NXP Semiconductors MC9S08DN16ACLF

Overview

MC9S08DN16ACLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM. It features a 40-MHz CPU (20-MHz bus), 12-bit 16-channel ADC with temperature sensor, dual analog comparators, SCI supporting LIN 2.0/J2602, SPI, I²C, two TPM modules (6+2 channels), RTC, and real-time interrupt capability. It targets automotive body control modules requiring robust low-power operation and embedded diagnostics.

For engineers reviewing the MC9S08DN16ACLF datasheet, MC9S08DN16ACLF pinout, MC9S08DN16ACLF application, or MC9S08DN16ACLF equivalent, key selection criteria include Flash size (16 KB), EEPROM endurance (100K erase/write cycles), 53 GPIO with configurable slew rate and hysteresis, and support for LIN-compliant serial communication in automotive subsystems.

Technical Context

The MC9S08DN16ACLF implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming (factory-stored value in Flash) and external crystal support from 31.25 kHz to 16 MHz.

Peripherals are tightly integrated: the 12-bit ADC achieves 2.5 μs conversion time with automatic compare and internal bandgap reference; dual ACMPs support edge-triggered interrupts and comparison against fixed internal reference; SCI1 includes master/slave extended break generation/detection per LIN 2.0 requirements.

Key Specifications

Pinout & Package

MC9S08DN16ACLF is packaged in a 48-pin LQFP (7×7 mm, 0.5 mm pitch) with 53 general-purpose I/O pins and 1 input-only pin - pin count exceeds package count due to multiplexed peripheral functions across shared pins. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with S9S08DN16F1CLK and MC9RS08LA8, the MC9S08DN16ACLF delivers optimal balance of LIN-ready communication, 2 KB EEPROM for field calibration, and 48-pin compact packaging - making it the preferred choice for mid-tier automotive body electronics where thermal margin and peripheral richness must coexist within space-constrained layouts.

Availability

MC9S08DN16ACLF is available at Aetrix Electronics and suitable for automotive body control modules, industrial sensor nodes, smart lighting systems, and appliance motor interfaces requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08DN16ACLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08DN16ACLF belongs to the HCS08 DN-series microcontrollers designed specifically for cost-sensitive, low-power automotive body electronics - emphasizing LIN compliance, EEPROM durability, and robust operation across extended temperature ranges.

FAQ

What is the maximum operating frequency of the MC9S08DN16ACLF CPU?

The MC9S08DN16ACLF CPU operates at a maximum core frequency of 40 MHz, with a corresponding bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, supported by either internal trimmed reference or external crystal (1–16 MHz). The MC9S08DN16ACLF maintains this performance across its specified industrial temperature range of –40°C to +85°C.

Does the MC9S08DN16ACLF support LIN 2.0 communication natively?

Yes, the MC9S08DN16ACLF includes SCI1 hardware that fully implements LIN 2.0 and SAE J2602 protocols. It supports master extended break generation and slave extended break detection, enabling direct connection to LIN transceivers without software bit-banging. This capability is confirmed in the official MC9S08DN60 Series Data Sheet Rev 3 (June 2008), which explicitly covers the MC9S08DN16ACLF as part of the DN-series family.

How much EEPROM does the MC9S08DN16ACLF have, and what is its erase granularity?

The MC9S08DN16ACLF integrates 2 KB of in-circuit programmable EEPROM with two erase sector sizes: 8-byte single-page erase and 4-byte dual-page erase. This architecture allows fine-grained updates for calibration data or event logs without disturbing adjacent memory. The MC9S08DN16ACLF supports program and erase operations while executing Flash code - enabling background data maintenance during active application runtime.

What package type and pin count does the MC9S08DN16ACLF use?

The MC9S08DN16ACLF is supplied in a 48-pin low-profile quad flat-pack (LQFP) measuring 7×7 mm with 0.5 mm pitch. Although the package has 48 physical pins, the device provides 53 general-purpose I/O pins and 1 input-only pin through functional multiplexing across Port A–G. Pin assignments and alternate functions are fully documented in Chapter 2 ("Pins and Connections") of the MC9S08DN60 Series Data Sheet.

Is there a real-time clock (RTC) peripheral in the MC9S08DN16ACLF?

The MC9S08DN16ACLF includes a Real-Time Counter (RTC) module - an 8-bit modulus counter with binary or decimal prescaler - and supports real-time clock functionality using an external 32.768 kHz crystal. It also features a free-running 1-kHz on-chip low-power oscillator for cyclic wake-up in Stop modes without external components. While not a full calendar RTC, the MC9S08DN16ACLF's RTC provides precise time-base generation for task scheduling and low-power periodic wake-up.