB Flash, 512 B RAM; no RTC or LIN SCI; single analog comparatorCost-optimized for simple I/O control only-lacks ADC channels, EEPROM, and advanced timing peripheralsSelect only for ultra-low-cost, space-constrained applications with minimal analog or communication requirements

Compared with S9S08DN16F1CLK and MC9RS08LA8, the MC9S08DN16ACLC delivers balanced integration of Flash size, EEPROM endurance, LIN capability, and RTC functionality within industrial temperature range-making it optimal for mid-tier automotive and industrial control where feature completeness and reliability are prioritized over extreme temperature or minimal BOM cost.

Availability

MC9S08DN16ACLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor control, and portable medical diagnostics requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08DN16ACLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08DN16ACLC belongs to the HCS08 DN-series, engineered for cost-effective, low-power embedded control in automotive body electronics and industrial automation where integrated analog peripherals and LIN compliance are essential.

FAQ

What is the maximum bus frequency supported by the MC9S08DN16ACLC?

The MC9S08DN16ACLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a 2:1 divider. This frequency is achievable using the MCG's PLL or FLL modes with appropriate external crystal or internal reference configuration. The MC9S08DN16ACLC maintains full peripheral functionality-including ADC timing, SCI baud rate generation, and TPM PWM resolution-at this speed across its specified voltage and temperature range.

Does the MC9S08DN16ACLC include a temperature sensor?

Yes, the MC9S08DN16ACLC integrates a factory-calibrated on-die temperature sensor accessible through the 12-bit ADC module. It is mapped as a dedicated ADC channel and uses the internal bandgap reference for ratiometric accuracy. This sensor enables closed-loop thermal monitoring in applications such as motor control and battery management without requiring external components. The MC9S08DN16ACLC datasheet specifies typical accuracy of ±3°C over –40°C to +105°C.

Can the MC9S08DN16ACLC operate in low-power stop modes with RTC wake-up?

Yes, the MC9S08DN16ACLC supports Stop2 and Stop3 modes with RTC wake-up enabled by its built-in 1 kHz low-power oscillator. In Stop3 mode, current consumption drops below 1 µA while retaining RTC counting and wake-up capability. The MC9S08DN16ACLC allows programmable wake-up intervals from milliseconds to hours using the 8-bit modulus counter and prescaler, making it suitable for battery-powered sensor polling applications.

What debug interface does the MC9S08DN16ACLC provide?

The MC9S08DN16ACLC features a single-wire background debug (BDM) interface compliant with Freescale/NXP BDM protocol. It supports full in-circuit emulation, real-time bus capture, flash programming, and breakpoint debugging without halting system clocks. This interface uses the BKGD/MS pin and requires no additional debug headers or JTAG adapter-reducing development tool cost. The MC9S08DN16ACLC also includes on-chip ICE resources for trace and timing analysis during firmware validation.

Is the MC9S08DN16ACLC LIN 2.0 compliant?

Yes, the MC9S08DN16ACLC SCI1 module implements LIN 2.0 Protocol and SAE J2602 conformance, including master extended break generation, slave extended break detection, and wakeup-on-active-edge functionality. Its baud rate generator supports standard LIN frequencies (e.g., 19.2 kbps) with hardware synchronization. The MC9S08DN16ACLC meets physical layer timing requirements when paired with an external LIN transceiver, enabling direct integration into automotive body networks.

MC9S08DN16ACLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DN16ACLC FAQ

1.How can I place an order for MC9S08DN16ACLC through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DN16ACLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DN16ACLC reliable?

The price and inventory of MC9S08DN16ACLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN16ACLC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN16ACLC transactions.

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4.How is shipping managed for MC9S08DN16ACLC?

MC9S08DN16ACLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DN16ACLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DN16ACLC?

For technical support, including MC9S08DN16ACLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN16ACLC requirements.

6.How does Aetrix verify that MC9S08DN16ACLC is sourced from the original manufacturer or authorized distributors?

All MC9S08DN16ACLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN16ACLC meets industry standards.

7.What is the process for return or replacement of MC9S08DN16ACLC?

All MC9S08DN16ACLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN16ACLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DN16ACLC part is unused and in its original packaging.

Return procedure for MC9S08DN16ACLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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